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SEMI, a supplier of independent semiconductor market research, today announced SEMI FabView, a mobile-friendly, interactive version of its popular World Fab Forecast quarterly report for electronic supply chain players and analysts. The new product was announced during the press conference at SEMICON Taiwan, where 43,000 industry professionals are convening this week. SEMI FabView tracks spending and capacities of over 1,100 facilities, including over 60 future facilities, across industry segments from Analog, Power, Logic, MPU, Memory, and Foundry to MEMS and LED fabs.

semi fabview

SEMI FabView features high-level fab data such as capacity, technology nodes, and equipment spending, with other device manufacturing insights such as fabs by region, wafer size, product type and construction status. This new online platform enables anytime access on the changes taking place in fab construction and expansion, production volume, device types, and more. The ability to quickly access the latest data for quarterly business reviews or earnings calls, or to validate an investment decision, is a key feature of this new product.

“SEMI FabView, an online platform, provides SEMI members and customers access to the industry benchmark World Fab Forecast database information in an entirely new way,” said Dan Tracy, senior director of SEMI Industry Research & Statistics for SEMI. “By adding the interactive elements of SEMI FabView, subscribers now have on-the-go real-time access to expert analysis that can be implemented in their models or forecasts.”

SEMI FabView users can:

  • view forecast for equipment and construction spending, capacity changes, and fab status from new plans to closures
  • organize data views by filtering data and accessing analyst commentary for each company and fab to see the latest SEMI forecast
  • access forecast data by company, geographical region, wafer size, technology geometry and specific stages of fab life cycle ─ from announced and planned new fabs to fabs that are in transition (e.g., when a cleanroom is converting to a larger wafer size or a different product type)

SEMI FabView is available for a product demo; contact [email protected]. Learn more about SEMI FabView here: www.semi.org/en/semi-fabview

Leading sensors and actuators companies will present the latest trends at the upcoming SEMI European MEMS Summit in Stuttgart on 15-16 September 2016.  Following 2015’s highly successful debut in Milano, the SEMI European MEMS Summit this year moves to Stuttgart. Over 250 attendees, including the industry’s global thought leaders, will discuss challenges, opportunities, and solutions.  A full capacity exhibition with representatives from the full value chain will complement the conference.

The event’s keynote presentations will feature:

  • Bosch Sensortec:  “Smart Connected MEMS Sensors – Enabler for the IoT” by Udo Gomez, CTO
  • STMicroelectronics:  “MEMS Sensors and Actuators – Opportunities and Challenges” by Benedetto Vigna, EVP and GM
  • Qorvo: “BAW and the ‘Edge of Tomorrow’ in Wireless Communication: Innovate, Ramp. Repeat” by Robert Aigner, Senior Director
  • AMKOR: “Sensor in Package – Standard Package Platform for Sensor Fusion and IoT” by Adrian Arcedera, VP

In addition to keynotes, the MEMS Summit’s exceptional speaker line-up includes presentations from ams AG, Bosch, Coventor, Fraunhofer IPMS, GLOBALFOUNDRIES, IHS, Invensas, NXP, Roland Berger, STMicroelectronics, Teledyne DALSA, and Yole Developpement.  The event’s main sessions will address Market and Business, Technology, Internet of Things, Automotive, Consumer, and Wearable Electronics. Promising start-ups Innoluce, USound, Polight and Enerbee will pitch their innovative solutions in a brand new session.

The Summit benefits from strong support from within the industry including Platinum Sponsor Bosch Sensortec; Gold Sponsors ASE Group, STMicroelectronics, and SUSS MicroTec; Silver Sponsors Applied Materials, EV Group, LAM Research, and SPTS. Other sponsors include AMKOR Technology, JSR Micro, Materion, Trymax, and VAT.

For more information and registration, please visit www.semi.org/eu/EuropeanMEMSSummit

Technavio analysts forecast the global radio frequency (RF) IC market to grow at a CAGR of nearly 12% during the forecast period, according to their latest report.

The research study covers the present scenario and growth prospects of the global RF IC market for 2016-2020. To calculate the market size, the report considers revenue generated from the shipment of RF ICs globally.

Asia-Pacific (APAC) is expected to be the major demand generating region and is expected to be the major contributor to the market during the forecast period. This is because of the growing demand for RF IC’s in the consumer electronics segment and increasing need for logic and multipoint control units (MCUs) in the automotive segment in the region. The presence of major buyers such as Samsung Electronics, LG Electronics, and Toyota Motor led to the increasing consumption of RF ICs in this region.

Increased demand for electronics from countries such as China and India drives the market in APAC. China’s massive demand for electronics exceeds the production levels in the country. Despite the phenomenal growth, only a small share of semiconductors’ demand in China is actually produced domestically.

Technavio hardware and semiconductor analysts highlight the following four factors that are contributing to the growth of the global RF IC market:

  • Deployment of next-generation LTE wireless networks
  • Advent of carrier aggregation
  • Use of new materials for manufacture of RF devices
  • Growing traction of RF technology for remotes

Deployment of next-generation LTE wireless networks

The increase in data consumption has resulted in the adoption of next-generation LTE networks such as 3G and 4G. The growing consumption has resulted in the growth of commercial networks, making LTE the fastest developing mobile technology. Though specific bands have been designated for LTE, they vary from carrier to carrier.

Sunil Kumar Singh, one of the lead embedded systems research analysts at Technavio, says, “LTE-based computing devices allow consumers to upload and download music and photographs, play games online with minimum signal interference, and watch online TV shows uninterrupted. This has created an opportunity for manufacturers of transceiver chips to offer solutions that address the consumer needs for faster and smoother access to mobile data.”

Advent of carrier aggregation

Carrier aggregation results in an increase in RF content in smartphones and tablets. Carrier aggregation combines a wide range of the available spectrum at the same time to increase download and upload speeds. Though carrier aggregation is not a widespread concept currently, it has already been implemented in South Korea.

“The RF signals are transmitted and received using transceiver chips, which are integrated into RF modules as a component. The advent of carrier aggregation will compel transceiver chip manufacturers to improve and upgrade their offerings according to the requirements of the OEMs,” adds Sunil.

Use of new materials for manufacture of RF devices

The manufacture of RF devices such as power amplifiers incurs huge costs for vendors because of the high cost of raw materials. This has resulted in vendors searching for new materials that can reduce the expenditure incurred in the manufacturing process of RF devices. The development of new materials such as GaAs and indium phosphide (InP) will ramp up the production of RF power amplifiers. GaAs-RF power amplifiers use high saturated electron velocity and electron mobility to function, especially at high frequencies.

The new materials display a superior level of integration with other electronic components such as switches being fabricated in silicon on sapphire or other silicon on insulator processes. While, SAW filters and duplexers are being fabricated with piezo-effective materials such as lithium tantalate and lithium niobate. Therefore, companies such as Murata and TriQuint are trying to use cost-effective and superior-performing materials to manufacture RF power amplifiers.

Growing traction of RF technology for remotes

RF remotes accounted for 13% of the global remote market in 2015 and are expected to witness increased adoption during the forecast period, accounting for a little more than 20% by 2020. One of the major factors contributing to it is the decrease in the development cost of RF technology-based products. Moreover, RF remotes are expected to gain traction in the market because of advantages compared with IR remotes. RF remotes have lower power consumption, longer range, and do not need line-of-sight to control the device.

The RF remotes segment will witness high demand considering the demand for advanced TVs such as 3D smart TVs and 4k UHD smart TVs. Consumers demand visually aesthetic TVs that deliver a unique experience in terms of picture quality, viewing angle, and internet connectivity. With such advanced features, remote manufacturers are also manufacturing advanced and sophisticated RF remotes. RF has benefits such as out-of-line and sight communication and control, two-way communication, incorporation of gesture recognition and voice controls, and enhanced bandwidth compared to IR.

The key vendors are:

  • Infineon Technologies
  • Qualcomm
  • Avago Technologies
  • Qorvo
  • Skywork Solutions
  • NXP Semiconductors
  • STMicroelectronics
  • Renesas Electronics

According to the latest market study released by Technavio, the global micro-electro-mechanical-systems (MEMS) market is expected to reach USD 20.26 billion by 2020, growing at a CAGR of nearly 12%.

This research report titled ‘Global MEMS Market 2016-2020’ provides an in-depth analysis of the market in terms of revenue and emerging market trends. To calculate the market size, the report considers revenue generated from the sales of MEMS. The report also presents the vendor landscape and a corresponding detailed analysis of top vendors in the market, as well as other prominent vendors.

MEMS are miniaturized devices and structures that are made using the techniques of microfabrication. These combine mechanical, optical, and fluidic elements with electronics. The size of the devices can range from less than one micron up to a number of millimeters. These devices are integrated with a number of devices such as smartphones, tablets, wearables, vehicles, medical devices, and industrial devices for carrying out different types of automated functions. Consumer electronics is the largest market for MEMS. IoT will boost up the MEMS demand, as a large number of MEMS would be required for smart homes, building and industrial automation, and smart grid applications.

Technavio’s hardware and semiconductor analysts categorize the market into three major segments by end user. They are:

  • Automotive
  • Consumer electronics
  • Industrial

Global MEMS market for consumer electronic segment

The consumer electronic segment was valued at USD 5.83 billion in 2015 and will reach USD 10.84 billion by 2020, growing at a CAGR of over 13% during the forecast period. MEMS are integrated into consumer electronics such as smartphones, tablets, cameras, gaming consoles, and wearables. The features such as display control, motion control, navigation, and gesture recognition are enabled by MEMS. Therefore, consumer electronics are integrated with MEMS. The global MEMS market for consumer electronics will primarily be driven by the increase in demand for smartphones. This is due to the decreasing cost of smartphones, which, in turn, boosts the market for MEMS.

According to Sunil Kumar Singh, a lead sensors research analyst from Technavio, “With the declining ASPs and increasing benefits such as low space and high accuracy, the demand for MEMS is increasing. MEMS are small enough to be soldered directly onto the circuit boards. This provides technology with a price advantage.”

Global MEMS market for automotive segment

The automotive segment was valued at USD 3.3 billion in 2015 and will reach USD 5.22 billion by 2020, growing at a CAGR of almost 10% during the forecast period. Government regulations and consumer awareness campaigns such as the Global New Car Assessment Program (NCAP) are driving the demand for MEMS in the automotive segment. Global NCAP demands the integration of minimum vehicle safety standards for both crash protection and crash avoidance in all new cars sold worldwide by 2020. This requires the installation of different types of MEMS in vehicles. MEMS provide safety features such as airbag systems, vehicle security systems, inertial brake lights, headlight levelling, rollover detection, automatic door locks, and active suspension.

“The UN Road Safety Collaboration has introduced a global plan for the decade 2011-2020. The plan focuses on road safety activities such as improving the safety of road infrastructure and broader transport networks; building road safety management capacity; enhancing the behavior of road users; further developing the safety of vehicles; and improving post-crash care,” says Sunil.

MEMS microphones are mainly used in the automotive segment for speech or voice recognition in automobile audio systems. This will enable the passengers to stay connected and be entertained in a safe environment, as they can communicate with the audio system verbally. This has the possibility to reduce road accidents, as people are often distracted by factors such as adjusting the car audio system or speaking on mobile phones.

Global MEMS market for industrial segment

The industrial segment was valued at USD 1.2 billion in 2015 and will reach USD 1.95 billion by 2020, growing at a CAGR of above 10% during the forecast period. MEMS are used in many industrial applications such as construction equipment, agricultural machinery or platform leveling, and for testing applications. MEMS accelerometers are used for vibration sensing conditions such as automotive testing or monitoring the pitch and roll of an aircraft.

MEMS are also used with IoT for industrial automation. MEMS technology is helpful for industrial robots, as it can be applied to tactile sensors, navigation, or proximity sensors. MEMS are used for condition monitoring of transportation and industrial equipment, vibration and rotational speed monitoring, asset and parcel tracking and monitoring, shock detection and logging, building and structure monitoring, and vibration and tilt monitoring.

By Yann Guillou, SEMI Europe

Leading companies will present the latest and most impactful trends at the upcoming SEMI European MEMS Summit in Stuttgart on 15-16 September, 2016.  Over 200 attendees, including the industry’s most influential executives and decision makers, are expected to discuss challenges, solutions, and critical trends impacting the sector.  The full program line-up for SEMI’s MEMS flagship event is available online.  Have a look and register now.

The event’s keynote presentation will be delivered by Udo Gomez, CTO of Bosch Sensortec, headquartered just a few kilometers away from the conference venue.  During his talk titled, “Smart Connected MEMS Sensors – Enabler for the IoT,” with the perspective of a sensor systems integrator, Gomez will discuss how different application domains overlap, the key drivers of connectivity and digitalization, and what is missing with respect to bridging future technologies.

One of the MEMS “Titans,” Benedetto Vigna, EVP and GM of STMicroelectronics, will deliver a keynote about “MEMS Sensors and Actuators – Opportunities and Challenges” and review their implication on ST focus areas such as Smart Driving and the Internet of Things.  It will be exciting to see what Vigna will share with the audience and what details might support what Peter Clarke recently called the “ST resurgence”.

Representing one of the largest growing companies of 2015, Robert Aigner, senior director from Qorvo, will keynote and present the success story behind BAW filters in his talk called “BAW and the “Edge of Tomorrow” in Wireless Communication: Innovate, Ramp. Repeat.” BAW filters had been termed “niche play,” but are now identified as key enablers for smartphones with multibillions of units expected to ship in 2016.

Addressing a key aspect of the quadriptych “power, performance, area and cost” equation, Adrian Arcedera, VP, AMKOR, will in his keynote talk discuss “Sensor in Package – Standard Package Platform for Sensor Fusion and IoT”. To offer cost competitive solutions without compromising performance, he will explain what standardization efforts are needed in packaging, assembly, test, and detail the solution proposed by AMKOR. He may also take the opportunity to provide additional info about the brand new MEMS plant of AMKOR in China.

In addition to these keynote talks, a top notch speaker line-up will be presented to attendees. Market analysts will share the results of their latest reports featuring IHS, Yole Developpement, and Roland Berger. Foundries such as GLOBALFOUNDRIES and Teledyne DALSA will present their strategies. The hyper active company in M&A, ams AG, will talk about MEMS and optical sensor in consumer and wearable electronics.

Intel will join the stage, addressing wearables in addition to providing a review of the key enabling technologies impacting MEMS today. NXP and Bosch will discuss sensors for automotive.  MEMS and CMOS integration, from a process and design perspective, will be addressed by Fraunhofer IPMS and Coventor and Invensas will deliver a presentation from a technological aspect.  Last, but not least, we are very excited to introduce great and promising start-ups Innoluce, USound, Polight and Enerbee. Attendees can look forward to hearing their pitches and learning about their innovative ideas.

Exhibitor space has sold out, but you can visit our website to see who will be exhibiting at the European MEMS Summit in Stuttgart.  Connect to the leaders and industry professionals that will help “Make Every Market Smarter” in the MEMS and Sensor value chain.  Register now, and be part of this exciting event in Stuttgart!

Please follow: SEMI Europe LinkedIn and SEMI Europe Twitter; also Global SEMI LinkedIn and SEMI Twitter.

MEMS, a pivotal technololgy predominantly used in the automotive industry, serves to enhance vehicle features. While the automotive MEMS technology has been widely adopted for vehicle control, safety, comfort, convenience, powertrain, and infotainment, vehicle safety is the key factor that majorly impacts the demand for MEMS in the automotive industry.

A few major brands in the automotive MEMS market witnessed a regulatory blow in 2014-15, resulting in passive market dynamics. However, the market has recovered rapidly and is currently growing at a significant pace, according to new research recently published by Future Market Insights.

The major applications of automotive MEMS include airbags, tire pressure monitoring, navigation, and electronic stability. However, according to FMI’s market research, the industry is currently witnessing a growing number of applications, which is expected to continue with the advent of technology and increasing research prospects. The market is thus foreseen to grow at an impressive pace over the forecast period 2016-2026.

Key players in the global automotive MEMS market

According to FMI’s findings, the prominent players in the global automotive MEMS market include Robert Bosch GmbH, General Motors Company, Analog Devices Inc., STMicroelectronics N.V., Sensata Technologies Inc., Panasonic Corporation, Infineon Technologies AG, Delphi Automotive PLC, and Freescale Semiconductors Ltd. (perviously NXP), Denso Corporation, and Murata Manufacturing Co. Ltd.

With the aim of expanding the customer base, few of the prominent players in the automotive MEMS market are setting up their production plants in the foreign market thereby further boosting the market revenues. For instance, on February 20, 2015, Denso Corporation, one of the prominent players in automotive MEMS market confirmed the plans of constructing another plant in Cambodia that would cater to the automotive industries in the region.

Strict government regulations

Various governments are implementing stringent regulations setting the standards for vehicles’ fuel efficiency and emission standards. As a result, major players in the market are increasingly striving to meet the standards through adoption of MEMS, thereby escalating the demand for automotive MEMS in the market. China and India in particular are expected to grow into attractive markets during the forecast period.

Regions with adverse climatic conditions

Studies depict that harsh climatic conditions such as heavy snowfall or rainfall may negatively influence the functioning of MEMS systems in vehicles. Moreover, it is not feasible to replace the entire MEMS system, if it faces a minor fault. This is expected to be a major challcenge that might reflect a shift in consumer behaviour.

Future Market Insight’s research on the global automotive MEMS market offers a 10-year forecast, segmenting the market according to type, applications, and regions.

On the basis of type, the automotive MEMS Market is further segmented into pressure sensor, accelerometer, gyroscope, flow sensor and others.

As per the regional analysis, the global automotive MEMS market is segmented into seven key regions, including North America, Latin America, East Europe, West Europe, Asia-Pacific excluding Japan, Japan, and Middle East & Africa.

Semiconductor Research Corporation (SRC) today announced that Tokyo Electron Limited (TEL) has joined SRC’s Nanomanufacturing Materials and Processes (NMP) initiative.

TEL’s addition contributes to a 33 percent increase in core SRC membership over the last 18 months and is the second non-US headquartered company to join within the same period. It is further indication of how important pre-competitive research is to overcome the current obstacles that impede future semiconductor technology progress.

“SRC is pleased TEL has made the decision to invest research dollars into the NMP program,” said Ken Hansen, President & CEO, SRC. “TEL’s addition strengthens research throughout the entire semiconductor supply chain that has consistently provided SRC members end-to-end solutions to the challenges facing the industry.”

As one of twelve different research areas, the NMP initiative focuses on developing revolutionary and high-impact materials and processes to enable future generations of semiconductor manufacturing technologies, while training well-educated students for innovation-driven careers in integrated circuit manufacturing. Key NMP research topics include Extreme Ultraviolet Lithography (EUV), Directed Self-Assembly (DSA), Atomic Layer Deposition and Etch (ALD/ALE) processes, interconnect scaling and optimization, and new semiconductor device materials.

“TEL sees the value of collaborating as a member of the SRC NMP program to find solutions for important semiconductor technology issues,” said Gishi Chung, Corporate Director & SVP, TEL.

Recognizing the massive growth potential of micro-electro-mechanical systems (MEMS) and sensors in Internet of Things (IoT) applications, MEMS & Sensors Industry Group (MSIG) will hold its third annual MEMS & Sensors Industry Group Conference Asia in Shanghai, China on September 13-14, 2016. Held in partnership with Shanghai Industrial Technology Research Institute (SITRI) and co-located with SENSOR CHINA, “The Internet of MEMS and Sensors Today and the Internet of TSensors Tomorrow” is a two-day conference focused on near- and long-term opportunities for MEMS and sensors in the IoT. MSIG and its members will also participate in a two-day exposition at SENSOR CHINA.

The IoT market is expanding rapidly, presenting huge market opportunities for MEMS and sensors. According to IHS Technology, the IoT market will grow from 15.4 billion devices in 2015 to 75.4 billion in 2025.

That growth has caught the attention of the global MEMS and sensors supply chain: “MEMS and sensors are critical to IoT devices,” said Karen Lightman, executive director, MEMS & Sensors Industry Group. “From smartphones that monitor air quality and agricultural sensors that manage irrigation to smart city applications that monitor structural health, adapt street lights to weather and light conditions, and enable smart roads, MEMS and sensors allow IoT devices to measure, monitor, sense and interact with our always-changing environment.”

Ms. Lightman added, “On September 13, attendees will gain actionable intelligence on the IoT devices of the near future — those applications that will reach commercialization within the next two to five years. On September 14, they will learn about the IoT devices that will come to market in ten to 20 years. Those speakers will address our TSensors vision — a transformational movement advocating the use of a trillion sensors to address major world problems — as they consider longer-term opportunities in the IoT.”

Conference Agenda
Featured presentations currently include:

Additional featured speakers include:

  • Masayuki Abe, manager, Corporate Production Technology, Asahi Kasei Corporation
  • Dr. Janusz Bryzek, CEO, eXo Systems, Inc., and founder, TSensors
  • Ahmed Busnaina, professor & director, NSF Center, Northeastern University
  • Susumu Kaminaga, executive senior advisor, SPP Technologies Co., Ltd.
  • Karen Lightman, executive director, MEMS & Sensors Industry Group
  • Ryoma Miyake, Process Development Group, Silicon Sensing Products, Ltd.
  • Keynote Speaker Tomy Runne, senior manager of planning and promotion department, Sensor Product Division, Murata Manufacturing Co., Ltd.
  • Keynote Speaker Dr. Jian Xu, executive general manager, Shanghai International Autocity Development Co., Ltd.

Panel
Context Computing — panel moderated by Leopold Beer, regional president AP, Bosch Sensortec, with panelists:

  • Xianfeng (Sean) Ding, director of sensing, Huawei Technologies
  • Ruizhen Liu, Shanghai Academy of Artificial Intelligence
  • Yang (Richard) Shi, industry strategy expert, Huawei Technologies

Samco, a semiconductor process equipment developer and manufacturer based in Japan, announced that it will open its Malaysia branch office on Aug. 10, 2016 in Petaling Jaya, a suburb of Kuala Lumpur.

“With our new office conveniently located near Kuala Lumpur, we expect to better serve Malaysia’s research universities and manufacturers,” says Osamu Tsuji, Samco’s chairman, president and CEO. “Four company representatives will be assigned to this new location, where they will actively provide production-type systems and services, consisting of the three major technologies Samco specializes in.”

These technologies include: thin film deposition with PECVD and ALD systems; microfabrication with ICP etching, RIE and DRIE systems; and surface treatment with plasma cleaning and UV ozone cleaning systems.

“Samco has been continually enhancing its sales presence and service capability in Southeast Asia since the establishment of Samco’s Singapore office 20 years ago,” says Tsuji. “The region has seen an increased number of semiconductor and electronic component manufacturers in recent years, which initially led to the creation of the company’s former Vietnam service office in Ho Chi Minh during 2012.”

However, Tsuji adds, there was still a considerable physical distance between the Vietnam office and the Europe-based device manufacturers that have accumulated in Malaysia (mainly in Penang, Kuala Lumpur and Malacca), as well as the research institutions of some of Samco’s important customers.

“Bridging that distance was one reason Samco decided to replace its Vietnam office with our new location in Malaysia,” he says.

These efforts to strengthen the company’s presence in Southeast Asia include samco-ucp, which was established in Liechenstein after the acquisition of plasma cleaner systems maker UCP in May 2014, and now serves as Samco’s main European office.

“Some of samco-ucp’s chief customers are concentrated in Southeast Asia,” says Tsuji. “Our Malaysia office will also be used as a sales and service base for samco-ucp’s main product, production-type plasma cleaners that operate with a remote plasma source.”

Currently, the company’s annual sales in the region are nearly 2 million USD, which is expected to rise to 5 million USD after three years.

“With the combined sales revenue from both companies, we plan to increase Samco’s annual revenue in Malaysia to 10 million USD,” says Tsuji.

Samco’s Malaysia branch office is located at:

C-8-21, Block C, Centum at Oasis Corporate Park,
No. 2, Jalan PJU 1A/2, Ara Damansara, 47301
Petaling Jaya, Selangor Darul Ehsan, Malaysia

The Semiconductor Industry Association (SIA), representing U.S. leadership in semiconductor manufacturing, design, and research, today announced worldwide sales of semiconductors reached $79.1 billion during the second quarter of 2016, an increase of 1.0 percent over the previous quarter and a decrease of 5.8 percent compared to the second quarter of 2015. Global sales for the month of June 2016 reached $26.4 billion, an uptick of 1.1 percent over last month’s total of $26.1 billion, but down 5.8 percent from the June 2015 total of $28.0 billion. Cumulatively, year-to-date sales during the first half of 2016 were 5.8 percent lower than they were at the same point in 2015. All monthly sales numbers are compiled by the World Semiconductor Trade Statistics (WSTS) organization and represent a three-month moving average.

“Global semiconductor sales increased slightly from Q1 to Q2 but remain behind the pace from last year, due largely to global economic uncertainty and sluggish demand,” said John Neuffer, president and CEO, Semiconductor Industry Association. “Sales into Japan and China have been a bright spot midway through 2016, and a modest rebound in sales is projected during the second half of the year.”

Regionally, sales increased compared to June 2015 in China (1.7 percent), but fell in Asia Pacific/All Other (-11.0 percent), the Americas (-10.8 percent), Europe (-5.5 percent), and Japan (-1.3 percent). Sales were up slightly compared to last month in the Americas (3.0 percent), China (2.2 percent) and Europe (1.7 percent), but down somewhat in Japan (-1.0 percent) and Asia Pacific/All Other (-0.6 percent).

sales graph sales table