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Axcelis Technologies, Inc. (Nasdaq:  ACLS), a supplier of innovative, high-productivity solutions for the semiconductor industry, announced today that it has received orders for the Purion H high current implanter from two leading manufacturers of memory devices in the Asia Pacific region. One of the orders is a follow-on order and the second order is a new customer placement. The systems will be used to support capacity ramps for next generation memory products. The systems will ship in the first quarter.

“The Purion H continues to gain ground as the high current tool of choice due to its ability to provide exceptional doping precision for enhanced device performance and yields,” said John Aldeborgh, executive vice president, customer operations. “We’re excited about the potential at this new customer placement, and remain focused on expanding our market share through both new and established customers by providing innovative, enabling technology to ensure their success.”

The power of Purion

The Purion platform redefines the ion implanter application space, delivering unmatched purity, precision and productivity to enhance customers’ device performance and yield.   On this platform, Axcelis has built the industry’s first complete implant product solution designed specifically for advanced planar and 3D devices while providing the most flexible and productive manufacturing capability for our customers. The systems’ common cross-product platform architecture is designed to drive manufacturing flexibility and lower the total cost of fab operations. All Purion implanters incorporate Axcelis’ industry leading Purion Contamination Shield Defense System, for unsurpassed implant quality, so even the most sensitive devices can realize optimized device performance.  The platform’s proprietary Purion Vector dose and angle control system, and constant focal length scanning deliver the most precise and repeatable dopant placement available today.   The platform’s superior beam current performance combined with the Purion 500wph end station provides the industry’s highest productivity. The Purion platform includes the Purion M medium current implanter, the Purion H high current implanter, and the Purion XE and Purion VXE high energy implanters.

Technavio’s latest market research report on the global field-programmable gate array (FPGA) market provides an analysis of the most important trends expected to impact the market outlook from 2017-2021. Technavio defines an emerging trend as a factor that has the potential to significantly impact the market and contribute to its growth or decline.

Sunil Kumar Singh, a lead analyst from Technavio, specializing in research on semiconductor equipment sector says, “The global FPGA market is expected to grow at a CAGR of close to 9% during the forecast period. The market is witnessing growth due to increased adoption in flourishing end-user segments such as telecommunications and consumer electronics. Demand for optimization in big data analytics is also leading to increased use of FPGAs in networking and storage applications.”

The top three emerging trends driving the global FPGA market according to Technavio hardware and semiconductor research analysts are:

  • Increased proliferation of IoT
  • Automation in automobiles
  • Increasing number of embedded processors in FPGA design

Increased proliferation of IoT

IoT is the latest trend in the global technology arena. IoT connects all essential home devices to the internet. This includes car, TV, laptop, coffee maker, automated door locks, GPS-enabled pet trackers, wearable devices, and mobile phones, forming a network of connected devices.

IoT comprises a staggering list of applications ranging from smart consumer electronics to wearables and automobiles. Designers must tackle significant implementation challenges, to deal with interfaces that are incompatible to IoT configuration, and create future systems that can accommodate billions of more devices and their performance requirements and processes. An FPGA-based design approach will assist in addressing these challenges due to their key ability of reprogrammability and low power consumption.

Automation in automobiles

Leading manufacturers such as Toyota, Audi, and Mercedes have invested considerable resources dedicated to R&D of automobile automation. Next-generation automobiles are expected to include speech recognition and video and image compatibilities, to provide optimal driving experience.

FPGAs allow multi-threading, which enables them to perform different functions in parallel. For instance, in Park Assist app, pictures are captured by cameras and are sent to a data fusion module. The data fusion module processes the image to display the corners of a car on the screen.

“Image processing functions such as image warping, analytics and object classification, and high dynamic range could be implemented on one chip using an FPGA due to its multi-threading feature. This allows fast booting of videos, enabling FPGAs to be widely used for surround-view camera systems and night vision systems in automobiles,” says Sunil.

Increasing number of embedded processors in FPGA design

Since 2012, the global FPGA market is witnessing an increase in the number of embedded processors in FPGA designs, to support growing demand for multiple function capability of FPGAs. This demand is further driven by emerging technologies such as IoT and new age smart devices such as wearables and their demanding processor requirements. FPGA modules can reduce power consumption and at the same time, improve on performance to deliver optimum output in reduced time.

MACOM Technology Solutions Holdings, Inc. (NASDAQ: MTSI), a supplier of high-performance RF, microwave, millimeterwave, and lightwave semiconductor products, today announced that it has successfully completed its previously announced acquisition of Applied Micro Circuits Corporation (NASDAQ: AMCC).

John Croteau, MACOM’s President and Chief Executive Officer stated, “I am pleased to announce the completion of this transaction. AppliedMicro’s leadership in MACsec and 100G to 400G single-Lambda PAM4 positions MACOM as a preferred supplier to major Enterprise and Cloud Data Center providers, many of whom are adopting the technologies this year. MACOM will now be able to support customers with all of the requisite semiconductor content for optical networks—analog, photonic and mixed signal PHY—from the switch to fiber for long haul, metro, access, backhaul and data centers.”

Commenting further Mr. Croteau noted, “With the transaction now closed, MACOM plans to promptly engage with previously identified potential buyers toward a near-term divestment of AppliedMicro’s well-positioned Compute business. As previously stated, this portion of the business does not strategically align with our long-term product focus, but we feel confident a successful transaction can be consummated.”

According to the latest market study released by Technavio, the global semiconductor chip packaging market is expected to grow at a CAGR of more than 31% during the forecast period.

This research report titled ‘Global Semiconductor Chip Packaging Market 2017-2021’ provides an in-depth analysis of the market in terms of revenue and emerging market trends. This market research report also includes up to date analysis and forecasts for various market segments and all geographical regions.

The global semiconductor chip packaging market is dominated by APAC, which holds more than 71% of the total market share. The presence of many prominent semiconductor foundries is driving the market in the region.

One of the important driving factors of the semiconductor chip packaging market is the high adoption of semiconductor ICs in automobiles. The increasing automation of automobiles is creating high demand for semiconductors for use in automotive products such as GPS, airbag control, anti-lock braking system (ABS), infotainment, and collision detection technology, which is beneficial for the market growth.

Based on packaging techniques, the report categorizes the global semiconductor chip packaging market into the following segments:

  • 3DIC TSV stacks
  • Flip-chip wafer bumping
  • 2.5D interposers
  • 3D WLP
  • Fan-in WL CSP
  • FO WLP/Sip

The top three revenue-generating packaging technique segments in the global semiconductor chip packaging market are discussed below:

3DIC through-silicon via (TSV) stacks

“The 3DIC through-silicon via stacks packaging technique will be responsible for generating almost 75% of the market revenue by 2021, posting a CAGR of 45% through the forecast period. This high adoption of TSV platforms is pushed by the growing need to increase functionalities, performance, and integration,” says Sunil Kumar Singh, one of the lead analysts at Technavio for semiconductor equipment research.

Form factor and cost reduction of the TSV platforms also play an important part in its rising adoption. This technology is emerging as one of the most crucial platforms for high-end memory applications, heterogeneous interconnection with micro-electro-mechanical systems (MEMS), sensors, radio frequency (RF) filters, and performance applications.

Flip-chip wafer bumping

Flip-chip or controlled collapse chip connection (C4) is used to solder connections between semiconductor devices, such as IC chips and micro-electro-mechanical systems (MEMS), and an external circuit. This technology reduces power consumption by a great extent and also offers high-frequency transmission, which attracts a higher number of end-users to adopt this technology.

2.5D interposers

The increasing number of devices with access to the internet is creating additional bandwidth needs, which supports high-performance computing and cloud infrastructure. The growing popularity of connected cars is also a major driver of streaming bandwidth. Silicon interposer packaging architectures are being developed and manufactured to meet these continually increasing bandwidth requirements.

“2.5D silicon interposers manufactured using four-metal layer back-end-of-line process has achieved data rates up to 11.5 Gbps. These impressive statistics are pushing for the high adoption of the 2.5D interposers packaging technique,” says Sunil.

The top vendors highlighted by Technavio’s research analysts in this report are:

  • Applied Materials
  • ASM Pacific Technology
  • Kulicke & Soffa Industries
  • TEL
  • Tokyo Seimitsu

ams (SIX: AMS), a worldwide supplier of high-performance sensor and analog solutions, announces the completion of the transaction to acquire 100% of the shares in Heptagon and the related capital increase of 11,011,281 new shares from authorized capital excluding subscription rights. ams announced on 24 October 2016 that the company had signed an agreement to acquire Heptagon, a developer of high performance optical packaging and micro-optics.

The upfront consideration for the transaction includes approximately USD 64 million in cash, 5,450,586 ams shares from currently held treasury shares as well as 11,011,281 new shares from authorized capital. The capital increase creating the 11,011,281 new shares from authorized capital was registered with the commercial register today and the shares are admitted to trading on the SIX Swiss Exchange from tomorrow, 25 January 2017, onwards. The total number of shares outstanding of ams AG will therefore be 84,419,826 no par value bearer shares with a calculated nominal value of EUR 1.00 per share.

Following the registration, the selling shareholders of Heptagon hold approximately 19.5% of the total registered share capital of ams. They are subject to a market standard, staggered lock-up obligation ending in the second quarter 2018.

North America-based manufacturers of semiconductor equipment posted $1.99 billion in orders worldwide in December 2016 (three-month average basis) and a book-to-bill ratio of 1.06, according to the December Equipment Market Data Subscription (EMDS) Book-to-Bill Report published today by SEMI.  A book-to-bill of 1.06 means that $106 worth of orders were received for every $100 of product billed for the month.

SEMI reports that the three-month average of worldwide bookings in December 2016 was $1.99 billion. The bookings figure is 28.3 percent higher than the final November 2016 level of $1.55 billion, and is 47.8 percent higher than the December 2015 order level of $1.34 billion.

The three-month average of worldwide billings in December 2016 was $1.87 billion. The billings figure is 15.7 percent higher than the final November 2016 level of $1.61 billion, and is 38.2 percent higher than the December 2015 billings level of $1.35 billion.

“2016 ended the year with bookings levels approaching $2 billion,” said Denny McGuirk, president and CEO of SEMI. “This combined with a significant increase in billings puts 2016 equipment sales of North American manufacturers well above 2015 levels and well positioned for 2017.”

The SEMI book-to-bill is a ratio of three-month moving averages of worldwide bookings and billings for North American-based semiconductor equipment manufacturers. Billings and bookings figures are in millions of U.S. dollars.

 

Billings
(3-mo. avg)

Bookings
(3-mo. avg)

Book-to-Bill
July 2016

$1,707.9

$1,795.4

1.05
August 2016

$1,709.0

$1,753.4

1.03
September 2016

$1,493.3

$1,567.2

1.05
October 2016

$1,630.4

$1,488.4

0.91
November 2016 (final)

$1,613.3

$1,547.5

0.96
December 2016 (prelim)

$1,865.8

$1,985.4

1.06

Source: SEMI (www.semi.org), January 2017

SEMI will cease publishing the monthly North America Book-to-Bill report this year. The December 2016 report and press release is the last publication.  The decision to discontinue the Book-to-Bill report is based on changes in reporting by some participants where the reporting of orders/bookings into the data collection program is no longer considered a necessary component of their industry analysis.

SEMI will continue to publish a monthly billings report and issue a press release Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report that SEMI prepares in collaboration with the Semiconductor Equipment Association of Japan (SEAJ). The WWSEMS report currently reports billings and bookings data by 24 equipment segments and by seven end market regions. Beginning with the January 2017 WWSEMS, bookings information will only be available for the back-end equipment segments of the industry.

SEMI continues to track semiconductor industry fab investments in detail on a company-by-company and fab-by-fab basis in its World Fab Forecast and SEMI FabView databases. These powerful tools provide access to spending forecasts, capacity ramp, technology transitions, and other information for over 1,000 fabs worldwide.  For an overview of available SEMI market data, please visit www.semi.org/en/MarketInfo.

Following economic leaders meeting in Switzerland for the World Economic Forum, electronics manufacturing executives will attend Europe’s SEMI Industry Strategy Symposium (ISS Europe) in Munich, Germany on 5-7 March. Hosted by SEMI Europe, the Symposium brings together leading analysts, researchers, economists, and technologists for critical insights on the forces shaping the electronics manufacturing supply chain. ISS Europe 2017 is the three-day flagship business event that discusses how to cope with the rapid changes and growing challenges of the digital revolution.

“ISS Europe is the leading European strategic platform where industry thought leaders across the electronics manufacturing value chain share the latest analysis and outlooks.  The conference covers global industry trends and challenges and opportunities from innovation, materials, design, and manufacturing – with a focus on end-applications in automotive, health care and smart manufacturing,” said Laith Altimime, president, SEMI Europe.

Twenty industry leaders will present insights into the current market developments in automotive, smart manufacturing, and health, including:

  • TSMC Europe: Maria Marced, president, High Performance Applications to Drive Innovation and Collaboration
  • Mentor Graphics: Wally Rhines, CEO, Semiconductor Consolidation versus Specialization: What’s the Driving Force for Mergers?
  • AUDI AG: Berthold Hellenthal, Robust Design / Komponentenerprobung Elektronik, Cross-Industry Collaboration Networks Accelerate Innovations
  • Dresden University Hospital: Christopher Piorkowski, professor at the Heart Center, Digital Health in Cardiovascular Medicine: Patients, Sensors, and Clinical Care
  • Bosch: Birte Lübbert, senior VP, Smart Manufacturing by Bosch in Reutlingen Plant 2
  • Imec: Ann Stegen, executive VP, Transformation into a 7nm Logic Node Solution with Fundamental Advantages

Join Europe’s strategic thinkers and business drivers at ISS Europe 2017 in Munich (Germany) from March 5-7, 2017!  Register here. For more information visit: www.semi.org/eu/iss-europe-2017

Amtech Systems, Inc. (NASDAQ:  ASYS), a global supplier of production equipment and related supplies for the solar, semiconductor, and LED markets, today announced fiscal year 2017 year-to-date order bookings through January 20, 2017 are approximately $84 million.  This includes solar orders of $60 million.   The solar bookings include major wins for the Company’s high productivity PECVD platform with top tier customers in China, Malaysia, and Taiwan and an n-type bi-facial turnkey order from a new customer in China.  The majority of the orders are expected to ship within the next six to nine months.

Fokko Pentinga, CEO and President of Amtech, commented, “These competitive wins are a direct result of our ongoing investment program and a clear testament to the Company’s ability to meet the market’s expectations as they selectively invest in next-generation technology solutions.  Our newly introduced PECVD platform is recognized as a compelling solution to increase the efficiency in solar cell manufacturing while lowering the cost of ownership.  The continuing development of our advanced n-type technology led to this turnkey order from a customer who will use the technology for Bi-Facial glass-glass module design in the first of a multi-phase 1GW cell and module expansion.  We believe that Amtech has the right mix of n-type and PERC cell technologies for this expanding global solar market where success is driven by the best next-gen technology solutions.  Recently, we have experienced increased customer interest in our n-type technology.  As the solar market looks to the future, we believe n-type cell technology has the best roadmap to higher efficiency.”

Fueled by lightning-fast demand for ubiquitous connectivity, the number of connected Internet of Things (IoT) devices globally will jump by 15 percent year-over-year to 20 billion in 2017, according to new analysis from IHS Markit (Nasdaq: INFO).

In a free new report entitled “IoT Trend Watch 2017,” IHS Markit technology analysts have identified four key trends that will drive the IoT this year and beyond. Increasingly, the report says, businesses see the IoT as a tremendous opportunity to create unique value propositions by linking disparate systems of connected devices that range from multiscreen content sharing to smart city networks.

IHS Markit defines IoT as a conceptual framework, powered by the idea of embedding connectivity and intelligence into a wide range of devices. “These internet-connected devices can be used to enhance communication, automate complex industrial processes and provide a wealth of information that can be processed into useful actions – all aimed at making our lives easier,” said Jenalea Howell, research director – IoT connectivity and smart cities for IHS Markit.

According to the report, the industrial sector — led by building automation, industrial automation and lighting — will account for nearly one half of new connected devices between 2015 and 2025.

IHS Markit has named these four trends as leading the IoT evolution in the coming years:

Trend #1 – Innovation and competitiveness are driving new business models and consolidation

  • To date, the focus on IoT monetization has rightly revolved around the way in which suppliers earn revenue selling components, software or services to IoT application developers. Increasingly, however, the focus is shifting to the IoT developers themselves and how they will monetize new streams of data delivered by their IoT deployments.
  • A wide range of monetization models are being tested, reflecting the fragmented nature of the IoT market across numerous vertical industries. Successful models will revolve around “servitization” and closer, ongoing relationships with end customers, the report says.

Trend #2 – Standardization and security are enabling scalability

  • With the high growth in IoT deployments and much hype surrounding the promise of the IoT marketplace, scaling the IoT is highly dependent on two factors: first, the pace at which devices are connected and second, the ability to manage a large number of devices.
  • Currently, diverse standards and technologies make it difficult to evaluate the many technology options available. Stakeholders also must take a holistic, end-to-end view of securing systems comprehensively and move beyond focusing only on device security.
  • By 2020, the global market for industrial cybersecurity hardware, software and devices is expected to surpass $1.8 billion as companies deal with new IoT devices on business networks as well as a new wave of mobile devices connected to corporate networks.

Trend #3 – Business models are keeping pace with IoT technology

  • The methods used to monetize the IoT are almost as diverse as the IoT itself. Many pioneers of the IoT sold products to build it. That is still happening, of course, but now there is a shift to reaping the benefits of the data that’s been created.
  • An overabundance of business models are being tested to determine which models work and for which applications. Advertising, services, retail and big data are just a few of the areas that have spawned many innovative experiments in monetization. In the coming years, the pace of innovation will slow as successful business models are identified.

Trend #4 – Wireless technology innovation is enabling new IoT applications

  • Advances in wireless technologies will continue to extend the IoT at both the low and high ends. At the low end, low-power wide-area network (LPWAN) promises low cost, low power and long range, connecting millions of devices that previously could not be unified in a practical way. At the high end, 802.11ad makes it possible to wirelessly connect very high performance applications such as 4k video.
  • Beyond 2020, 5G has the potential to address new, mission-critical use cases, particularly where mobility is essential. By 2020, IHS Markit expects around two billion device shipments by integrated circuit type will feature integrated cellular technology.

Demand for TV panels in terms of area is forecast to reach 143 million square meters in 2017, up 8 percent from 2016, contributing to a 6 percent growth in the overall display market, according to IHS Markit (Nasdaq: INFO).

“Owing to the increase in average TV screen sizes demanded by consumers, TV panel makers will enjoy a high growth in display area demand despite sluggish growth in terms of quantity,” said Alex Kang, senior analyst of display research for IHS Markit. The average TV panel size exceeded 40 inches in 2016 for the first time ever, and it will increase further by 1.3 inches to reach 42.6 inches in 2017. “As consumers show a preference for larger display models and as set makers promote products with higher profitability, the average size of TV panels should continue to increase.”

According to the IHS Markit Display Long-Term Demand Forecast Tracker, TV panels accounted for about 70 percent of the entire display demand in terms of area in 2016, while IT panels, which include those for desktop monitors, notebooks and tablet PCs, made up 18 percent. In contrast, IT panel demand is expected to remain flat in 2017, while mobile phone display demand is expected to grow 10 percent to 14 million square meters during the same period.

“Although the increase in the average smartphone screen size is propelling area demand for mobile phone displays, its impact to the entire display market should be minimal as mobile phones make up only 7 percent of the entire display market,” Kang said.

2017 area panel demand