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Spintronic majority gates could revolutionize circuit design. They will completely change the paradigm – both at device and circuit level – in how to approach scaling.

BY IULIANA RADU and AARON THEAN, imec, Leuven, Belgium

Spin logic devices are an emerging beyond-CMOS technology that may push beyond Moore’s law, enabling functional scaling beyond the 5nm technology node. These exotic devices lend themselves to majority logic operation, which differs in many ways from the classical NAND-based operation. Imec looks into spin torque majority gates and spin wave majority gates, two concepts that completely change the way we think of computing and scaling. As shown at the 2015 IEDM conference, circuit simulations with these majority gates outperform equivalent CMOS circuits in terms of area and power consumption. Meanwhile, experimental work has been started to learn about the materials, about the devices behavior and about the technology challenges that lie ahead.

Spintronic majority gates, an efficient way to build circuits

As we approach 5nm logic technology in 2020, CMOS device density scaling faces serious challenges due to escalating process costs and parasitics. This inevitably leads to questions of sustainability of traditional Moore’s law where cost and data processing supposedly scale favorably with increasing device density. This begs the question: are there specialized devices and computational paradigms out there that break away from these fundamental trappings of CMOS scaling? The search is on and novel beyond-CMOS devices are being intensively studied.

This varied class of devices may enhance and complement the functionality of CMOS circuits. Among the promising concepts are spintronic devices (FIGURE 1), which exploit the electron’s spin, a quantum attribute that relates to magnetism, rather than its charge to perform logic operations. Spin logic devices promise to be non-volatile and lend themselves to ultralow-energy operation. But one of their biggest trumps is the ability to build majority gates, ‘democratic’ devices that return true if more than 50% of their inputs are true. For example, if two inputs are in a true state and a third one is in a false state, the expected state at the output is true. With these majority gates, logic AND and OR operations can be emulated. Also, this concept of majority logic operation differs in many ways from the classical NAND-based logic, where an output is false only if all its inputs are true. It presents a concept shift that completely changes the way we synthesize circuits. But the advantages are huge: majority gates enable arithmetic circuits that are much more compact and energy-efficient than conventional NAND or XOR gate-based circuits. For example, while a one-bit adder in CMOS technology requires about 25 transistors, the equivalent wave computing circuit only requires 5 transducers and 4 waveguides to perform the same operation.

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Two ways of encoding information

Spintronic majority gates can come in several flavors, differing in the way the information is encoded and processed in the device, and in the way transduction from the charge domain to the spin (magnetism) domain is executed. At imec, two concepts are studied extensively: the spin torque majority gate (STMG) and the spin wave majority gate (SWMG).

In a STMG, the information is encoded in magnetic domain walls. Domain walls are interfaces that separate regions with different magnetization direction. The majority gate itself consists of a cross-shaped free layer that is common to 4 magnetic tunnel junctions (3 inputs, 1 output). The magnetization direction of the 3 ‘input’ free layers is switched using spin transfer torque, provided by a current through each of the magnetic tunnel junctions. Based on quantum interactions between electrons known as exchange, the domain walls propagate and interact, and the majority magnetization direction wins. The output state is measured via tunneling magnetoresistance.

In a SWMG, the computation principle is based on the interference of spin waves. The information can be encoded either in the amplitude or in the phase of the waves. Spin waves are low-energy collective excita- tions in magnetic materials. They can be generated by a so-called magneto-electric cell, which converts voltage into a spin wave. Key elements of this cell are a piezoelectric layer (that converts voltage into strain) and a magnetostrictive layer (in which the strain produces a change in magnetization or magne- tization anisotropy). In its turn, the change in magne- tization can generate a spin wave in a magnetic spin wave bus. The same cell is used to read the output state of the majority gate (FIGURE 2).

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Both concepts have been studied intensively, and approaches of how to handle the computation have been proposed. An experimental demonstration is however still missing. At imec, we have enlarged our basic understanding of both STMG and SWMG and used simulations to validate device functioning. We have compared the two types of majority gates against equivalent circuits in 10nm FinFET CMOS technology. And we present our first experimental results, and highlight the main challenges for both concepts.

Spin torque majority gate – compact and technology friendly

We used micromagnetic simulations to validate the functioning of the STMG and identify its operating conditions. For this majority gate, the switching of the magnetization state is current controlled. If the applied current or the pulse length are not enough, the output fails to switch. Even if the applied current pulses provide enough energy to switch, other failure modes can appear. For example, the domain walls that are being formed can become ‘stuck’ at the crossing of the device. This happens when the width of the cross exceeds a certain value, typically in the 15-20nm range. This makes these devices difficult to demonstrate experimentally as it requires patterning and etching to small size and tight pitch between the magnetic tunnel junctions. However, this initial impediment holds great promise for further device scaling. A major advantage of this majority gate is the use of technology friendly materials, compa- rable to the materials used in magnetic memories.

We have benchmarked the device against equivalent 10nm CMOS circuits by comparing key metrics of area, power and delay. On average, the STMG circuits have about 10x smaller area, and provide a means for further scaling. However, being current controlled, the STMG circuits have a longer delay, making them less efficient than equivalent CMOS circuits. Further advances in materials stacks are needed to improve their performance, comparable to those needed in general for magnetic memory.

At imec, we are currently building the first STMG devices on 300mm wafers. Particular attention is paid to the magnetic tunnel junction pillar etch development (FIGURE 3).

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Spin wave majority gate – compact, ultralow-power but challenging materials

We used micromagnetic simulations to model the spin wave propagation in SWMGs and to simulate the magnetic behavior of the magneto-electric cell that converts the applied voltage into a spin wave. This cell is a critical component for the device functionality. We mapped out the parameter space where the magneto-electric cell is expected to work optimally and used these parameter ranges as input for circuit synthesis. Building magneto- electric cells experimentally is very challenging as the materials to be used are not typically used in standard fabs and cleanrooms. For this reason, and to help choose the right materials, we have performed circuit synthesis and benchmarked them against CMOS. Based on materials parameters extracted from these simulations we have chosen a starting set of materials for our experiments.

One of the questions to be answered is how piezoelectrics behave at very high frequencies (gigahertz range) as needed for logic devices. Piezoelectric materials are being used in many applications, where they typically operate at low frequencies (up to hundreds of kHz). At imec, we started first experiments to grow piezoelectric materials in a thin film and to learn how these materials behave in the high frequency domain. And although more experiments are needed to improve the performance and map out the reliability behavior, our preliminary results are very encouraging. An important drawback of the spin wave technology is that the required materials (both the magnetostrictive and the piezoelectric materials) are very different from standard CMOS materials (FIGURE 4).

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The spin wave technology was also benchmarked against CMOS circuits. The spin wave circuits take on average 3.5 times less area and about 400 times lower power than their CMOS counterparts. However, the spin wave circuits are on average 12 times slower, mainly because of the large switching delay of the magneto-electric cell. SWMGs may therefore be used for ultralow-power applications, where latency is a secondary consideration (FIGURE 5).

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Building arithmetic circuits on top of CMOS

Spintronic majority gates could revolutionize circuit design. They will completely change the paradigm – both at device and circuit level – in how to approach scaling. In the future, more experimental work is planned to learn about the new materials required, to validate circuit assessment, and to finally demonstrate functional devices.

Once these technologies have become more mature, we can start thinking of multi-device architectures that combine CMOS-based and spin logic devices. An interesting approach is to stack, on top of CMOS technology, arithmetic circuits made of spintronic majority gates. The high-performance functions could be executed by the CMOS-based devices and the ultralow-power functions by the spin logic arithmetic circuits. So, rather than replacing Si CMOS based transistors in the future, this beyond-CMOS technology is intended to enhance and complement the functionality of CMOS-based devices.

Spintronics belongs to the beyond-CMOS segment, where we look into new materials and device architectures, and even into new computing paradigms and circuits. Beyond-CMOS research is part of imec’s multiple roadmap scenario that is built around 3 pillars: Si extension, beyond Si and beyond CMOS. Each of these segments has its own mission and approach to enabling scaling. And each of the new technologies will bring in enabling modules and devices that will serve the application diversity in the new era of electronics: the internet of things. And the results will support the quest of the semiconductor industry to find solutions that enable continual functional scaling of cost and energy per bit by departing from the familiar CMOS scaling.

Suggested additional reading

1. Spintronic majority gates, I. P. Radu et al., IEDM 2015 (https://www.researchgate.net/publication/286882975_ Spintronic_Majority_Gates)

2. Design and benchmarking of hybrid CMOS-spin wave device circuits compared to 10nm CMOS, O. Zografos et al., Proceedings of the 15th International IEEE Conference on Nanotechnology (NANO), 2015(http://infoscience.epfl.ch/ record/211004)

3. “With our multiple roadmap scenario, we anticipate the appli- cation diversity in the new Era of Electronics”, imec annual overview 2015, vision by Aaron Thean (click on the name of Aaron at http://magazine.imec.be/data/80/reader/reader. html?t=1452505511353#!preferred/1/package/80/pub/86/ page/8)

IULIANA RADU is a program manager and AARON THEAN is the Vice President of Process Technologies and the Director of the Logic Devices Research at imec, Leuven, Belgium.

With consumers becoming increasingly comfortable using smartphones and tablet PCs, touch screens are now increasingly making their way into their vehicles, too. In fact, the automotive touch panel market is expected to expand from 28 million units shipped in 2013 to 86 million in 2021, according to IHS Inc. (NYSE: IHS), a global source of critical information and insight.

“Projected capacitive touch technology is commonly found in consumer smartphones and tablets, which consumers have grown very comfortable using,” said Shoko Oi, senior display analyst at IHS Technology. “Although there are concerns about how direct touch operations could affect safety while driving, automotive touch panels are becoming a standard feature in new vehicles coming to market.”

The content shown on automotive displays now comes from a variety of sources, both inside and outside the car. Many of these applications require touch panels, which shift the role of the display from simply revealing information visually to becoming an actual human-machine interface. This shift, along with the increased volume and importance of displayed data, is leading to a growing need for easy-to-see designs that incorporate larger sizes, irregular or curved shapes and higher resolutions.

Technological evolution hits automakers

Automotive touch panels are shifting from resistive-touch to capacitive-touch technology, and capacitive touch screens are forecast to exceed resistive touch-screens in vehicles in 2017, according to the IHS Automotive Touch Panel Market Report. As vehicle models are updated, the resistive touch screens that formerly dominated the automotive industry are quickly being replaced by capacitive touch screens.

“In spite of higher module costs, projected capacitive technology is replacing resistive technology as the mainstream touch solution for automotive monitors,” Oi said. “The latest trends in connected cars and telematics encourage car makers to adopt projected capacitive touch screens, because they provide a similar user experience to smartphone and tablet-PC touch displays.”

The IHS Automotive Touch Panel Market Report analyzes all aspects of current touch technologies, plus those being considered for future automotive applications. It includes market historical and forecast analyses by technology, sensor type, size, maker, and price.

This article originally appeared on EECatalog.com.

Are the power solutions the IoT needs arriving quickly enough?

The massive game-changing potential of the Internet of Things (IoT) connected devices has been limited by a lack of effective power solutions. The solid-state thin film battery market is forecasted to reach $1.3 bil­lion worldwide by 2021 as published by Custom Market Insights. Fueling this growth is the rise of IoT—wear­ables, medical devices and sensors. Traditional battery technologies simply cannot provide the new features and designs that these new applications demand.

However, arriving on the market are thin-film, flexible batteries which are ultra-thin, flexible, rollable, stretch­able and can withstand high temperatures.

Many applications are still emerging, and their require­ments are evolving fast. Because target specs are also very diverse, each with unique requirements for power, thinness, cost, safety, shelf life, reliability, and flex­ibility, a customized power source makes sense.

BrightVolt is one company tackling the demand for small powered solutions.

Figure 1: Traditional battery technologies are giving way to new designs, which can reduce design complexity. (Courtesy BrightVolt)

Low power/long battery life—As IoT infrastructure becomes ubiquitous, many use-cases require designing and building low power and small form factor batteries, both primary and rechargeable. BrightVolt’s Flexion™ batteries have 3.0V, multiple capacity options such as 10, 14, 20, 25mAh and varied tab con­figurations such as extended tab, terminal support, terminal support with ACF. They also have attachment options such as ultrasonic welding, soldering, conductive epoxy and conductive film and a shelf life of 3-5+ years.

Customized—Battery designs are available that are as thin as 0.37mm. For example, BrightVolt Flexion batteries were designed to operate continuously over a wide temperature range (-10 ºC to +60 ºC). They utilize a patented solid polymer electrolyte and contain no volatile liquids or gelling agents. Self-connecting battery terminals using anisotropic conductive film. BrightVolt can custom-build the size, shape, power, capacity, tab configurations and attachment options that are needed for these diverse requirements.

Scalable Manufacturing—BrightVolt has already shipped millions of units. Scalability is our key differentiator. We can take a solution from prototype to full production and anything in between. Our enduring quality, durability, and built-in intelligence is what makes us the best choice for custom product designs.

Safe—It is now possible to find batteries that are non-toxic, non-corrosive and environ­mentally friendly. It’s also important to choose an Inherently safe design that reduces the need for additional battery safety circuitry. Polymer matrix electrolyte provides outstanding thermal stability with no volatile liquids or gels.

Medical Miracles and Thin Batteries

Nanotechnology itself dates back to the 1980s, when U.S. engineer Eric Drexler coined it. Today, nanotechnology and tiny batteries are changing the medical device industry.

Applicable medical uses include the ability to use small form batteries to power the circuitry associated wit skin-based monitoring devices that can detect the glucose levels, for example. Trans­dermal drug delivery and patches could change how injectable drugs are delivered in a more effective time-released manner through a battery-powered patch.

Additionally, the combination of a nanosensor used in conjunction with a smartphone could be used to track auto­immune diseases and cancer. It could also be an effective screening tool for rejection in patients with organ transplants.

Sensors, Smart Packaging and the IoT

It is anticipated that the temperature monitoring market will reach over $3.2 billion by 2020. Smart sensor labels answer the needs for numerous indus­tries, particularly perishable goods. These printed electronics devices and labeling enable the IoT to reduce waste and improve consumer safety.

This technology allows pharmaceutical companies to keep temperature-sensitive products safe and effective, while pre­venting the unnecessary ruin of usable products. Retailers who use temperature-monitoring labels during shipment of produce and other food products as well as cosmetics and off-the-shelf healthcare items will have immediate insight with regards to both shelf life and food safety.

Some of the most ubiquitous wearables are fitness trackers like FitBit and Jaw­bone that hit the market like wildfire in 2013. 1 in 5 Americans today wear this technology to track their activity levels, sleep and more. Wearables will continue to evolve in size, usability, form factors and diverse power needs.

Assisted living and eldercare is another compelling and demanding wearable technology market. Wearable sensors for this market pose massive potential in generating big data for IoT, with a great applicability to biomedicine and ‘ambient assisted living’ (AAL). ‘Ambient intelligence’ in eldercare is being sensi­tive and responsive to the presence of people. Recent advancements in several technological areas have helped the vision of AAL to become a reality. These tech­nologies include of course smart homes, assistive robotics, and, in small form: e-textile, mobile and wearable sensors.

Another significant advancement is detecting common medical issues such as sleep apnea, which used to require an uncomfortable in-clinic sleep study. No more. Today, a patient can wear a device overnight in the privacy of their own home and send the results off to their physician. Other exciting uses include trackers in clothing, interactive toys, games and more.

Embedding Security

Target’s $10 million 2013 class action data breach lawsuit and privacy issue hammered home just how devastating security fraud really is. Since that time, many credit cards are now embedded with an EMV chip but there’s an even better solution emerging. Not only will a small form battery the size of a postage stamp power these new cards, a com­puter chip randomizes the code number about every hour, adding to its security. This renders the card useless to anyone who has written down your card number, expiration date and code. This applica­tion will effectively eliminate ‘card not present’ fraud. Other ultra-thin battery uses in a credit card could allow for a tiny screen on your card itself that displays your balance.

When Apple launched its biometric ID fingerprint reader on its iPhone 5S, many people adjusted quickly to the convenience of the fingerprint password. Building on that same technology, travel documents including drivers’ licenses and passports, as well as vital health information, can be included in one ultra-thin battery-powered, pocket-sized card that fits in your wallet.

Conclusion

By assessing the considerations outlined in this article, a product designer can effectively achieve a small-form factor product able to reliably operate with the right battery. Custom batteries can eliminate design complexities and opti­mize battery use for many applications.

About the Author

Venetia Espinoza is in charge of market­ing at BrightVolt, a worldwide leader in the design, development and scale manufacturing of thin film batteries. She holds more than 25 years of marketing and product experience with premier technology companies. She also served as Vice President and General Manager of Softcard, a joint venture established by industry giants Verizon, AT&T and T-Mobile. She holds an MBA and BS de­gree in Industrial Engineering.

As the mobile phone market slows, display manufacturers are looking to new in-cell and on-cell touch-screen solutions that offer consumers thinner and brighter displays, while shortening the supply chain for smartphone manufacturers. As panel makers promote these new solutions, and offer aggressive pricing as well, in-cell and on-cell touch solutions are expected to comprise half of all smartphone displays shipped in 2017, according to IHS Inc. (NYSE: IHS), a global source of critical information and insight.

With the advent of active-matrix organic light-emitting diode (AMOLED) used in smartphones, new touch solutions are emerging that boast greater flexibility, lighter weight and other feature improvements. Emerging touch solutions for flexible displays are expected to grow more than 50 percent in 2016 compared to the previous year, which will bolster revenue levels, according to the latest IHS Touch Panel Market Tracker.

“Since Samsung announced their Galaxy S6 Edge smartphone last year, flexible displays have grabbed consumer and industry attention,” said Calvin Hsieh, director of display research for IHS Technology. “Flexible AMOLED displays offer many more features than traditional rigid AMOLED and LCD displays, which is an attractive proposition for device makers and consumers.”

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ams AG (SIX: AMS) today took a step forward in its long-term strategy of increasing manufacturing capacity for its high-performance sensors and sensor solution integrated circuits (ICs), holding a groundbreaking event at the site of its new wafer fabrication plant in Utica, New York.

An artist’s rendering of a semiconductor fab at the Marcy site.

The ceremony featured New York Lieutenant Governor Kathy Hochul, Utica Mayor Robert Palmieri, local dignitaries and senior executives from ams and SUNY Polytechnic Institute.

ams sensor solutions are relied upon globally by manufacturers of smartphones, tablets and other communications devices, automakers, audio and medical equipment manufacturers and others. ams sensors are used in hundreds of millions of devices to recognize light, color, gestures, images, motion, position, environmental and medical parameters and more.

With construction work now underway on the new fab, ams remains on track to reach its target for the first batches of wafers made at the plant in the first half of 2018.

Production capacity at the Utica fab will supplement ams’ existing 180nm and 350nm CMOS and SiGe fab at its headquarters near Graz, Austria. Adding this additional volume to its in-house chip manufacturing facilities positions ams to meet the forecasted growth in demand for its high-performance sensor solution ICs.

New York Governor Andrew Cuomo has made public-private partnerships an important part of this  Nano Utica initiative, which exceeds 4,000 projected jobs over the next decade. Designed to replicate the dramatic success of SUNY Poly’s Nanotech Megaplex in Albany, NANO Utica further cements New York’s international recognition as the preeminent hub for 21st century nanotechnology innovation, education, and economic development.

The Governor says the addition of ams and others to Nano Utica is creating an economic revolution around nano-technology in the Mohawk Valley region, and that the economy there is “gathering momentum unlike ever before.”

The new fab, which is being built to ams’s specifications and which ams will operate under a 20-year lease, is expected initially to offer capacity of at least 150,000 200mm-wafer equivalents per year. Planned expansion thereafter will eventually see the plant operating at a capacity of more than 450,000 200mm-wafer equivalents per year.

The new fab is located close to a campus of SUNY Polytechnic Institute in New York’s Tech Valley, the largest region focused on technology manufacturing in the US and home to other nanotechnology and semiconductor companies. The fab will be capable of producing wafers at the 130nm node, and more advanced nodes in the future.

Today’s celebratory event at the new fab site also marked the success of the partnership behind the project to build, equip and operate another high-technology manufacturing facility in the State of New York. This partnership has benefited from a wide-ranging collaboration between public sector bodies such as the New York governor’s office, the City of Utica and the State University of New York, and various private sector institutions including ams, the fab’s sole leaseholder.

Approximately 250 people gathered at the construction site to see Lt. Governor Hochul and ams CEO Alexander Everke break ground for the foundation of what will be, on completion in 2018, one of the world’s largest analog wafer fabs.

“Building this new wafer fab enables ams to achieve its plans for growth and to meet the increasing demand for sensor solutions produced at advanced manufacturing nodes. Our decision to locate the facility in New York was motivated by the availability of a highly skilled workforce, the proximity to prestigious educational and research institutions, and the favorable business environment, backed by public and private partners,” Mr. Everke said. “What we will create together in Utica will be the most productive ‘More than Moore’ fab worldwide,” he added.

Whether it’s the Internet of Things (IoT), wearables, or industrial automation, new devices and applications are portable, battery-operated and require continuous power.  Wireless connectivity is required for connecting to the Internet.  Today’s devices collect and transmit data from sensors, are always or almost always on and require power.  The semiconductor industry has met the challenge to design devices for low power operation.  But eventually batteries still run out of energy and have to be replaced or recharged.  Energy harvesting can extend battery life or possibly replace batteries altogether for continuous operation.  The new Semico Research report “Energy Harvesting: The Next Billion Dollar Market for Semiconductors” projects semiconductor sales for this market will reach $3 billion by 2020.

An energy harvesting solution requires more than just the energy harvester or transducer.  The key components include a power converter, power management IC (PMIC), MCU, and energy storage.  “An ecosystem of semiconductor vendors is emerging for the nascent energy harvesting market,” says Tony Massimini, Semico Research’s Chief of Technology.  “The ecosystems are gravitating around the vendors of key power components.  They are forming partnerships with producers of energy harvesters, battery suppliers, and other components.”

This study examines the market opportunity for energy harvesting outside of large installations and commercial power generation.  A broad range of markets will employ energy harvesting to either replace batteries or extend battery life. These applications cover wireless sensor nodes (WSN) for bridges, infrastructure, building automation and controls, and home automation (including lighting, security and environmental). Energy harvesting will grow in automotive applications, cell phones, wearables and other consumer electronics.

“The vendors of MCUs, sensors, RF, analog and other components will continue to develop lower power devices”, according to Massimini. “While this puts less drain on a battery and will extend its life, it also lessens the load for an energy harvesting solution.  Energy harvesting solutions are also expected to improve during the forecast period.”

The ASPs for the semiconductor components continue to decline, lowering the costs for an energy harvesting solution.  This is driving higher penetration rates.

Key findings of the report include:

  • The number of energy harvesting solutions will grow to 777 million units by 2020 (CAGR ’15 to ’20 = 80.6%).
  • Smartphone market will become the largest by volume by 2020.
  • WSN in commercial and industrial applications, including bridges, will be the second largest market by 2020
  • Semiconductor revenues in Energy Harvesting will reach $3 billion by 2020(CAGR ’15 to ’20 = 71.4%).

In its recent report “Energy Harvesting: The Next Billion Dollar Marketfor Semiconductors” (MP112-16), presents the market for energy harvesting by key end use markets and the semiconductor content.  Readers will see which market segment is growing fastest and which semiconductor components account for sales potential.  The report discusses the latest trends in energy harvesting, the growing ecosystem, and technical innovations.  Included are profiles of silicon vendors involved with energy harvesting and other key vendors in the ecosystem. The report is 70 pages long and includes 11 tables and 24 figures.

Companies cited in the report: Analog Devices, Atmel, Audience, Cherry Switches, Cymbet, Cypress, enOcean, Linear Technology, Maxim Integrated, Microchip Technology, NXP, Powercast, Renesas, Semtech, Silicon Labs, Silicon Reef, STmicroelectronics, Texas Instruments, Imprint Energy, Sakti3, Solid Power, Apple, Laird, MicroGen, Micropelt, Thermo Life, Thermogen Technologies, Sanyo, EnerBee, Energy Harvesters, K3OPS, Nikola Labs and Imec.

This report is part of Semico Research’s IoT and MEMS portfolios, which also include:

The Smart Economy: The Internet of Everything

IoT Security: At What Cost?

Sensors in Wearables and Mobile: The Many Players

The Smart Home: Big Brother or Swarm Intelligence?

IC Insights’ March Update to the 2016 McClean Report refreshed the forecasts for 33 major IC product categories through 2020.  The complete list of all 33 major IC product categories ranked by the updated forecast growth rates for 2016 is shown in Figure 1.  Fourteen product categories—topped by Cellphone Application Processors and Signal Conversion (analog) devices—are expected to exceed the 2% growth rate forecast for the total IC market this year. Another five product categories are expected to grow at the same 2% rate as the total IC market.  The total number of IC categories forecast to register sales growth in 2016 increases to 20 products from only nine in 2015.

Growth of Cellphone Application MPUs (10%) is forecast to remain near the top on the growth list for a fifth consecutive year. Though the rate of growth for cellphone application MPUs has cooled in recent years, IC Insights still forecasts a solid 10% growth year for this market as smartphone shipments remain an attractive end-use application for IC markets.  Signal Conversion (DAC analog, etc.) devices are also expected to show a 10% increase in 2016 thanks to their implementation across a wide variety of consumer, communication, and computing devices, and in other systems to monitor and control the interface between analog and digital signals.   The market for 32-bit MCUs is forecast to increase 8% with “intelligent” cars the catalyst for much of this growth.  Driver information systems and many of the increasing number of semi-autonomous driving features such as self-parking, advanced cruise control, and collision-avoidance rely on 32-bit MCUs. Complex 32-bit MCUs are expected to account for over 25% of the processing power in vehicles in the next few years.

Other notable categories include the previously high-flying Tablet MPU market, which is forecast to sputter to just 2% growth in 2016 as enthusiasm fades for these systems. DRAM is expected to show a steep market decline this year and drop to become the second-largest IC product category (trailing only the standard PC, server MPU market) in 2016.  After registering big gains in 2013 and 2014, the DRAM market fell 3% in 2015 and is forecast to tumble another 8% in 2016 as oversupply and waning desktop and notebook computer demand force suppliers to slash average selling prices to move product.  Worldwide DRAM ASP growth was down 4% in 2015 and is on track to fall 11% in 2016.

2016 forecast of ic market

Figure 1

By David W. Price, Douglas G. Sutherland and Kara L. Sherman

Author’s Note: The Process Watch series explores key concepts about process control—defect inspection and metrology—for the semiconductor industry. Following the previous installments, which explored the 10 fundamental truths of process control, this new series of articles highlights additional trends in process control, including successful implementation strategies and the benefits for IC manufacturing. For this article, we are pleased to include insights from our guest author, Kara Sherman.

As we celebrate Earth Day 2016, we commend the efforts of companies who have found ways to reduce their environmental impact. In the semiconductor industry, fabs have been building Leadership in Energy and Environmental Design (LEED)-certified buildings [1] as part of new fab construction and are working with suppliers to directly reduce the resources used in fabs on a daily basis.

As IC manufacturers look for more creative ways to reduce environmental impact, they are turning to advanced process control solutions to reduce scrap and rework, thereby reducing fab resource consumption. Specifically, fabs are upgrading process control solutions to be more capable and adding additional process control steps; both actions reduce scrap and net resource consumption per good die out (Figure 1).

Figure 1. The basic equation for improving a fab’s environmental performance includes reducing resource use and increasing yield. Capable process control solutions help fabs do both by identifying process issues early thereby reducing scrap and rework.

Figure 1. The basic equation for improving a fab’s environmental performance includes reducing resource use and increasing yield. Capable process control solutions help fabs do both by identifying process issues early thereby reducing scrap and rework.

Improved process control performance

Process control is used to identify manufacturing excursions, providing the data necessary for IC engineers to make production wafer dispositioning decisions and to take the corrective actions required to fix process issues.

For example, if after-develop inspection (ADI) data indicate a high number of bridging defects on patterned wafers following a lithography patterning step, the lithography engineer can take several corrective actions. In addition to sending the affected wafers back through the litho cell for rework, the engineer will stop production through the litho cell to fix the underlying process issue causing the yield-critical bridging defects. This quick corrective action limits the amount of material impacted and potentially scrapped.

To be effective, however, the quality of the process control measurement is critical. If an inspection or metrology tool has a lower capture rate or higher total measurement uncertainty (TMU), it can erroneously flag an excursion (false alarm), sending wafers for unnecessary rework, causing additional consumption of energy and chemicals and production of additional waste. Alternatively, if the measurement fails to identify a true process excursion, the yield of the product is negatively impacted and more dies are scrapped—again, resulting in less desirable environmental performance.

The example shown in Figure 2 examines the environmental impact of the process control data produced by two different metrology tools in the lithography cell. By implementing a higher quality metrology tool, the quality of the process control data is improved and the lithography engineers are able to make better process decisions resulting in a 0.1 percent reduction in unnecessary rework in the litho cell. This reduced rework results in a savings of approximately 0.5 million kWh of power and 2.4 million liters of water for a 100k WSPM fab—and a proportional percentage reduction in the amount of resist and clean chemicals consumed.

Figure 2. Higher quality process control tools produce better process control data within the lithography cell, enabling a 0.1 percent reduction in unnecessary rework that results in better environmental performance.

Figure 2. Higher quality process control tools produce better process control data within the lithography cell, enabling a 0.1 percent reduction in unnecessary rework that results in better environmental performance.

As a result of obtaining increased yield and reduced scrap, many fabs have upgraded the capability of their process control systems. To drive further improvements in environmental performance, fabs can benefit from utilizing the data generated by these capable process control systems in new ways.

Traditionally, the data generated by metrology systems have been utilized in feedback loops. For example, advanced overlay metrology systems identify patterning errors and feed information back to the lithography module and scanner to improve the patterning of future lots. These feedback loops have been developed and optimized for many design nodes. However, it can also be useful to feed forward (Figure 3) the metrology data to one or more of the upcoming processing steps [2]. By adjusting the processing system to account for known variations of an upcoming lot, errors that could result in wafer scrap are reduced.

For example, patterned wafer geometry measurement systems can measure wafer shape after processes such as etch and CMP and the resulting data can be fed back to help improve these processes. But the resulting wafer shape data can also be fed forward to the scanner to improve patterning [3-5]. Likewise, reticle registration metrology data can be used to monitor the outgoing quality of reticles from the mask shop, but it can also be fed forward to the scanner to help reduce reticle-related sources of patterning errors. Utilizing an intelligent combination of feedforward and feedback control loops, in conjunction with fab-wide, comprehensive metrology measurements, can help fabs reduce variation and ultimately obtain better processing results, helping reduce rework and scrap.

Fig 3

Figure 3. Multiple data loops to help optimize fab-wide processes. Existing feedback loops (blue) have existed for several design nodes and detect and compensate for process variations. New, optimized feedback loops (green) provide earlier detection of process changes. Innovative feed forward loops (orange) utilize metrology systems to measure variations at the source, then feed that data forward to subsequent process steps.

Earlier excursion detection reduces waste

Fabs are also reducing process excursions by adding process control steps. Figure 4 shows two examples of deploying an inspection tool in a production fab. In the first case (left), inspection points are set such that a lot is inspected at the beginning and end of a module, with four process steps in between. If a process excursion that results in yield loss occurs immediately after the first inspection, the wafers will undergo multiple processing steps, and many lots will be mis-processed before the excursion is detected. In the second case (right), inspection points are set with just two process steps in between. The process excursion occurring after the first inspection point is detected two days sooner, resulting in much faster time-to-corrective action and significantly less yield loss and material wasted.

Furthermore, in Case 1, the process tools at four process steps must be taken off-line; in Case 2, only half as many process tools must be taken offline. This two-day delta in detection of a process excursion in a 100k WSPM fab with a 10 percent yield impact results in a savings of approximately 0.3 million kWh of power, 3.7K liters of water and 3500 kg of waste. While these environmental benefits were obtained by sampling more process steps, earlier excursion detection and improved environmental performance can also be obtained by sampling more sites on the wafer, sampling more wafers per lot, or sampling more lots. When a careful analysis of the risks and associated costs of yield loss is balanced with the costs of additional sampling, an optimal sampling strategy has been attained [6-7].

Figure 4. Adding an additional inspection point to the line will reduce the material at risk should an excursion occur after the first process step.

Figure 4. Adding an additional inspection point to the line will reduce the material at risk should an excursion occur after the first process step.

Conclusion

As semiconductor manufacturers focus more on their environmental performance, yield management serves as a critical tool to help reduce a fab’s environmental impact. Fabs can obtain several environmental benefits by implementing higher quality process control tools, combinations of feedback and feedforward control loops, optimal process control sampling, and faster cycles of learning. A comprehensive process control solution not only helps IC manufacturers improve yield, but also reduces scrap and rework, reducing the fab’s overall impact on the environment.

References

  1. Examples:
    1. https://newsroom.intel.com/news-releases/intels-arizona-campus-takes-the-leed/
    2. http://www.tsmc.com/english/csr/green_building.htm
    3. http://www.ti.com/corp/docs/manufacturing/RFABfactsheet.pdf
    4. http://www.globalfoundries.com/about/vision-mission-values/responsibility/environmental-sustainability-employee-health-and-safety
  1. Moyer, “Feed It Forward (And Back),” Electronic Engineering Journal, September 2014. http://www.eejournal.com/archives/articles/20140915-klat5d/
  2. Lee et al, “Improvement of Depth of Focus Control using Wafer Geometry,” Proc. of SPIE, Vol. 9424, 942428, 2015.
  3. Tran et al, “Process Induced Wafer Geometry Impact on Center and Edge Lithography Performance for Sub 2X nm Nodes,” 26th Annual SEMI Advanced Semiconductor Manufacturing Conference, 2015.
  4. Morgenfeld et al, “Monitoring process-induced focus errors using high resolution flatness metrology,” 26th Annual SEMI Advanced Semiconductor Manufacturing Conference, 2015.
  5. Process Watch: Sampling Matters,” Semiconductor Manufacturing and Design, September 2014.
  6. Process Watch: Fab Managers Don’t Like Surprises,” Solid State Technology, December 2014.
  7. Reducing Environmental Impact with Yield Management,” Chip Design, July 2012.

About the Authors:

Dr. David W. Price, Dr. Douglas Sutherland, and Ms. Kara L. Sherman are Senior Director, Principal Scientist, and Director, respectively, at KLA-Tencor Corp. Over the last 10 years, this team has worked directly with more than 50 semiconductor IC manufacturers to help them optimize their overall inspection strategy to achieve the lowest total cost. This series of articles attempts to summarize some of the universal lessons they have observed through these engagements

By Paul Trio (SEMI); Dalia Vernikovsky (Applied Seals NA)

Evolving Industry Priorities

As the microelectronics industry becomes more mature and products become more advanced, there is greater emphasis on improving process control deeper within the supply chain. Whereas much of the attention has historically been at the fab as well as on equipment and materials, the spotlight is now focused on components and subcomponents.

As the industry prepares for 7nm and beyond, there is a realization that high-volume manufacturing at these advanced process nodes will be gated by equipment parts performance. With device manufacturers refining advanced process recipes pushing equipment, components, and subcomponents to the fringes of their performance envelopes, control is paramount. Industry standards will be as important in providing consistent parameters to enable users to compare similar parts and assess performance differences.

The Seal Situation

The subcomponent industry challenge outlined above certainly rings true for elastomeric seals. “Seals were invented near the end of the 19th century and the disturbing fact is that their manufacturing, material composition, and overall position in the vast industry is industrial in nature,” said Dalia Vernikovsky (Applied Seals North America), SCIS co-chair,  “Unless this industry comes together to forge guidelines or standards that correlate to SEMI’s stringent applications, and we bring the awareness that seal language still correlates to the mechanical make-up (thus the metal adders and constituents of things such as magnesium ferrous oxides), not the cleanliness specifications required, 7nm manufacturing will see defects traced to those components long after they are incorporated.”

Sealed with a Standard

With a myriad of applications and a variety of options, it is often difficult for users to select appropriate sealing materials. This problem is further compounded when O-ring suppliers use different criteria for quantifying O-ring performance coupled with inconsistent parameters and test methods. Control is key: making the right choice is essential for improving equipment uptime and reducing operational costs.

SEMI F51, Guide for Elastometric Sealing Technology, has been in publication since early 2000. This Document is a basic guide for the use of seals in semiconductor fabrication equipment. However, in order to meet the latest customer requirements, the standard needed an overhaul.

In 2014, the F51 Revision Task Force, under the North America Facilities Technical Committee Chapter was chartered to bring the standard to current industry specs. After a few ballot attempts, the task force’s 5080B proposal passed technical committee review at SEMICON West 2015 (July). By fall, the 5080B Ratification Ballot met the required acceptance conditions as well as clearing the necessary procedural reviews by the ISC Subcommittee on Audits & Reviews. The latest version of SEMI F51was published in November 2015 is now available for purchase from SEMI. It defines the criteria by which sealing performance can be judged in comparable measurements and seal materials can be chosen.

Behind the Scenes: A SEMI Special Interest Group

Determining how the SEMI F51 Standard would be revised didn’t happen overnight. Even before the F51 Revision Task Force was chartered, another SEMI group architected the characterization of seals parameters required at these advanced process nodes.

The Seals Group first identified seal performance criteria in several applications or process areas. The performance criteria was mainly divided into two groups: sealing requirements (e.g., etch rate, sealing force retention) and impurities (e.g., leachable, ash, outgassing, total organic carbon [TOC] testing). Process areas included: wet etch, etch, CVD/PVD, diffusion, and sub-fab.

Once the parameters were identified, the group prioritized which characteristics it needed to focus on. These included TOC, surface extractable metal contamination, and ash metal analysis. The Seals Group then developed test methodologies for measuring each performance. If test methods or standards already existed, the group simply referenced them.

Relative Importance of Seal Performance Criteria in Several Applications/Process Areas (1 – most important, 5 – least important) Figure 1

The Seals Group is part of a SEMI Special Interest Group (SIG) focused on Semiconductor Components, Instruments, and Subsystems (SCIS)SEMI SIGs provide a forum that fosters discussion and aligns stakeholders on industry-critical issues. SCIS represents companies that produce, package and/or distribute any of the following used in semiconductor or related industries:

  • Components such as seals, filters, mass flow controllers, valves, sensors, ion beam sources, etc.
  • Instruments for in-line and off-line data measurement, collection, and monitoring
  • Sub-systems that support process tools such as vacuum, robotics, power conversion, abatement, chillers, etc.

SCIS participation encompass Subcomponent-OEM-IDM stakeholders, including: Applied Seals NA; ASM; Brooks Automation; Busch Vacuum; Ebara; Edwards Vacuum; Entegris; Festo; GLOBALFOUNDRIES; Greene, Tweed; Horiba; Intel; KLA-Tencor; Lam Research; Pall; Parker; SMC; Swagelok; Texas Instruments; UltraClean Technology; VAT Valve.

SEMI SCIS SIG – Addressing Defectivity Problems in HVM

With defect and traceability playing a critical role in enabling high-volume manufacturing, SCIS is currently structured to focus on these problem areas. It aims to establish a framework that will enable industry partners to define:

  • Measurable defects for different components specific to intended process applications
  • Standardized test methods to measure the defects
  • Consistent methods for reporting the results

“Increased collaboration is required to establish new industry standards and parameters associated with semiconductor process control to meet the ever increasing yield, variability, and reliability challenges that comes with continued technology scaling,” said Gary Patton, CTO and SVP of WW R&D at GLOBALFOUNDRIES. “The SEMI SCIS group is playing a very crucial role in driving alignment between semiconductor manufacturers and equipment and sub-component suppliers on successful standards for sub-component defectivity and traceability needed for future technology nodes.”

The Seals Group is just one of four subteams under SCIS focused on defectivity. Subteams are established in the following areas:

  • Valves, Seals, and Pumps
  • Liquid and Gas Delivery
  • Critical Chamber Components and RF
  • Automation

As of this writing, each SCIS subteam has identified at least one process-critical component considered to be a primary contributor to defects:

Scope of Defectivity Components Figure 2

The subteams are now focusing on establishing a standard system of comparable metrics which will be used to rate, compare, and classify each of these identified components. This process is dictated by the following template:

SCIS Defectivity Template Figure 3

The Seals Group is not resting on its laurels with the latest revision to SEMI F51. The Seals team is now working on the next set of parameters including: sealing force retention, etch rate (range), permeation, and particles (size and range).

Visibility with Traceability

SCIS is also addressing the need for improved component parts traceability that will enable effective problem diagnosis and faster resolution.

Consider this rather common scenario: Fab yield excursion is traced to a batch of custom machined parts manufactured by Supplier A on a pump supplied by Supplier B on a process tool manufactured by Supplier C.  Fab engineer requests Supplier C to provide a list of all affected systems and spares to enable global containment planWithout a standardized traceability process in place, the list takes a week to compile, introducing delays to the corrective action. 

The Traceability Verification Subteam under SCIS is chartered to implement an industry standard parts traceability process that will:

  • Define standardized formats and protocols
  • Facilitate communication among suppliers, OEMs, and IDMs.
  • Enable efficient problem diagnosis and resolution

“The Traceable Verification Model ensures Key Characteristics are controlled with compliance information easily accessed via a cloud based application. Intellectual property is secured via pre-approved access levels. The model holds all suppliers accountable but also ensures proprietary information is not compromised.” said Lance Dyrdahl (Lam Research), Defect Traceability Subteam leader.

Full Circle Engagement

As with the F51 seals activity, output from these SCIS Subteams will feed in to the various committees and task forces under the SEMI International Standards Program. As these Standards are used by the industry, new requirements will emerge and it will be up to SEMI Members to address them.

“Components standards should be effectively linked to the field performance for all-around benefits to component makers, OEMs and IDMs. The committee deliverables are structured to allow competitors to work together in driving commonality. Standardization and normalization methodology will provide IP-free participation.” said Ya-hong Neirynck (Intel), SCIS RF subteam co-leader. Lance Dyrdahl further pointed out, “Speedy ratification occurs when all participants agree on self-evident non-proprietary methods.”

The demands of the next-generation high-volume manufacturing will no doubt require a concerted effort among device manufacturers, OEMs, and suppliers. Diverse stakeholder participation is critical in solving these problems proactively. Failure to do so will certainly result in greater challenges (and pain) that will be shared by all.  “A piece of equipment or process line is only as strong as its weakest component,” said Sanchali Bhattacharjee (Intel), SCIS cochair.

Engaging in these SEMI SCIS initiatives provides a very strong value proposition for IDM-OEM-suppliers alike.

Engaging in SEMI SCIS Benefits All Industry Stakeholders Figure 4

The SEMI SCIS Special Interest Group is open to all SEMI Members. There will be an SCIS face-to-face meeting in conjunction with the SEMI Advanced Semiconductor Manufacturing Conference (ASMC) – May 16-19, 2016 – in Saratoga Springs, New York. Conference attendees are welcome to attend this face-to-face meeting. Future face-to-face meeting are also scheduled for SEMICON West 2016 (July) as well as the SEMI Strategic Materials Conference (SMC) in September. SCIS subteams meet via teleconference in between these face-to-face meetings. For more information or to join the SCIS SIG, please contact Paul Trio at SEMI ([email protected]).

By Jan Vardaman (TechSearch International) and Dan Tracy (SEMI)

While much of the recent attention has been focused on the growth of wafer level packages (WLPs), specifically fan-out WLPs, this is not the only segment forecast to undergo strong unit growth. In total, IC leadframe shipment growth will trend in the low single-digit range; the growth is entirely attributed to the chip-scale package (CSP) leadframe form factor. Combined, the more traditional IC leadframe segments are expected to experience flat shipments trends, while leadframe CSP shipments continue to growth.

Source: SEMI and TechSearch International, Global Semiconductor Packaging Materials Outlook

Leadframe CSP packages find broad adoption in analog, power, mixed signal, general purpose logic, sensors, and other device applications. A number of leadframe CSPs are in the form of quad flat no-lead (QFN) packages. These packages have pads instead of leads and do not use solder balls.  QFNs are found in mobile phones including smartphones, toys, games, tablets, medical systems, industrial, computers, networking, and automotive products.  Devices packaged in QFNs include many different MEMS and sensors such as accelerometers, gyroscopes, magnetometers, and pressure sensors, and power management devices, controllers, and ASICs.  Stacked die versions are increasingly common.  Gyroscopes and accelerometers are stacked with wire bonds in the QFNs found in many wearable products.  QFNs are also increasingly common as packages for automotive electronics.

This form factor will grow as it delivers a thin, small, and low-cost solution required in many applications. Emerging in the market are coreless structures based on a modified leadframe technology called a Molded Interconnect Solution/System (MIS) that deliver higher I/O and SiP solutions. Advancements are needed to further the high-volume ramp of MIS and other routable-leadframe CSP technologies.

Small package form factors deliver solutions needed in mobile applications and will provide the package technology for many sensor and wearable applications emerging in the market place.

The information in this article is from the Global Semiconductor Packaging Materials Outlook—2015-2019 report produced by SEMI and TechSearch International.