Tag Archives: letter-wafer-business

By Emir Demircan

Joining distinguished speakers from the European Commission, industry, academia and Member States, Laith Altimime, SEMI Europe president, will keynote on “European Competitiveness in the Context of the Global Digital Economy” on 20 November at the European Forum for Electronic Components and Systems (EFECS) in Lisbon, Portugal.

Players across the European electronics manufacturing value chain will gather 20-22 November, 2018, at EFECS to share the industry’s vision and set the future direction of technology innovation. Themed “Our Digital Future,” this year’s forum focuses on how rapid innovation in electronics components and systems-based applications are shaping Europe’s digital future. Start-ups, SMEs, research institutes, academia, large and medium enterprises and public authorities will learn about new collaboration initiatives and the latest developments in European funding instruments while offering their expectations for future funding programmes.

Organized by AENEAS, ARTEMIS-IA, EPoSS, ECSEL Joint Undertaking and the European Commission, in association with EUREKA, EFECS will also highlight the impact and results of various European funding instruments.

For more information about the event, please click here.

Emir Demircan senior manager for advocacy and public policy at SEMI Europe. 

Micron Technology, Inc. today announced the company has joined CERN openlab, a unique public-private partnership, by signing a three-year agreement. Under the agreement, Micron will provide CERN with advanced next-generation memory solutions to further machine learning capabilities for high-energy physics experiments at the laboratory. Micron’s memory solutions that combine neural network capabilities will be tested in the data-acquisition systems of experiments at CERN.

High-energy physics scientists are looking to deploy leading-edge technologies that can support their experiments’ computing and data processing requirements. Memory plays a vital role in accelerating intelligence by processing vast amounts of data, helping researchers gain valuable insights from data generated by high-energy physics experiments.

As part of the work with CERN, Micron will develop and introduce a specially designed Micron memory solution that will be tested by researchers at CERN for use in rapidly combing through the vast amount of data generated by experiments. The project will feature FPGA-based boards with Micron’s most advanced high-performance memory combined with an advanced neural network technology developed in collaboration between Micron and FWDNXT, a provider of deep learning and AI solutions.

“Micron is committed to pushing the limits of innovation by providing high-performance memory and storage solutions to solve the world’s greatest computing and data processing challenges in data analytics and machine learning,” said Steve Pawlowski, vice president of advanced computing solutions at Micron Technology. “We’re proud to work with CERN to deliver machine learning capabilities that will enable high-energy physics scientists to make advances in their science and research experiments.”

“CERN collaborates openly with both the public and private sector, and working with technology partners like Micron helps ensure that members of the research community have access to the advanced computing technologies needed to carry out our groundbreaking work,” said Maria Girone, CTO at CERN openlab. “It is critical to the success of the Large Hadron Collider that we are able to examine the petabytes of data generated in a fast and intelligent manner that enables us to unlock new scientific discoveries. These latest-generation memory solutions from Micron and machine learning solutions from FWDNXT offer significant potential in terms of enabling us to process more data at higher speeds.”

Micron will demonstrate its high-performance memory solutions running FWDNXT’s Machine Learning SDK at SC18, November 12-15, in Dallas, Texas.

Spin Memory, Inc. (Spin Memory), the MRAM developer, today announced a commercial agreement with Applied Materials, Inc. (Applied) to create a comprehensive embedded MRAM solution. The solution brings together Applied’s deposition and etch capabilities with Spin Memory’s MRAM process IP.

Key elements of the offering include Applied innovations in PVD and etch process technology, Spin Memory’s revolutionary Precessional Spin Current™ (PSC™) structure (also known as the Spin Polarizer), and industry-leading perpendicular magnetic tunnel junction (pMTJ) technology from both companies. The solution is designed to allow customers to quickly bring up an embedded MRAM manufacturing module and start producing world-class MRAM-enabled products for both non-volatile (flash-like) and SRAM-replacement applications. Spin Memory intends to make the solution commercially available from 2019.

“In the AI and IoT era, the industry needs high-speed, area-efficient non-volatile memory like never before,” said Tom Sparkman, CEO at Spin Memory. “Through our collaboration with Applied Materials, we will bring the next generation of STT-MRAM to market and address this growing need for alternative memory solutions.”

“Our industry is driving a new wave of computing that will result in billions of sensors and a dramatic increase in data generation,” said Steve Ghanayem, senior vice president of New Markets and Alliances at Applied Materials. “As a result, we are seeing a renaissance in hardware innovation, from materials to systems, and we are excited to be teaming up with Spin Memory to help accelerate the availability of a new memory.”

Semiconductor Research Corporation (SRC), today announced that SK hynix, a global leader in producing semiconductors including DRAM and NAND Flash memory, has signed an agreement to join SRC’s research consortium. SK hynix will participate in multiple SRC research initiatives including; Global Research Collaboration (GRC) and the New Science Team (NST) project.

GRC, a worldwide research program with 17 industrial sponsors is comprised of nine design and process technology disciplines. SK hynix will participate in SRC’s Nanomanufacturing Materials and Processes and Logic & Memory Devices research programs that focus on new device structures, memory alternatives, materials, and processes.

The NST project, a consortium consisting of 12 industrial sponsors and three government agencies is a 5-year, $300 million SRC initiative launched this January. NST consists of two complementary research programs: JUMP (Joint University Microelectronics Program) and nCORE (nanoelectronics Computing Research), which will advance new technologies focused on high- performance, energy-efficient microelectronics for communications, computing and storage needs for 2025 and beyond.

“The entire SRC team joins me in welcoming SK hynix to our distinguished membership of industry leaders from around the world”, said Ken Hansen, President and CEO of SRC. “SK hynix has an impressive history that showcases how ingenuity and innovative thinking can advance technology at a progressive pace. We look forward to a long, successful relationship with SK hynix as we push the limits of imagination and innovation.”

“SK hynix’s fundamental objective to surpass technological boundaries through propelling innovation has brought us to this association with SRC”, said Jinkook Kim, Head of R&D at SK hynix. “We recognize the significant impact that collaborative research programs such as those underway at SRC have in moving our industry forward. Strategic partnerships in research and development will help drive the Fourth Industrial Revolution with AI and autonomous vehicles leading the way.”

Today’s announcement is significant as the top 5 global semiconductor companies are now members of SRC. SK hynix represents the 8th non-U.S. headquartered company to join SRC as it seeks to expand its global presence. Industry sponsors are invited to explore the possibilities at SRC.

Veeco Instruments Inc. (Nasdaq: VECO) and ALLOS Semiconductors GmbH announced today the completion of another phase of their mutual effort to provide the industry with leading GaN-on-Silicon epiwafer technology for microLED production. The purpose of the companies’ most recent collaboration was to demonstrate the reproducibility of ALLOS’ 200 mm GaN-on-Si epiwafer technology on Veeco’s Propel® MOCVD reactor when producing epiwafers for many prominent global consumer electronics companies.

“To bring microLED technology into production, simply presenting champion values for a single metric is insufficient. It is essential to achieve the whole set of specifications for each wafer with excellent repeatability and yield,” said Peo Hansson, Ph.D., senior vice president and general manager of Veeco’s Compound Semiconductor business unit. “This successful joint effort reaffirms the power of combining Veeco’s superior MOCVD expertise with ALLOS’ GaN-on-Silicon epiwafer technology to provide customers a novel, proven and reliable approach to accelerate microLED adoption.”

Sorting and binning are standard methods to achieve wavelength consistency for conventional LEDs. But microLEDs are too small and numerous to be sorted and binned; therefore, the uniformity of the epitaxial deposition is even more critical. The most important success factor for turning the promise of microLED displays into mass production reality is to achieve extremely good emission wavelength uniformity, which eliminates the need to test and sort individual microLED chips. Depending on the application and mass transfer approach, the target requirements of the industry are between +/-1 nm and +/-4 nm bin (min/max) on the epiwafer. Through this collaborative project, Veeco and ALLOS further improved the critical wavelength uniformity with the best wafer having a standard deviation of just 0.85 nm, representing an industry first on a production system.

“Veeco and ALLOS validated wafer-to-wafer reproducibility with an average wavelength standard deviation for all wafers of 1.21 nm and the peak wavelength within a +/- 0.5 nm range. With these results we made another significant leap towards the +/-1 nm bin goal on an epiwafer,” said Burkhard Slischka, CEO of ALLOS. “Our technology is already available on 200 mm wafer diameter, which enables the use of low-cost and high yield silicon lines for microLED chip production. Additionally, we have a clear roadmap to enable 300 mm.”

Innovators in display technology are focusing on microLED as the next significant technological shift. According to research firm Yole Développement, the market for microLED displays could potentially reach 330 million units by 2025. This optimism is fueled by the promise of microLED technology (sub-100 micrometer edge length), which is considered the critical enabler to achieving the ultimate display with much lower power consumption. However, development of such displays has been hindered by high material costs and low yield and throughput of microLED mass transfer technology. This joint technical effort effectively addresses these challenges as Veeco and ALLOS continue to work with customers to further improve GaN-on-Si epiwafer and microLED mass transfer technology.

Veeco and ALLOS will showcase details of their breakthrough achievements at the International Workshop on Nitride Semiconductors (IWN) in Kanazawa, Japan on Nov. 12, 2018.

Pfeiffer Vacuum, a provider of high-tech vacuum solutions for the semiconductor, industrial, coating, analytical and R&D markets, opened up a new 27,000 square foot building in Nashua, NH, on October 25. This modern two-story construction will be the home of the North American headquarters for administration, sales, product management, marketing and customer care. In parallel, the former 24,000 square foot administration building has been converted into a Service Center of Excellence, bringing together under one roof all service activities for the major part of the Pfeiffer Vacuum product portfolio. State-of-the-art automated cleaning and test equipment is being utilized resulting in high-quality, fast repairs of the highest standards. Together with the service center in Austin, Texas with its strong presence in the semiconductor industry, Pfeiffer Vacuum has an ideal organization to serve the North American customers.

“With the completion of the two facilities, Pfeiffer Vacuum will be able to better support our valued customers throughout North America, while at the same time providing a modern, best-in-class work environment for our staff,” said Daniel Saelzer, President of Pfeiffer Vacuum Inc.

SkyWater Technology Foundry, the industry’s most advanced U.S.- based and U.S.-owned Trusted Foundry, today announced that Tom Legere has been appointed as Senior Vice President of Operations. In this role Legere will focus on evolving and enhancing SkyWater’s operations as they drive world-class foundry efficiency and customer support in support of the company’s long-term growth objectives.

“I’m extremely excited to have Tom join us at SkyWater as we accelerate our technology foundry transformation and work to blend best-in-class operational efficiency with a highly differentiated technology portfolio.” said Thomas Sonderman, President, SkyWater Technology Foundry. “Tom brings a unique set of operations leadership experiences across the semiconductor industry and the industry segments we serve. This deep understanding of our customers will be critical as we look to scale our business in 2019 and beyond.”

Legere brings an ideal combination of leadership and operational talent to the SkyWater executive team with extensive industry experience in aerospace and defense, life sciences, security, MEMS, renewable energy and semiconductors. He has led both mature and start-up organizations with extensive implementation experience in Design for Manufacturability (DFM), lean and six sigma principles, supply chain management and customer engagement. Over the last three decades Legere has held senior operational roles at a diverse range of companies, most notably Aurora Semiconductor, Sonavation, eSolar, SVTC, Cypress Semiconductor and Atmel.

Added Legere, “SkyWater brings a truly differentiated proposition to semiconductor industry, blending innovative advanced technology development with the ability to manufacture at scale. I’m excited to join the team as we look to further scale the business with an operationally efficient, customer-first approach.”

Praxair, Inc., a wholly-owned subsidiary of Linde plc (NYSE:LIN; FWB:LIN) today announced it has signed a long-term agreement to supply ultra-high purity nitrogen to Samsung’s world-class semiconductor facility in Hwaseong, South Korea. This is the fifth plant Praxair will build at this site to help enable Samsung to meet increased global semiconductor demand.

The plant will supply Samsung’s facility with high purity nitrogen and is expected to start up in late 2019. Additionally, the company will install multiple purifiers and a new pipeline system to support the project.

“Praxair has been a reliable partner to Samsung for over four decades,” said B.S. Sung, president of Praxair Korea. “We are proud to continue to support their growth as global demand for electronics intensifies. This project increases our density in the region and positions us for future expansion.”

Earlier this year, Praxair announced two other long-term agreements with Samsung affiliates in South Korea, one to supply another of Samsung Electronics’ world-scale semiconductor plant in Pyeongtaek and a second to supply Samsung Electro-Mechanics’ facility in Busan.

BISTeL, a provider of adaptive intelligent (AI) applications for smart manufacturing today announced that it has joined the MindSphere Partner Program, Siemens’ partner program for Industrial IoT solution and technology providers. BISTel applications are expected to be available on the MindSphere platform Q1 2019.

BISTel’s advanced data analytics platform, eDatalzyer®, and its real-time, health monitoring and predictive maintenance (HMP) solution will connect with the MindSphere cloud-based, open Industrial IoT platform to deliver significant business value to the manufacturing sector. Opportunities for enhanced business value include access to the latest industrial IoT technology and access to industry leading manufacturing applications that are designed to accelerate the customers’ journey to smart manufacturing, improve engineering productivity, provide greater operational efficiencies, and increase quality and yield. Smart Manufacturing (also referred to as Industry 4.0), is event driven, enabling issues to be addressed before they occur, and machines taken offline only when it is absolutely necessary.

According to W.K. Choi, CEO, BISTel, “We are delighted to work with Siemens and build MindSphere applications to take advantage of Siemens’ leading industrial IoT technology. BISTel’s real-time monitoring, fault detection, data analysis and predictive maintenance applications on the MindSphere platform enable customers to quickly turn manufacturing data into actionable intelligence that improves business performance and creates significant efficiencies across their manufacturing organizations.”

“BISTel is capable of delivering tremendous value in engineering and automation applications for smart manufacturing,” said Paul Kaeley, senior vice president, global partner ecosystem at Siemens PLM Software. “With BISTel as a partner in the MindSphere ecosystem, customers now have more strong options to solve operational challenges with advanced data analytics and predictive maintenance.”

Industry 4.0 enables the digitalization of the manufacturing sector and transforms the way plants operate. Increased automation and the introduction of AI create new ways for engineers and operators to interface with factory equipment and processes and solve every day manufacturing problems in real time. Key to this, is Industrial Internet of Things (IIoT) technology. According to a recent Gartner Group study, the number of IoT connected devices worldwide will grow from 8.4 billion in 2017 to more than 20.4 billion by 2020, creating access to a wealth of new data across the manufacturing ecosystem.  To achieve the vision of Industry 4.0 the manufacturing ecosystem must deliver this data to the right people, at the right place and at the right time. The proliferation of the Cloud, Big Data analytics and the adoption of AI based technologies are critical to achieving this goal.

Adaptive Intelligence for Smart Manufacturing

BISTel is redefining AI as adaptive intelligence for smarter manufacturing.  Several new AI based, real-time monitoring and advanced data analytics tools connect with IIoT platforms. These new solutions enable manufacturers to connect to and gather data from any data source. BISTel’s real-time monitoring applications detect faults before they occur, quickly conduct root cause analysis in hours and minutes versus the weeks and months it takes others.  With its new health monitoring and predictive maintenance (HMP) solution, engineers and operators can now predict outcomes and adapt real-time to changing factory conditions.

MagnaChip Semiconductor Corporation (“MagnaChip”) (NYSE: MX), a designer and manufacturer of analog and mixed-signal semiconductor platform solutions, today announced the appointment of Jeong Ki Min to the newly created position of Chief of Strategic Planning. Mr. Min, a seasoned semiconductor executive with 33 years of global business experience, previously held senior positions at Samsung Semiconductor, Samsung Electronics, Samsung Display, and SK Telecom. He reports directly to YJ Kim, MagnaChip’s Chief Executive Officer.

During his more than three decades in the high-tech industry, Mr. Min has initiated and negotiated high-profile joint venture agreements, strategic alliances and acquisitions. Among his other accomplishments, Mr. Min also has led new business planning teams, managed R&D operations, led Foundry marketing teams, and helped develop semiconductor growth strategies.

Most recently, Mr. Min was Senior Vice President, Office of the Vice Chairman of SK Telecom. Prior to that, Mr. Min held various leadership roles at several divisions of Samsung during a 25-year career.

At MagnaChip, Mr. Min will have a variety of responsibilities, including strategic planning related to semiconductor technologies, products, and markets. He also will play a key role in activities related to potential alliances, joint ventures and other transactions.

“Mr. Min brings to MagnaChip a wealth of semiconductor experience as well as a strong track record of business success,” said YJ Kim, MagnaChip CEO. “Mr. Min will drive the strategic planning process across MagnaChip and help the management team set the future direction of our company.”

Mr. Min said,  “Over the past three years, MagnaChip has been transformed into a powerhouse in the Display and Power standard products businesses and become an industry leader in the analog and mixed signal Foundry business. I’m excited to join MagnaChip and look forward to working with the management team on strategic issues to help MagnaChip achieve the next level of success.”