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The global value of quantum dot markets was $306 million USD in 2014 and is expected at $4.6 billion USD over the forecast period due to the subsequent generation device, display, and system activated by quantum dot, according to a new report released this week by Radiant Insights. Semiconductor revolution is represented by quantum dots which provide complicated functions on the bases of nanoparticles shape. A verity of devices can be made with low-cost due to easy manipulation of the material.

Quantum Dot & Quantum Dot LED market sectors are solar, HDTV 7 displays, ID tags, LED lighting, cancer imaging, telco lasers, and personalized medicine. All sectors are expected to attain amazing expansion, with solar market and TV display technology getting more than $1 billion USD in profits annually by 2021. Qdot cancer imaging attains $750 million USD & quantum dot ID Tags reach $700 million USD over the forecast period.

Quantum dot market is growing rapidly. Technology maturity force is the key drive to the market. Solar quantum dots, fuel cell catalysts, TV displays, and a variety of applications depend on the aptitude to quantum dot time to time in enough amount needed for commercial purpose. One of the foremost applications of quantum dots commercially was the display of large screens and is proven to be a very good market.

Ultratech, Inc., a supplier of lithography, laser processing and inspection systems used to manufacture semiconductor devices and high-brightness LEDs (HB­-LEDs), as well as atomic layer deposition (ALD) systems, and Qoniac GmbH of Dresden, Germany, a specialist in process optimization and overlay control solutions for leading-edge semiconductor lithography, announced that the companies are jointly developing a 3D lithography advanced process control (APC) solution for advanced 3D CMOS manufacturing. Building on the companies’ respective leadership in 3D inspection and lithography APC, the solution will allow Ultratech’s Superfast to interface with Qoniac’s OVALiS, the leading lithography process optimization solution. As a result, the goal of this interface is to enable a new level of lithography 3D correctable performance that leverages Superfast’s high-density distortion sampling and OVALiS’ dynamic field-by-field feedback and feed-forward control.

Arthur W. Zafiropoulo, Ultratech’s CEO, said, “I am delighted to partner with Qoniac to provide our mutual customers a new level of 3D correctable performance. Today’s leading-edge fabs require better overlay control as one of the critical parameters affecting good process yields. Superfast has now been adopted for high-volume, 3D distortion control and lithography feed-forward applications. Qoniac’s expertise and leadership in lithography APC will help drive innovation so that we can provide our customers with new capabilities they need as they move to the next generation of Vertical NAND, DRAM and FinFET processes.”

Adwin Timmer, CEO at Qoniac, said, “Our current joint development with Ultratech for 3D lithography APC will enhance our lithography APC capabilities with distortion correction. As the industry increases the use of 3D manufacturing to lower cost, structural distortion has become a major component of the overlay budget. Ultratech’s Superfast CGS technology has given the 3D manufacturing leaders control over these distortions. Qoniac’s OVALiS aims to insure that this control is smart, dynamic and with the highest yields.”

Ultratech’s Superfast 4G+ Inspection System

Based on patented coherent gradient sensing (CGS) technology, Ultratech’s Superfast 4G+ inspection system for patterned wafers provides the industry’s highest throughput, with a low cost-of-­ownership compared to competing systems. Building on the field­-proven Superfast platform, Ultratech’s 4G+ Inspection System provides the industry with a 3D topography inspection solution for advanced lithography applications with the flexibility to measure front-­side of patterned wafers anywhere in the production line. Its direct, front­-side 3D topography measurement capability is well suited for patterned wafer applications such as displacement feed­-forward to the scanner, 3D topography measurement for focus control, and high-­stress process control.

Qoniac’s OVALiS Litho Process Optimization and Control Solution

Based on patent-pending algorithms, Qoniac’s OVALiS software suite provides the industry’s most advanced solutions for process optimization, diagnostics, monitoring and control, resulting in the best possible on-product litho performance and corresponding yields. Its diagnostic and simulation capabilities ensure shortest time-to-market and unrivalled optimization of the litho manufacturing process. Its monitoring and dynamic litho APC capabilities enable advanced excursion detection, reliable overlay dispositioning and optimal field-by-field APC corrections with the tightest possible specs.

SEMICON Korea 2016 at COEX in Seoul opens tomorrow with more than 540 exhibiting companies and an expected 40,000 attendees. Today’s SEMICON Korea press conference expressed a positive lookout, for both 2016 and for longer-term growth drivers, like the Internet of Things (IoT).

Denny McGuirk, president and CEO of SEMI, reported at the Press Conference that even with slightly decreased annual spending, Korea is expected to remain the second largest equipment market for the second year in a row. In 2014, the materials market in Korea surpassed Japan to become the second largest materials market after Taiwan. This year, we expect Korea to represent about a $7.3 billion market, representing 16 percent of the world materials market.

Much of the semiconductor manufacturing capacity in Korea is targeted towards both advanced NAND Flash and DRAM. Korea represents the largest region of installed 300mm fab capacity in the world. Korean semiconductor manufacturers represent about 60 percent of the worldwide Memory output, and is the market leader for installed Memory fab capacity.  According to the SEMI World Fab Forecast, memory was a significant driver for semiconductor equipment spending in 2015 and is expected to remain the largest spending segment 2016, driven mainly by investments for 3D NAND. The primary driver for the Memory market continues to be mobility, keeping the pressure on scaling and added functionality.

Korea fab equipment spending (front-end) in 2016 is forecast to be US$ 8.1 billion. The combined equipment and materials spending outlook for Korea in 2016 will likely top $15.3 billion. The semiconductor, semiconductor equipment, and materials supply chain in Korea is increasingly deep and broad and filling out as a complete ecosystem.

In addition, the LED market will experience strong double-digit growth in lighting applications over the next several years. Overall LED fab capacity continues to expand, and many manufacturers are transitioning to manufacturing with 4-inch diameter sapphire wafers. Korean manufacturers are prominently positioned in the global LED rankings.

Tomorrow’s keynotes at SEMICON Korea will be presented by AUDI, Synopsys, and Texas Instruments. Highlights include: Semiconductor Technology Symposium which addresses the global trends and new technologies of the semiconductor manufacturing process; Market Seminar; Supplier Search Program; OEM Supplier Search Meeting; Presidents Reception; and International Standards meetings.

SEMICON Korea 2016 is a semiconductor technology event for market trends and breaking technology developments, featuring deep technical forums, business programs and standards activities.

Sponsors of SEMICON Korea 2016 include: Special sponsors Samsung, SK Hynix, and Dongbu HiTek; Platinum sponsors Lam Research, Applied Materials, Wonik, Exicon, ASE Group, Advantest, EO Technics, and TEL; and Gold sponsors Hitachi High-Tech and PSK.

The event is co-located with LED Korea 2016.  For more information on the events, visit SEMICON Korea: www.semiconkorea.org/en/  and LED Korea: www.led-korea.org/en/.

The Critical Materials Council for Semiconductor Fabricators, originally established by ISMI/SEMATECH in the early 1990’s, will be managed by TECHCET CA LLC starting January 01, 2016. Under its new name CMC Fabs, the membership-based organization of semiconductor fab & fabless manufacturers will continue working to identify and remediate issues impacting the supply, availability, and accessibility of both current and emerging semiconductor process materials. In keeping with SEMATECH tradition, the work of the international council takes place in a non-competitive environment for the benefit of the semi device fabrication community. Topics addressed are identified and prioritized by the member companies.

The organization has a new website at cmcfabs.org, which includes an overview of the Council’s mission, news of upcoming events and a Members Only portal for access to minutes of monthly phone/WebEx meetings and workshop details. The site also features access for Members to the TECHCET Critical Materials Reports and the related quarterly updates.

The next face-to-face meeting of CMC Fabs will take place May 3-6, 2016 in Hillsboro, Oregon. The meeting will include the annual CMC Materials Seminar held on May 5-6 that is open to the public. Sessions include a market briefing, supply chain issues and methods, the evolution of emerging materials in ALD / ALE, and the materials revolution around carbon. Speakers will be drawn from fabs, suppliers and analysts to address topics of concern and interest to the Council, and the semiconductor materials supply chain.

CMC Fabs is a unit of TECHCET CA LLC, a firm focused on Process Materials Supply Chains, Electronic Materials Technology, Materials Market Research and Consulting for the Semiconductor, Display, Solar/PV, and LED Industries. The company has been responsible for producing the SEMATECH Critical Material Reports since 2000.

By Denny McGuirk, SEMI president and CEO

“In like a lion, out like a lamb” is just half the story for 2015.  While initial expectations forecasted a double-digit growth year, the world economy faded and dragged our industry down to nearly flat 2015/2014 results.

However, 2015 will be remembered for a wild ride that fundamentally changed the industry.  In 2015 a wave of M&A activity swept across the industry supply chain — unlike any single year before — with scores of transactions and notable multi-billion dollar companies being absorbed.  In 2016, we all will be working within a newly reconfigured supply chain.

Increasingly, in this business landscape, collaboration is required simultaneously across the extended supply chain — customers’ customers’ customers are now routinely part of the discussion in even unit process development.  Facilitating interaction and collaboration across the extended supply chain is part of what SEMI does and I’ll be updating you in next week’s letter on how, but first, let’s review what’s happened and what’s happening.

2015 Down 1%: “In Like a Lion, Out Like a Lamb”

2015 had an optimistic start with a strong outlook and good pace in Q1 and 1H.  In January 2015 forecasters projected semiconductor equipment and materials growing in a range of 7 percent to nearly 14 percent vs. 2014.  Global GDP, as late as May 2015, was pegged at 3.5 percent for 2015 after coming in at only 3.4 percent in 2014.  In August, estimates dropped to 3.3 percent, in November estimates dropped further to 3.1 percent for the year.

As our industry has matured, semiconductor equipment and materials growth rates are ever more tightly correlated to shifts in global GDP.  With global GDP unexpectedly dropping, the second half saw declining book-to-bill activity and the year will likely end flat or slightly negative for 2015.  Though nearly flat, the numbers are still impressive with a healthy $37.3 billion annual revenue for semiconductor manufacturing equipment and $43.6 billion for semiconductor materials.

An important change is since the 2009 financial crisis, electronics, chips, and semiconductor equipment and materials markets have been much more stable year-to-year than in the years prior to 2009.  Also, the movement of the three segments is much more synchronized compared to the earlier years of boom and bust. For SEMI’s members this means cycles are becoming more muted — enabling members to shift business models accordingly to better maintain prosperity.

Fab-Equipmt-600w Capital-Equip-600w

 

2015’s $125+ Billion M&A:  Inflection Point for Silicon Valley Icons and Global Titans

2015 is a year that will be viewed as an inflection point in our industry.  The unprecedented M&A volume (more than $125 billion for semiconductor related companies) and the size of individual deals through the electronics supply chain will forever  change the industry.

historic-proportions

While there have been waves of consolidation for semiconductor Integrated Device Manufacturers (IDMs) in the 1980s and 1990s, and semiconductor equipment and materials in the 1990s and 2000s, the fabless semiconductor companies are the latest wave undergoing consolidation.  Although, in 2015, not just fabless, but all segments saw major deals — even iconic chemical brands DuPont and Dow Chemical announced their intention to merge.

Large and familiar brands like Broadcom (Avago), SanDisk (Western Digital), Altera (Intel), Freescale (NXP), and KLA-Tencor (Lam Research) have been merged and will continue forward as part of their acquirers.  China is on the move with its ambitions to quickly grow its indigenous semiconductor supply chain with recent acquisitions of ISSI, OmniVision, NXP RF power unit, and notably Mattson in the semiconductor equipment segment.

In an age when new fab costs are pushing double-digit billions of dollars and leading-edge device tapeouts are surpassing $300 million per part, consolidation is a strategy to increase scale, leverage R&D, and compete better.  For SEMI’s members, the winner-take-all stakes increase and raise expectations for technology, product performance, application development, speed, and support.  This, in turn, means that SEMI members have an increased need for a newly drawn pre-competitive collaboration model along the extended electronics supply chain and for Special Interest Groups (SIGs) to drive collective action in focused sub-segments and for specific issues.

Collaboration-is-critical-6

Source: SEMI (www.semi.org), 2015

2016 Up ~1%: Stay Close to your Customer and your Customer’s Customer and …

Current projections for semiconductor equipment and materials suggest that 2016 will not be a high growth year.  The span of forecasts ranges from almost -10 percent to +5 percent.  At SEMI’s Industry Strategy Symposium (ISS), 10-13 January, we will be taking a deep-dive into the 2016 forecast and on the business drivers and will have a much better picture of the consensus outlook.

However, it is already quite clear that following this enormous wave of consolidation, the industry will look different and will offer new and different opportunities.  Listening to SEMI’s members, I’ve heard that during this period of upheaval it’s absolutely critical to stay close to one’s customers – but more than that – to have access and ongoing direct dialogue with the customer’s customer … and customers’ customers’ customers.

In light of the cost of research and development, the magnitude of risks, and the speed of new consumer electronics adoption, SEMI members find that they need to intimately know emerging requirements two to three steps away in the supply chain, and may require rapid and innovative development from their own sub-suppliers to meet product delivery in time.  In parallel, we see system integrators (electronics providers) staffing up with semiconductor processing engineers and equipment expertise, both for differentiation of their own products and for potential strategic vertical manufacturing.

2016 will mark an acceleration of collaboration and interdependence across the extended supply chain.  Next week, I’ll provide an update letter on SEMI’s related activities with an overview of what SEMI is doing to meet the realities of a reshaped industry.  SEMI’s role is evolving, and more important now than ever, in helping the industry achieve together, what it cannot accomplish alone.

SEMI-Infographic--Achieving

Learn more about SEMI membership and upcoming events.

The SEMI Foundation today announced that Belle W. Y. Wei, Ph.D., was elected as a new director to the SEMI Foundation Board of Trustees in accordance with the association’s by-laws. Her appointment to the Board is immediately effective.

The SEMI Foundation is known for its flagship program, SEMI High Tech U, which serves high school students interested in pursuing careers in science, technology, engineering and math (STEM).  Since 2001, the Foundation has delivered 190 programs to over 6,000 students and teachers worldwide. Companies and organizations join the SEMI Foundation’s existing High Tech U program, by generously offering financial support, in-kind donations and volunteering at High Tech U events.

Belle Wei has held a range of leadership positions at California State University, Chico, and San Jose State University’s College of Engineering. Wei has promoted student success and bolstered STEM education, expanded educational access for historically underrepresented groups, and helped improve students’ timely graduation. She also led the Engineering Pathway Initiative that brought the Project Lead the Way engineering curricula to middle and high schools in the San Francisco/Silicon Valley region to prepare young students for colleges and careers in STEM fields. Wei presented before U.S. Congress in 2006 and contributed to the America COMPETES Act of 2007. In 2012, she participated in the “10,000 Engineers Initiative” of the President’s Council on Jobs and Competitiveness. Wei has a Ph.D. in Electrical Engineering and Computer Sciences from the University of California, Berkeley and Master of Science degree in Engineering from Harvard University. Her undergraduate degree is in Biophysics from the University of California, Berkeley.

“We are inspired by Belle’s deep engagement in higher education and her drive to help students pursue STEM careers,” said Denny McGuirk, president and CEO of SEMI. “We welcome her to the Board and look forward to utilizing her knowledge and experience as we expand the SEMI Foundation’s contributions to STEM education and workforce development.”

“I’m impressed with the SEMI Foundation’s High Tech U program, which helps students understand the connection of STEM skills to future career opportunities in high tech. At a more strategic level, the Foundation’s track record of engaging industry sponsors is remarkable,” said Belle Wei. “I’m looking forward to working with the Board and helping to develop new opportunities for the SEMI Foundation to strengthen its role in STEM education and career exploration for young people.”

Other members of the SEMI Foundation Board are: Denny McGuirk, chairman of the SEMI Foundation and president and CEO of SEMI; Richard Salsman, CFO and treasurer of the SEMI Foundation and CFO and executive vice president of Global Alliances at SEMI; Leslie Tugman, secretary of the SEMI Foundation and executive director of the SEMI Foundation; Arthur Zafiropoulo, chairman and CEO of Ultratech; Yong Han Lee, chairman of Wonik; Stanley Myers, president of ST Myers and Associates; Dana Ditmore, Oak Valley Consulting; and John Biera, principal of Central High School in Phoenix, Ariz.

The SEMI Foundation’s Board of Trustees represent companies from Asia and the United States, reflecting the global scope of the association’s activities. For more information about the SEMI Foundation, visit www.semi.org/en/About/SEMIFoundation.

Worldwide semiconductor fab equipment capital expenditure growth (new and used) for 2015 is expected to be 0.5 percent (total capex of US$35.8 billion), increasing another 2.6 percent (to a total of $36.7 billion) in 2016, according to the latest update of the quarterly SEMI World Fab Forecast report.

SEMI reports that in 2015, Korea outspent all other countries ($9.0 billion) on front-end semiconductor fab equipment, and is expected to drop to second place in 2016 as Taiwan takes over with the largest capex spending at $8.3 billion. In 2015, Americas ranked third in overall regional capex spending with about $5.6 billion and is forecast to increase only slightly to (5.1 percent) in 2016.

fab equipment spending 2016

In 2015, 80 to 90 percent of fab equipment spending went to 300mm fabs, while only 10 percent was for 200mm or smaller.  SEMI’’s recently published “Global 200mm Fab Outlook” provides more detail about past and future 200mm activities.

Examining fab equipment spending by product type, Memory accounts for the largest share in 2015 and 2016.  While 2015’s spending was dominated by DRAM, the SEMI World Fab Forecast reports that 2016 will be dominated by Flash, mainly 3D-related architectures.  Capacity for 3D-NAND will continue to surge. SEMI’’s report tracks 10 major 3D producing facilities, with a capacity expansion of 47 percent in 2015 and 86 percent in 2016.

The Foundry segment is next in terms of the largest share of fab equipment spending in 2015 and 2016.  In general, the foundry segment shows steadier, more predictable spending patterns than other device product segments. Coming in third place in fab equipment spending, MPU had lower spending in 2015.  Logic spending was very strong in 2015, with 90 percent growth, driven by SONY’s CMOS image sensors.

Throughout 2015, SEMI anticipates that there will be 1,167 facilities worldwide investing in semiconductor equipment in 2016, including 56 future facilities across industry segments from Analog, Power, Logic, MPU, Memory, and Foundry to MEMS and LEDs facilities. For further details, please reference to the latest edition of SEMI’s World Fab Forecast report.

The Semiconductor Industry Association (SIA) announced worldwide sales of semiconductors reached $29.0 billion for the month of October 2015, 1.9 percent higher than the previous month’s total of $28.4 billion and 2.5 percent lower than the October 2014 total of $29.7 billion. The Americas market posted 3.9 percent growth compared to last month, leading all regions. All monthly sales numbers are compiled by the World Semiconductor Trade Statistics (WSTS) organization and represent a three-month moving average. Additionally, a new WSTS industry forecast projects slight market growth for the next three years.

“Global semiconductor sales have shown signs of stabilizing in recent months, with October marking the third straight month of month-to-month growth,” said John Neuffer, president and CEO, Semiconductor Industry Association. “Year-to-date sales are narrowly ahead of where they were through the same time last year, and slight growth is projected for next year and beyond.”

Month-to-month sales increased across all regional markets: the Americas (3.9 percent), China (1.6 percent), Europe (1.2 percent), Japan (0.4 percent), and Asia Pacific/All Other (1.7 percent). Compared to October 2014, sales were up in China (5.7 percent), but down in the Americas (-5.6 percent), Europe (-9.4), Japan (-10.5 percent), and Asia Pacific/All Other (-2.4 percent).

Additionally, SIA endorsed the WSTS Autumn 2015 global semiconductor sales forecast, which projects the industry’s worldwide sales will reach $336.4 billion in 2015, a 0.2 percent increase from the 2014 sales total. WSTS projects year-to-year increases for 2015 in Asia Pacific (3.9 percent), with decreases projected for the Americas (-0.6 percent), Europe (-8.2 percent), and Japan (-10.3 percent).

Beyond 2015, the global market is expected to grow at a modest pace. WSTS forecasts 1.4 percent growth globally for 2016 ($341.0 billion in total sales) and 3.1 percent growth for 2017 ($351.6 billion). WSTS tabulates its semi-annual industry forecast by convening an extensive group of global semiconductor companies that provide accurate and timely indicators of semiconductor trends.

October 2015

Billions

Month-to-Month Sales                               

Market

Last Month

Current Month

% Change

Americas

5.82

6.05

3.9%

Europe

2.87

2.90

1.2%

Japan

2.69

2.70

0.4%

China

8.45

8.58

1.6%

Asia Pacific/All Other

8.58

8.72

1.7%

Total

28.41

28.96

1.9%

Year-to-Year Sales                          

Market

Last Year

Current Month

% Change

Americas

6.41

6.05

-5.6%

Europe

3.21

2.90

-9.4%

Japan

3.01

2.70

-10.5%

China

8.12

8.58

5.7%

Asia Pacific/All Other

8.94

8.72

-2.4%

Total

29.68

28.96

-2.5%

Three-Month-Moving Average Sales

Market

May/Jun/Jul

Aug/Sept/Oct

% Change

Americas

5.51

6.05

9.7%

Europe

2.83

2.90

2.5%

Japan

2.63

2.70

2.3%

China

8.18

8.58

5.0%

Asia Pacific/All Other

8.71

8.72

0.2%

Total

27.87

28.96

3.9%

Diodes reported that it has completed its acquisition of Pericom Semiconductor.

Diodes noted the merger agreement was initially announced on September 3, and Pericom shareholders approved the transaction at a special meeting of shareholders held on November 20. According to a release, the transaction closed and became effective today, with each share of Pericom being converted into the right to receive $17.75 in cash, without interest. The aggregate consideration will be approximately $413 million, including the value of Pericom equity awards paid out or converted to Diodes equity awards. As a result of the transaction’s close, the common stock of Pericom will no longer be listed for trading on the NASDAQ stock exchange as of the close of market today.

“We are very pleased to complete the acquisition of Pericom, which will be immediately accretive to Diodes’ earnings and also provide enhanced margin expansion opportunities,” stated Dr. Keh-Shew Lu, President and Chief Executive Officer.

“Also notable, this acquisition broadens Diodes’ analog footprint and adds a strong mixed-signal connectivity offering that will drive expanded product content in our target market applications. Pericom also provides an extensive timing product line that complements Diodes’ standard product portfolio.”Dr. Lu also added, “I would like to personally welcome the Pericom employees to the Diodes’ family. Together, we are able to accelerate the attainment of our goal to reach a $1 billion annual revenue run rate with 35 percent gross margin, and I look forward to expanding our global organization and achieving future success.”

Diodes is a global manufacturer and supplier of application specific standard products within the broad discrete, logic and analog semiconductor markets.

Related news

Historic era of consolidation for chip makers

BY PETER CONNOCK, Chairman of memsstar

The dramatic shift from the trend for increasingly advanced technology to a vast array and volume of application-based devices presents Europe with a huge opportunity. Europe is a world leader in several major market segments – think automotive and healthcare as two examples – and many more are developing and growing at a rapid rate. Europe has the technology and manufacturing skills to satisfy these new markets but they must be addressed cost effectively – and that’s where the use of secondary equipment and related services comes in.

While Moore’s Law continues to drive the production of advanced devices, the broadening of the “More than Moore” market is poised to explode. All indicators are pointing to a major expansion in applications to support a massive increase in data interchange through sensors and related devices. The devices used to support these applications will range from simple sensors to complex packages but most can, and will, be built by “lower” technology level manufacturing equipment.

This equipment will, in many cases, be required to be “remanufactured” and “repurposed” but will allow semiconductor suppliers to extend the use of their depreciated equipment and/or bring in additional equipment, matched to their process needs, at reduced cost. In many cases this older equipment will need to be supported by advanced manufacturing control techniques and new test and packaging capabilities.

SEMI market research shows that investment in “legacy” fabs is important in manufacturing semiconductor products, including the emerging Internet of Things (IoT) class of devices and sensors, and remains a sizeable portion of the industries manufacturing base:

  • 150mm and 200mm fab capacity represent approximately 40 percent of the total installed fab capacity
  • 200mm fab capacity is on the rise, led by foundries that are increasing 200mm capacity by about 7 percent through to 2016 compared to 2012 levels
  • New applications related to mobility, sensing, and IoT are expected to provide opportunities for manufacturers with 200mm fabs

Out of the total US$ 27 billion spent in 2013 on fab equipment and US$ 31 billion spent on fab equipment in 2014, secondary fab equipment represents approximately 5 percent of the total, or US$ 1.5 billion, annually, according to SEMI’s 2015 secondary fab equipment market report. For 2014, 200mm fab investments by leading foundries and IDMs resulted in a 45 percent increase in spending for secondary 200mm equipment.

Secondary equipment will form at least part of the strategy of almost anyone manufacturing or developing semiconductors in Europe. In many cases, it is an essential capability for competitive production. As the secondary equipment industry increases its strategic importance to semiconductor manufac- turers and researchers it is critical that the corresponding supply chain ensures a supply of quality equipment, support and services to meet rapidly developing consumer needs.

Common challenges across the supply chain include:

  • How to generate cooperation across Europe between secondary equipment users and suppliers and what sort of cooperation is needed?
  • How to ensure the availability of sufficient engineering resource to support the European secondary installed base?
  • Are there shortages of donor systems or critical compo- nents that are restricting the use of secondary equipment and, if so, how might this be resolved

Europe’s secondary industry will be in the spotlight during two sessions at SEMICON Europa 2015:

  • Secondary Equipment Session – Enabling the Internet of “Everything”?
  • SEA Europe ‘Round Table’ Meeting

The sessions are organised by the SEMI SEA Europe Group and are open to everyone associated with the secondary industry, be they device manufacturer or supplier, interested in the development of a vibrant industry providing critical support to cost effective manufacturing in Europe.