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Worldwide semiconductor manufacturing equipment billings reached US$16.7 billion in the second quarter of 2018, 1 percent lower than the previous record quarter and 19 percent higher than the same quarter a year ago, SEMI, the global industry association representing the electronics manufacturing supply chain, reported today.

The data are gathered jointly with the Semiconductor Equipment Association of Japan (SEAJ) from more than 95 global equipment companies that provide monthly data. The quarterly billings data by region in billions of U.S. dollars, quarter-over-quarter growth and year-over-year rates by region are as follows:
2Q2018
1Q2018
2Q2017
2Q18/1Q18
(Qtr-over-Qtr)
2Q18/2Q17
(Year-over-Year)
Korea
4.86
6.26
4.79
-22%
2%
China
3.79
2.64
2.51
44%
51%
Japan
2.28
2.13
1.55
7%
47%
Taiwan
2.19
2.27
2.76
-4%
-21%
North America
1.47
1.14
1.23
29%
20%
Europe
1.18
1.28
0.66
-7%
80%
Rest of World
0.96
1.27
0.62
-24%
56%
Total
16.74
16.99
14.11
-1%
19%

Source: SEMI (www.semi.org) and SEAJ, September 2018

The Equipment Market Data Subscription (EMDS) from SEMI provides comprehensive market data for the global semiconductor equipment market.

SEMI announced today the October 9 deadline for presenters to submit abstracts for the annual SEMI Advanced Semiconductor Manufacturing Conference(ASMC). ASMC, May 6-9, 2019, in Saratoga Springs, New York, will feature technical presentations of more than 90 peer-reviewed manuscripts covering critical process technologies and fab productivity.

ASMC 2019 will feature keynotes, a panel discussion, networking events, technical sessions on advanced semiconductor manufacturing, and tutorials. The conference will also feature a special student poster session to highlight student projects related to semiconductor manufacturing.

Selected speakers will present to IC manufacturers, equipment manufacturers, materials suppliers, chief technology officers, operations managers, process engineers, product managers and academia. All technical papers will be published by IEEE, and authors also may receive an invitation to publish their papers in a special section for ASMC 2019 to be featured in IEEE Transactions on Semiconductor Manufacturing. Technical abstracts are due October 9, 2018, and can be submitted here. 

ASMC 2019 will cover the following topics:

  • Advanced Equipment Processes and Materials
  • Advanced Metrology
  • Advanced Equipment Processes and Materials
  • Advanced Patterning / Design for Manufacturability
  • Advanced Process Control
  • Contamination Free Manufacturing
  • Big Data Management and Mining
  • Defect Inspection and Reduction
  • Discrete and Power Devices
  • Enabling Technologies and Innovative Devices
  • Equipment Reliability and Productivity Enhancements
  • Factory Automation
  • The Fabless Experience
  • Green Factory
  • Industrial Engineering
  • Lean Manufacturing
  • MOL and Junction Interfaces
  • Smart Manufacturing
  • Yield Enhancement/Learning
  • Yield Methodologies
  • 3D Packaging and Through Silicon Via

ASMC, in its 30th year, continues to fill a critical need for the industry, providing a venue for professionals to network, learn and share knowledge about semiconductor manufacturing best practices.

Details on how to upload abstracts can be found here. To learn more about the conference and the selection process, please contact Margaret Kindling at [email protected] or call 1.202.393.5552.   

Papers co-authored by device manufacturers, equipment or materials suppliers, and/or academic institutions that demonstrate innovative, practical solutions for advancing semiconductor manufacturing are highly encouraged.

ASMC is organized by SEMI Americas to connect more than 2,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics manufacturing

Dr. Gary Patton, Chief Technology Officer and Senior Vice President of Worldwide Research and Development at GLOBALFOUNDRIES, will deliver the opening keynote address at the inaugural GSA Silicon Summit – East, being held Tuesday, October 9 in Saratoga Springs, NY.

The conference is presented by the Saratoga County Prosperity Partnership (Saratoga Partnership), Saratoga County, NY’s economic development agency; the Global Semiconductor Alliance (GSA), a leading voice for the worldwide semiconductor industry; and the Center for Economic Growth (CEG), a regional economic and business development organization.

A well-recognized industry leader in semiconductor technology R&D with over 30 years of semiconductor experience, Gary Patton is responsible for GLOBALFOUNDRIES’ semiconductor technology R&D roadmap, operations and execution. His address will discuss “Market Drivers for Moore and Beyond Moore Semiconductor Technologies.”

“We are delighted that Gary Patton, a distinguished technologist, innovator, visionary and thought leader in the semiconductor industry, will be launching the first GSA Silicon Summit – East with his keynote,” said Shrikant Lohokare, Executive Director and Senior Vice President, GSA. “I can see Gary’s unique insights into technology inflections and emerging market opportunities they enable at the leading edge of Moore’s Law and Beyond setting the tone for a fantastic program and discussions to follow.”

“Gary Patton is the perfect choice to kick off Silicon Summit – East, which focuses the eyes of the semiconductor world squarely on Saratoga County,” said Marty Vanags, President of the Saratoga County Prosperity Partnership. “Gary’s leadership role in enabling GLOBALFOUNDRIES’ position as the world’s most advanced semiconductor manufacturing operation demonstrates his success in driving innovative technology that delivers business results.”

Prior to joining GLOBALFOUNDRIES, Patton was Vice President of IBM’s Semiconductor Research and Development Center, where he was responsible for IBM’s semiconductor R&D and technology development alliances. A Fellow of the IEEE, he received the 2017 IEEE Frederik Philips Award for industry influence and leadership in the development of leading-edge microelectronics technology and collaborative research, and in 2016 was inducted into the VLSI Research Hall of Fame for his contributions to the advancement of the semiconductor industry over several decades.

Additional speakers confirmed at this time include Mukesh Khare, Vice President of the IBM Research Semiconductor Group; Gary Bronner, Deputy CTO and Senior Vice President of Rambus Labs/Rambus; and Huibert Verhoeven, Senior Vice President and General Manager of the IoT Division, Synaptics.  A complete list can be found at https://www.gsaglobal.org/2018sse/meet-the-speakers/.

Registration is now open for Silicon Summit – East at https://www.gsaglobal.org/2018sse/registration/. Complete information about the event, including the program and sponsorship opportunities, can be found at https://www.gsaglobal.org/2018sse/.

GSA Silicon Summit – East is the product of a strategic alliance established last year by the Saratoga Partnership and GSA, which represents more than 400 member companies in 32 countries that combine for over 75 percent of revenue in the $400 billion semiconductor industry. With a theme of “Harnessing Emerging Semiconductor Market Opportunities,” the event is designed to promote partnerships and drive efficiencies that advance semiconductor technology and business, while also informing the regional ecosystem on growth opportunities.

 

Lattice Semiconductor Corporation (NASDAQ: LSCC), a provider of customizable smart connectivity solutions, announced the appointment of Steve Douglass as the Company’s Corporate Vice President, R&D, effective immediately. Mr. Douglass brings extensive experience building and leading global high performing engineering and customer-facing teams that deliver industry-leading IC products and solutions. He has a proven track record of creating and executing business strategies that inspire customer innovation and deliver profitable results. Prior to Lattice, Mr. Douglass was the Corporate Vice President, Customer Technology Deployment at Xilinx, Inc.

Jim Anderson, President and Chief Executive Officer, said, “We are excited to have Steve Douglass join Lattice. His proven ability to lead global FPGA and CPLD teams, and drive customer-focused innovation in targeted applications make him the perfect fit. His technical skills, market knowledge and leadership capabilities will help further strengthen Lattice as we drive sustained growth and profitability by accelerating the worldwide adoption of our ground-breaking hardware and software solutions.”

Mr. Douglass said, “I am excited to be joining Lattice and leading its R&D efforts. Lattice has an excellent programmable product offering built by a talented engineering team. I look forward to the opportunity to further strengthen the portfolio with market driven innovations that will help deliver profitable growth for the Company.”

Steve Douglass brings to the role over 30 years of broad technology experience developing programmable solutions for many markets including wired and wireless communications, industrial, automotive and test and measurement. He is a 20-year Xilinx executive, most recently serving as Corporate Vice President, Customer Technology Deployment and leading the Worldwide Technical Sales and Support team since 2012. Prior to that, he held a wide range of leadership positions, including Vice President and GM, Advanced Products Division, and Vice President of Product Development.

Mr. Douglass was previously at Cypress Semiconductor for 13 years and served in various leadership roles, including Business Unit Director, CPLDs and FPGAs. He began his career as a Circuit Design Engineer at Intel Corporation. He was awarded 23 U.S. and International patents for FPGA and PLD architectures and circuits, and has received numerous industry honors including EDN’s Product of the Year and Innovator of the Year. He holds a Master of Science in Electrical Engineering from Stanford University and Bachelor of Science in Electrical Engineering from Santa Clara University. He also serves on Santa Clara University’s Electrical Engineering Industry Advisory Board.

NXP acquires OmniPHY


September 4, 2018

NXP Semiconductors N.V. (NASDAQ: NXPI), the world’s largest supplier of automotive semiconductors, has acquired OmniPHY, a provider of automotive Ethernet subsystem technology. The company’s expertise includes automotive Ethernet, a technology that enables the rapid data transfer required for autonomous driving. OmniPHY’s advanced high-speed technology, combined with NXP’s leading portfolio and heritage in vehicle networks, uniquely positions NXP to deliver the next-generation of data transfer solutions to carmakers. Financial terms of the transaction are not disclosed.

An automotive networking revolution is underway, driven by the need for higher data capacity and speed to meet the requirements of increasingly autonomous and connected vehicles. New advanced autonomous driving systems will require gigabit data speeds and beyond. Current plans for next-generation vehicles call for eight or more cameras, high definition radar, lidar and V2X capability, all of which generate steep data challenges for current car networks. These requirements, combined with the modern vehicle’s need to offload data to enable the new business opportunities of the connected car, will soon make terabyte levels of data processing commonplace.

“One of the vexing questions of the Autonomous Age is how to move data around the car as fast as possible,” said Ian Riches, executive director in the Strategy Analytics Global Automotive Practice. “Cameras and displays will ramp the number of high-speed links in the car to 150 million by 2020 and by 2030 autonomous car systems will aggressively drive that number to 1.1 billion high-speed links.”

As the self-driving ecosystem works to deliver on emerging automotive data requirements, many have turned to enterprise networking solutions as a stopgap measure for testing. Yet long-term solutions will need to be automotive grade and of a size and weight that make their implementation feasible. NXP’s acquisition of OmniPHY, which has already begun to translate 1000BASE-T1 Ethernet for the automotive space, will give NXP a significant position in this rapidly evolving area.

“Our heritage in vehicle networks is rich and with our leadership positions in CAN, LIN, and FlexRay, we hold a unique viewpoint on automotive networks,” said Alexander E. Tan, vice president and general manager of Automotive Ethernet Solutions, NXP. “The team and technology from OmniPHY give us the missing piece in an extensive high-bandwidth networking portfolio.”

OmniPHY is a pioneer in high-speed automotive Ethernet IP and automotive qualified IP for 100BASE-T1 and 1000BASE-T1 standards. Over its six-year history, it has worked with some of the largest consumer companies in the world and has developed competitive 1st-silicon-right solutions for emerging markets like automotive and industrial Ethernet. OmniPHY interface IP and communication technology along with NXP’s automotive portfolio will form a “one-stop shop” for automotive Ethernet. The companies’ technology synergies will center on 1.25-28Gbps PHY designs and 10-, 100- and 1000BASE-T1 Ethernet in advanced processes.

“We are very excited to join NXP – a leader in automotive electronics, for a front-row seat to the autonomous driving revolution, one that will deliver profound change to the way people live,” said Ritesh Saraf, CEO of OmniPHY. “The combination of our teams and technology will accelerate and advance the delivery of automotive Ethernet solutions providing our customers with high quality and world-class automotive Ethernet innovation.”

Roger Carpenter, a Google hardware engineer with 30 years of experience in electronic design automation and chip design, has been elected to the Silicon Integration Initiative board of directors. Si2 is a research and development joint venture that provides standard interoperability solutions for integrated circuit design tools.

Before joining Google, Carpenter held executive roles at three EDA firms: Magma Design Automation, Javelin Design Automation and Envis. His design experience includes positions at Wave Computing, Broadcom, Chromatic Research and Xilinx. A holder of more than a dozen patents, Carpenter received a Bachelor’s and Master’s of Electrical Engineering and Computer Science from the Massachusetts Institute of Technology.

John Ellis, Si2 president and CEO, said that Google’s membership on the Si2 board reflects the increasing impact of vertical integration in the electronics industry.  “A recent Si2 industry survey showed that over 80 percent of our end users develop some specialized, internal design tools. This proprietary software meets their unique needs and performance requirements,” Ellis said.

“Directly accessing the Si2 OpenAccess data base by making use of our Application Programming Interface, designers and integrators have greater control over their bottom line by optimizing their design flow and, in turn, shortening product time-to-market. It’s critical that system houses like Google, along with their unique semiconductor design software needs, are now represented on the Si2 board.”

The twelve members of the Si2 board represent leading semiconductor manufacturers and foundries, fabless companies, and EDA software providers.

Atlas Copco Group has announced its agreement to acquire the cryogenic business of Brooks Automation, Inc through its wholly owned US entity Edwards Vacuum LLC. Once the deal is complete, which is expected to be in the first quarter of 2019, it will significantly expand Edwards’ offering to the global semiconductor industry.

Brooks Automation, headquartered in Chelmsford, USA is a market leader in the provision of advanced cryopumps and associated products for the semiconductor industry through its CTI-Cryogenics and Polycold brands.

The acquisition includes cryopump operations in Chelmsford, MA and Monterrey, Mexico as well as a worldwide network of sales and service centres. Brooks Automation’s 50% shareholding in Japan-based joint venture company Ulvac Cryogenics Inc is also part of the deal.

The acquired business will become part of the Semiconductor and Semiconductor Service divisions within Atlas Copco’s Vacuum Technique business area and will significantly expand Edwards’ chamber solutions offering to customers in the semiconductor industry.

Paul Rawlings, President of the Semiconductor division, said: “The acquisition of Brooks Automation’s cryogenic business will help us cement our position as a trusted partner to the world’s leading semiconductor OEMs by enabling the expansion of our current chamber solutions offering through the addition of new technologies and products.”  The planned acquisition is subject to regulatory approvals.

Further information about Edwards can be found at www.edwardsvacuum.com

GLOBALFOUNDRIES today announced an important step in its transformation, continuing the trajectory launched with the appointment of Tom Caulfield as CEO earlier this year. In line with the strategic direction Caulfield has articulated, GF is reshaping its technology portfolio to intensify its focus on delivering truly differentiated offerings for clients in high-growth markets.

GF is realigning its leading-edge FinFET roadmap to serve the next wave of clients that will adopt the technology in the coming years. The company will shift development resources to make its 14/12nm FinFET platform more relevant to these clients, delivering a range of innovative IP and features including RF, embedded memory, low power and more. To support this transition, GF is putting its 7nm FinFET program on hold indefinitely and restructuring its research and development teams to support its enhanced portfolio initiatives. This will require a workforce reduction, however a significant number of top technologists will be redeployed on 14/12nm FinFET derivatives and other differentiated offerings.

“Demand for semiconductors has never been higher, and clients are asking us to play an ever-increasing role in enabling tomorrow’s technology innovations,” Caulfield said. “The vast majority of today’s fabless customers are looking to get more value out of each technology generation to leverage the substantial investments required to design into each technology node. Essentially, these nodes are transitioning to design platforms serving multiple waves of applications, giving each node greater longevity. This industry dynamic has resulted in fewer fabless clients designing into the outer limits of Moore’s Law. We are shifting our resources and focus by doubling down on our investments in differentiated technologies across our entire portfolio that are most relevant to our clients in growing market segments.”

In addition, to better leverage GF’s strong heritage and significant investments in ASIC design and IP, the company is establishing its ASIC business as a wholly-owned subsidiary, independent from the foundry business. A relevant ASIC business requires continued access to leading-edge technology. This independent ASIC entity will provide clients with access to alternative foundry options at 7nm and beyond, while allowing the ASIC business to engage with a broader set of clients, especially the growing number of systems companies that need ASIC capabilities and more manufacturing scale than GF can provide alone.

GF is intensifying investment in areas where it has clear differentiation and adds true value for clients, with an emphasis on delivering feature-rich offerings across its portfolio. This includes continued focus on its FDXTM platform, leading RF offerings (including RF SOI and high-performance SiGe), analog/mixed signal, and other technologies designed for a growing number of applications that require low power, real-time connectivity, and on-board intelligence. GF is uniquely positioned to serve this burgeoning market for “connected intelligence,” with strong demand in new areas such as autonomous driving, IoT and the global transition to 5G.

“Lifting the burden of investing at the leading edge will allow GF to make more targeted investments in technologies that really matter to the majority of chip designers in fast-growing markets such as RF, IoT, 5G, industrial and automotive,” said Samuel Wang, research vice president at Gartner. “While the leading edge gets most of the headlines, fewer customers can afford the transition to 7nm and finer geometries.  14nm and above technologies will continue to be the important demand driver for the foundry business for many years to come. There is significant room for innovation on these nodes to fuel the next wave of technology.”

Lattice Semiconductor Corporation (NASDAQ: LSCC), a provider of customizable smart connectivity solutions, announced the appointment of Jim Anderson as the Company’s President and Chief Executive Officer, and to the Company’s Board of Directors, effective September 4, 2018. Mr. Anderson brings broad technology industry experience and a proven track record of leading and transforming businesses to drive sustained growth and profitability. Mr. Anderson joins Lattice from Advanced Micro Devices (AMD) where he served as the General Manager and Senior Vice President of the Computing and Graphics Business Group.

Jeff Richardson, Chairman of the Board, said, “On behalf of the Board, we are pleased to announce the appointment of Jim Anderson as Lattice’s new President and Chief Executive Officer. Jim brings a strong combination of business and technical leadership with a deep understanding of our target end markets and customers. The transformation he drove of AMD’s Computing and Graphics business over the past few years is just a recent example of his long track record of creating significant shareholder value. We are excited to bring Jim’s proven leadership to Lattice as we accelerate all aspects of the company in order to capture the enormous opportunity that lies ahead.” Mr. Richardson added, “The Board would also like to thank Glen Hawk for his leadership and service to Lattice as COO and then as Interim CEO during the Company’s management transition.” Glen has agreed to serve as Special Advisor to the CEO through October 31, 2018, to help ensure a smooth transition before leaving Lattice to pursue other opportunities.

Mr. Anderson said, “I want to thank the Board of Directors for its confidence and the opportunity to lead Lattice as President and CEO, with a focus on driving sustained growth and profitability. Lattice has an impressive history of innovation in programmable solutions. I am excited about the opportunity to help bring that innovation to growing end markets, while deepening partnerships with our customers. Lattice has a compelling combination of ground-breaking hardware and software solutions, global reach, and talented employees that forms a strong foundation for industry leadership and success.”

Jim Anderson brings to the role over 20 years of broad technology industry experience across many markets, including consumer, enterprise/datacenter, and telecom. In his role leading AMD’s Computing and Graphics business group since 2015, Mr. Anderson drove a strategic and operational transformation that brought disruptive new products to the market and delivered market-leading revenue growth and significant profitability expansion for AMD. Prior to AMD, he held a broad range of leadership positions spanning general management, engineering, sales, marketing, and strategy at companies including, Intel, Broadcom Limited (formerly, Avago Technologies), and LSI Corporation.

Mr. Anderson holds an MBA and Master of Science in electrical engineering and computer science from the Massachusetts Institute of Technology, a Master of Science in electrical engineering from Purdue University, and a Bachelor of Science in electrical engineering from the University of Minnesota. Mr. Anderson has received four patents for innovations in computer architecture. He also serves on the Board of Directors of Qylur Intelligent Systems, Inc.

North America-based manufacturers of semiconductor equipment posted $2.36 billion in billings worldwide in July 2018 (three-month average basis), according to the July Equipment Market Data Subscription (EMDS) Billings Report published today by SEMI. The billings figure is 4.9 percent lower than the final June 2018 level of $2.48 billion, and is 4.1 percent higher than the July 2017 billings level of $2.27 billion.

“Global billings declined for the second month in a row, indicative of customer push-outs,” said Ajit Manocha, president and CEO of SEMI. “We expect the industry to weather this soft patch and end the year overall with strong growth.”

The SEMI Billings report uses three-month moving averages of worldwide billings for North American-based semiconductor equipment manufacturers. Billings figures are in millions of U.S. dollars.
Billings
(3-mo. avg.)
Year-Over-Year
February 2018
$2,417.8
22.5%
March 2018
$2,431.8
16.9%
April 2018
$2,689.9
25.9%
May 2018
$2,702.3
8.1%
June 2018 (final)
$2,484.3
8.0%
July 2018 (prelim)
$2,363.1
4.1%

Source: SEMI (www.semi.org), August 2018

SEMI publishes a monthly North American Billings report and issues the Worldwide Semiconductor Equipment Market Statistics (WWSEMS) report in collaboration with the Semiconductor Equipment Association of Japan (SEAJ). The WWSEMS report currently reports billings by 24 equipment segments and by seven end market regions. SEMI also has a long history of tracking semiconductor industry fab investments in detail on a company-by-company and fab-by-fab basis in its World Fab Forecast and SEMI FabView databases. These powerful tools provide access to spending forecasts, capacity ramp, technology transitions, and other information for over 1,000 fabs worldwide. For an overview of available SEMI market data, please visit www.semi.org/en/MarketInfo.