Tag Archives: Small Times Magazine

(July 19, 2010) — A confluence of new piezo-based technology has added new capability into the nano- and micro-positioning world. The global market for piezoelectric-operated actuators and motors was estimated to be $6.6 billion in 2009 and is estimated to reach $12.3 billion by 2014, showing an AAGR of 13.2%/year.

Figure. Global share for piezoelectric actuators and motors by application, 2009 and 2014 ($ millions).
Click to Enlarge

Piezo actuation is increasingly suitable for applications formerly addressable only by magnetic motors, and the technology offers significant benefits in terms of size, speed, fieldlessness, reliability, vacuum compatibility, resolution and dynamics. These benefits, in turn, enable significant advances in existing and new applications. Piezomotors and actuators typically eliminate any need for gear reduction because they drive loads directly. Piezoelectric actuators have been commercialized in various areas such as information technology, robotics, biomedical engineering, automotive, ecological and energy engineering.

According to a recently published report from iRAP, Inc., ET112: Piezoelectric Actuators and Motors – Types, Applications, New Developments, Industry Structure and Global Markets, the global market for piezoelectric-operated actuators and motors was estimated to be $6.6 billion in 2009 and is estimated to reach $12.3 billion by 2014, showing an average annual growth rate (AAGR) of 13.2% per year.

The market for piezoelectric-operated actuators and motors in ultra-small scale precision motion related applications will be the largest segment, estimated to have reached $3,200 million (48.6% share) in 2009 and projected to reach $6,000 million in 2014, for an AAGR of 13.4%. The other major segment includes phone cameras, digital cameras, microscope lenses, mirrors and optics, estimated at $2,800 million (42.5% share) in 2009 and $5,200 million in 2014, for an AAGR of 13.1%.

The remaining 8.9% ($587 million) is a third market segment consisting of auto fuel injectors, micro-pumps, micro-blowers, printer cartridges, surgical instruments, mini-robots, etc.). In 2014, this market segment will have a share of 8.7% ($1,090 million).

Table. Global market size/percentage share for piezoelectric actuators and motors by application, through 2014 (Source: iRAP, Inc.)

Applications

2009 ($ Mil.) 2009 (%) 2014 ($ Mil.) 2014 (%)

AAGR (%)
2009-14

Ultra-small scale motion related applications 3,200 48.6 6,000 48.9 13.4
Cameras, microscope lenses, mirrors and optics     2,800 42.5 5,200 42.4 13.1
Others, e.g., auto fuel injectors, micro-pumps, micro-blowers, piezo ink cartridges, surgery instruments, mini-robots 587 8.9 1,090 8.7 13.1
Total  6,587 100 12,290 100 13.2

The manufacturers of optics, photonics and nanometrology equipment have been the major consumers of piezoelectric-operated motors and actuators.

Life sciences and medical technology also constitute a high-growth segment of the piezoelectric-operated actuators and motors market. This area is expected to grow at 18.7% annually and could record an even higher growth rate if there is wider acceptance by end users. It is still going through a gestation period. Read more about the life sciences and medical sector.

Over the projected period of five years, market share of piezoelectric-operated actuators and motors will increase, taking share from electromagnetic motors.

In terms of types, bulk PZT material-based piezo actuators and motors have the highest market share at 98%, with a market of US$6.455 billion in 2009; this segment will grow at an AAGR 12.4% to reach US$11.6 billion in 2014. Thick-film PZT used in piezo actuators and motors reached a market of US$65.83 million in 2009, approximately 1% of the total, and will show an AAGR of 30.1% to reach US$245.8 billion in 2014. Fiber composites used in actuators and motors had a market of US$39.52 million in 2009, and by 2014, with an AAGR of 50.7 %, the segment will reach US$307.2 million in sales. Lead-free ceramics used in actuators and motors had a market of US$26.345 million in 2009 and is expected to reach US$123 million by 2014, for an AAGR of 36%.

In terms of regional market share, North America leads, with 40.5% in 2009, followed by Europe with 34%, Japan with 20%, and the balance 5.5% for China and the rest of the world.

For more information from iRAP, Inc., visit http://www.innoresearch.net/report_summary.aspx?id=75&pg=154&rcd=ET-112&pd=7/1/2010

(July 19, 2010) — Carl Zeiss introduced EVO HD, a conventional Scanning Electron Microscopy (C-SEM) system with higher resolution at low acceleration voltages. The EVO HD introduces High Definition to electron microscopy.

Click to Enlarge

Figure 1. Scale of butterfly wing (Pieris Brassicae) taken on the new EVO HD electron microscope at 5kV acceleration voltage. The combination of the groundbreaking high source brightness of the EVO HD and the enhanced low-kV sensitivity of the detector allows for more insight into such non-conductive biological nano-structures. Nano-textures associated with biological structures have attracted considerable attention not just in Zoology, but also in Material Science, bio-mimicry and nano-engineering. (Photo: Business Wire)

The technological basis for this achievement is the new EVO HD source, which features a higher source brightness. This brightness results in an improvement in resolution at low-kV relative to conventional tungsten SEMs. The improved source properties also aid analytical applications with a 30% increase in resolution at 30kV and 1nA.

“We are convinced that this is the most significant innovation in the market for conventional SEM in the last decade. Numerous applications in both life sciences and materials analysis will benefit from the increased performance,” explains Allister Mc Bride from Carl Zeiss Nano Technology Systems division at Cambridge.

The Carl Zeiss Group operates worldwide in the optical and opto-electronic industries. Carl Zeiss SMT AG comprises the Semiconductor Technology Group of the Carl Zeiss Group, manufacturing lithography optics and light, electron and ion-optical inspection, analysis and measuring systems. Further information is available at www.smt.zeiss.com

Also read:
Zeiss tool put to work finding rock-encased hydrocarbons

SPIE/BACUS: NIL in patterned media…but when for ICs?

Carl Zeiss delivers "complete" optics for production EUV

Zeiss debuts "correlative microscopy" elements

(July 16, 2010) — The SMTA and MEPTEC announced that the Medical Electronics Symposium: "Successful Strategies for the Medical Electronics Sector: Steady Growth Keeps the Momentum Moving Forward," will have keynote addresses on intelligent medicine and micropackaging innovations, from Proteus Biomedical and the Alfred Mann Foundation for Scientific Research, respectively.

The program is scheduled for September 22-23, 2010 at Arizona State University, Tempe, AZ. Ben Costello, Proteus Biomedical, will present the keynote address on Improving Health Care with Intelligent Medicine during the first day. The second day will feature a keynote on Hermetic, Radio-Transparent Micropackaging for Implantable Neural Prosthetics by Charles Byers, Alfred Mann Foundation for Scientific Research.

Ben Costello, VP of Product Engineering for Proteus Biomedical, will present "Improving Health Care with Intelligent Medicine." The presentation will introduce Proteus Biomedical’s technology which enables proven drugs and devices to incorporate active digital sensors that connect with cell phones, enabling widely adopted therapies to be personalized by a patient, their family and physician.

Charles Byers will present "Hermetic, Radio-Transparent Micropackaging for Implantable Neural Prosthetics." He will discuss packaging innovations that helped miniaturize circuitry and made the creation of hermetic cases for modern prosthetic devices possible.

For more information, visit https://meptec.org/meptec2010medica.html

Browse other events here.

(July 15, 2010) — In response to requests from R&D and academic communities, ElectroChemical Systems, Inc. (ECSI) FIBRotools is introducing two products for development of advanced MEMS/nano and high-density interconnect (HDI) fabrication technologies: IKoCLASSIC-SL and IKoCLASSIC-MG.

Click to Enlarge

Advanced MEMS, nano, and HDI fabrication requires fewer processing steps and improved efficiency and product quality, noted ECSI. The IKoCLASSIC-SL enables electroplating of micro and nano-structures on doped silicon (Si) substrates without the seed layer as a precursor.

Actuators, field generators and micro-motors call for MEMS and nano structures with magnetic capability. IKoCLASSIC-MG enables electroplating of such structures under a magnetic field.

For more information, visit www.fibrotools.com

Read more about MEMS and nanotechnology fabrication equipment here.

(July 14, 2010) — At SEMICON West 2010, top analysts from Yole and iSuppli discuss the market for MEMS devices; outsourcing MEMS foundries; and the relationship between manufacturing processes, cost, and MEMS adoption. Chief editor Pete Singer summarizes the findings.

The market for MEMS devices is expected to grow rapidly in the coming years, moving from around $6.5B in 2009 to more than $16B in 2015, according to Jean Christophe Eloy, founder and CEO of Yole Developpement. Eloy provided his forecast at Semicon West during an “extreme electronics” XPOT focused on opportunities in MEMS, new applications, integrated functions and faster time to market. The number of units is expected to grow from 3.2 billion in 2009 to 10 billion in 2015.

iSuppli Corp. also issued a rosy forecast for the MEMS market, projecting MEMS revenue to reach $6.54 billion, up 11.1% from $5.88 billion last year. The market will continue to expand through 2014, when it will have grown another $3.3 billion to hit $9.8 billion — equivalent to a compound annual growth rate (CAGR) of 10.7% throughout the 2009-2014 period, according to iSuppli.

As a sign of MEMS demand, Eloy said that major systems companies with internal MEMS fabs, such as Delphi and Conti, are now looking to use external foundries.

He also said that there are many applications that are still emerging and are now in the R&D phase, including energy harvesting and MEMS speakers. “Many new startups are using foundries,” Eloy said. Other growing markets for MEMS include RFID, IR photodetectors, picoprojectors and auto focus technology. Digital compasses, microbolometers, microdisplays, micro fuel cells, oscillators, and microstructures (for watches, for example) were also named.

For 2011, MEMS displays will make a comeback, thanks not only to pico projectors but also to new types of MEMS flat-panel technologies for portable electronics, reports iSuppli. MEMS microphones and BAW filters will increase their penetration, while completely new types of MEMS actuators will bring significant additional revenue for switches or varicaps and autofocus for camera phones.

Eloy said the growth in MEMS is in part due to price decreases made possible by advancements in manufacturing technology. In 2000, typical accelerometer devices were 10mm2 in size, consumed 0.1 mW, cost more than $3.00, and were manufactured on 4” and 6” wafers. In 2010, devices measure about 2-3 mm2, consume 0.05mW and cost $0.7 and are manufactured on 6” and 8” wafers. By 2020, MEMS devices will measure 1-2mm2, consume less than 0.05mW, cost less than $0.4, and be manufactured mostly on 8” wafers. 3D integration will also be used at the 2020 node.

Click to Enlarge
The figure shows iSuppli’s MEMS revenue forecast from 2006 to 2014, with revenue dipping in 2008 and then bottoming out in 2009 as a result of the global recession.

The expected rise in MEMS revenue this year will mirror an equivalent increase in MEMS unit shipments, anticipated to reach 4.14 billion units, up from 3.44 billion units in 2009. Overall, MEMS shipments will log an impressive 19.5% CAGR to top 8.5 billion units by 2014, iSuppli data indicate.

“MEMS production is back on the fast track,” said Jérémie Bouchaud, director and principal analyst for MEMS and sensors at iSuppli. “Beginning in September 2009, MEMS manufacturing began to grow at a rate that came close to the high-level mark set three years ago in 2007. In particular, the MEMS market is being fueled by the continuing might of MEMS applications for consumer electronic devices and mobile handsets. These two sectors bulldozed their way through the economic crisis, in the process cementing their status as the new locomotive for MEMS.” By 2014, Bouchaud said both sectors will generate $3.2 billion in value, accounting for 32% of total MEMS market revenues.

MEMS sensor production for automotive applications likewise remains high, with the market set to rebound in 2010 after a fall last year. Factors stimulating the growth of automotive MEMS include anticipated stronger shipments of cars from 2010 to 2014, mandates in the United States and Europe for vehicular safety systems, and continuing regulation in the reduction of harmful emissions.

Also enjoying robust growth is the high-value MEMS market for the industrial, medical and aerospace-defense sectors. With a projected CAGR of 13.7% from 2009 to 2014, the MEMS market for these segments will be worth $2.3 billion at the end of the forecast period, iSuppli data show.

Among MEMS devices, three segments will exceed the $1 billion mark this year, and two others will be close to joining that list by 2014.

Inkjet printheads will remain the dominant-selling MEMS device from now until the end of 2014, with revenue exceeding $2 billion that year. However, growth in this segment is stagnating and will experience dwindling shipments as the market transitions from disposable to permanent printheads, says iSuppli. Rounding out the top 5 — along with their projected revenue in 2014 — are accelerometers, in second place with $1.7 billion; pressure sensors, in third with $1.4 billion; gyroscopes, in fourth with $961 million; and optical MEMS for displays, in fifth with $940 million.

–Pete Singer, editor in chief, Small Times

(July 14, 2010) — Rice University scientists have found the ultimate solvent for all kinds of carbon nanotubes (CNTs), a breakthrough that brings the creation of a highly conductive quantum nanowire closer.
 
Nanotubes have the frustrating habit of bundling, making them less useful than when they’re separated in a solution. Rice scientists led by Matteo Pasquali, a professor in chemical and biomolecular engineering and in chemistry, have been trying to untangle them for years as they look for scalable methods to make exceptionally strong, ultralight, highly conductive materials that could revolutionize power distribution, such as the armchair quantum wire.
 
The armchair quantum wire — a macroscopic cable of well-aligned metallic nanotubes — was envisioned by the late Richard Smalley, a Rice chemist who shared the Nobel Prize for his part in discovering the the family of molecules that includes the carbon nanotube. Rice is celebrating the 25th anniversary of that discovery this year.
 
Pasquali, primary author Nicholas Parra-Vasquez and their colleagues reported this month in the online journal ACS Nano that chlorosulfonic acid can dissolve half-millimeter-long nanotubes in solution, a critical step in spinning fibers from ultralong nanotubes.
 
Current methods to dissolve carbon nanotubes, which include surrounding the tubes with soap-like surfactants, doping them with alkali metals or attaching small chemical groups to the sidewalls, disperse nanotubes at relatively low concentrations. These techniques are not ideal for fiber spinning because they damage the properties of the nanotubes, either by attaching small molecules to their surfaces or by shortening them.
 
A few years ago, the Rice researchers discovered that chlorosulfonic acid, a "superacid," adds positive charges to the surface of the nanotubes without damaging them. This causes the nanotubes to spontaneously separate from each other in their natural bundled form.
 
This method is ideal for making nanotube solutions for fiber spinning because it produces fluid dopes that closely resemble those used in industrial spinning of high-performance fibers. Until recently, the researchers thought this dissolution method would be effective only for short single-walled nanotubes.
 
In the new paper, the Rice team reported that the acid dissolution method also works with any type of carbon nanotube, irrespective of length and type, as long as the nanotubes are relatively free of defects.
 
Parra-Vasquez described the process as "very easy."
 
"Just adding the nanotubes to chlorosulfonic acid results in dissolution, without even mixing," he said.
 
While earlier research had focused on single-walled carbon nanotubes, the team discovered chlorosulfonic acid is also adept at dissolving multiwalled nanotubes (MWNTs). "There are many processes that make multiwalled nanotubes at a cheaper cost, and there’s a lot of research with them," said Parra-Vasquez, who earned his Rice doctorate last year. "We hope this will open up new areas of research."
 
They also observed for the first time that long SWNTs dispersed by superacid form liquid crystals. "We already knew that with shorter nanotubes, the liquid-crystalline phase is very different from traditional liquid crystals, so liquid crystals formed from ultralong nanotubes should be interesting to study," he said.
 
Parra-Vasquez, now a postdoctoral researcher at Centre de Physique Moleculaire Optique et Hertzienne, Université de Bordeaux, Talence, France, came to Rice in 2002 for graduate studies with Pasquali and Smalley.
 
Study co-author Micah Green, assistant professor of chemical engineering at Texas Tech and a former postdoctoral fellow in Pasquali’s research group, said working with long nanotubes is key to attaining exceptional properties in fibers because both the mechanical and electrical properties depend on the length of the constituent nanotubes. Pasquali said that using long nanotubes in the fibers should improve their properties on the order of one to two magnitudes, and that similar enhanced properties are also expected in thin films of carbon nanotubes being investigated for flexible electronics applications.
 
An immediate goal for researchers, Parra-Vasquez said, will be to find "large quantities of ultralong single-walled nanotubes with low defects — and then making that fiber we have been dreaming of making since I arrived at Rice, a dream that Rick Smalley had and that we have all shared since."
 
Co-authors of the paper are graduate students Natnael Behabtu, Colin Young, Anubha Goyal and Cary Pint; Pulickel Ajayan, the Benjamin M. and Mary Greenwood Anderson Professor in Mechanical Engineering and Materials Science and of chemistry, and Robert Hauge, a distinguished faculty fellow in chemistry, all at Rice; and Judith Schmidt, Ellina Kesselman, Yachin Cohen and Yeshayahu Talmon of the Department of Chemical Engineering, Technion-Israel Institute of Technology, Haifa, Israel.
 
The Air Force Office of Scientific Research, the Air Force Research Laboratory, the National Science Foundation Division of Materials Research, the Robert A. Welch Foundation, the United States-Israel Binational Science Foundation and the Evans-Attwell Welch Postdoctoral Fellowship funded the research.
 
Read the abstract at http://pubs.acs.org/doi/abs/10.1021/nn100864v

(July 14, 2010) — SEMI published eight new technical standards applicable to the semiconductor, MEMS, FPD and photovoltaic (PV) manufacturing industry. The new standards, developed by technical experts from equipment and materials suppliers, device manufacturers and other companies participating in the SEMI International Standards Program, are available through the SEMIViews Standards product, available at www.semi.org/semiviews.

“Today’s release of these eight new SEMI International Standards covers a wide range of applications, including display, PV, and 450 mm wafers,” said James Amano, Director, SEMI International Standards. “These standards address issues that are active today, and those that will arise when and if the industry moves to larger-diameter silicon.”

The list of new SEMI Standards being released includes:

  • SEMI T20.3, Specification for Service Communication for Authentication of Semiconductors and Related Products;
  • SEMI E158, Mechanical Specification for Fab Wafer Carrier Used to Transport and Store 450 mm Wafers (450 FOUP) and Kinematic Coupling;
  • SEMI M76, Specification for Developmental 450 mm Diameter Polished Single Crystal Silicon Wafers;
  • SEMI D60, Test Method of Surface Scratch Resistance for FPD Polarizing Film and Its Materials;
  • SEMI E156, Mechanical Specification for 450 mm AMHS Stocker to Transport Interface;
  • SEMI E157, Specification for Module Process Tracking;
  • SEMI D59, 3D Display Terminology; and
  • SEMI PV4, Specification for Range of 5th Generation Substrate Sizes for Thin Film Photovoltaic Applications.

The new standards, part of the July 2010 publication cycle, join more than 790 standards that have been published by SEMI during the past 36 years. The SEMI Standards Program, established in 1973, covers all aspects of semiconductor process equipment and materials, from wafer manufacturing to test, assembly and packaging, in addition to the manufacture of flat panel displays, photovoltaic systems and micro-electromechanical systems (MEMS). Visit www.semi.org/standards for further details about SEMI Standards.

Get all the latest news from SEMICON West at http://www.electroiq.com/index/Semiconductors/semiconwest2010.html

(July 12) — Affinity Biosensors and Innovative Micro Technology Inc. (IMT) entered into a strategic foundry partnership today for volume production of suspended mass resonator (SMR) MEMS devices enabling particle measurement in fluidic solutions with femtogram resolution. The SMR MEMS devices are the chips that drive Affinity Biosensors’ ARCHIMEDES Particle Measurement System.

Originally conceived at Massachusetts Institute of Technology (MIT), IMT refined and developed a robust process for volume production, including a key component to this product – sub-mTorr vacuum, wafer-level packaging (WLP) technology. ARCHIMEDES measures a particle as it traverses through a microfluidic channel embedded in a resonating cantilever. The mass is determined by detecting the change in resonant frequency at the time the particle enters the tip of the cantilever. Achieving femtogram resolution requires the cantilever to have a very high Q-factor that is only accomplished by encapsulating the cantilever in high-vacuum WLP.
 
"Working with IMT has been a very rewarding experience. I know of no other MEMS foundry with the breadth of facilities and depth of expertise needed to develop the sensors for ARCHIMEDES, and to bring them into production. It is not an exaggeration to say that ARCHIMEDES, and perhaps Affinity Biosensors itself, might not exist without our relationship with IMT," said Ken Babcock, Ph.D., CEO of Affinity Biosensors.

IMT builds complex MEMS devices in today’s market. Incorporating proven technology modules and platforms, such as WLP, through silicon vias (TSV), and 3D microfluidics helps to mitigate program risks and achieve production-friendly processes. As a result, IMT’s customer products are reaching the market in ever faster times.
 
"Of course, we are always pleased when we can provide a value that enables our customers to achieve true technical differentiation in the market," stated Dr. John Foster, CEO of IMT. "While the concept of the SMR chip is simple, the technology used to produce these devices is not. We are fortunate to have been able to leverage our standard processes and depth of experience in microfluidics to help shorten the development time of this project and are thrilled to be supporting Affinity Bio in production today."

Affinity Biosensors is pioneering ultra high-resolution mass measurement for real-world applications in industrial manufacturing, research, life sciences, and nanotechnology. Learn more at www.affinitybio.com

IMT produces and develops MEMS devices and is a pure-play MEMS foundry in the United States. For more information, visit http://www.imtmems.com

(July 12, 2010) — Rudolph Technologies, Inc. (NASDAQ: RTEC), provider of process characterization equipment and software for wafer fabs and advanced packaging facilities, announced that the Fraunhofer Institute for Silicon Technology (ISIT) in Germany has placed an order for an NSX® Series Macro Inspection System for advanced MEMS processing. The system will be installed this summer in the state-of-the-art 200mm MEMS pilot production line at ISIT.

Click to Enlarge

“We are pleased to continue working with ISIT on next-generation MEMS processes,” said Hartmut Seeger, sales manager for Rudolph in Europe. “ISIT evaluated the NSX System along with several other inspection systems for this application. Acceptance of this tool confirms that the investments we have made to address unique MEMS inspection requirements, including the challenge of wafer handling, are meeting our customers’ needs.”

The ISO 9001:2008-certified production environment at ISIT enables the development of advanced MEMS devices for inertial, RF and electro-optical applications with the required application-specific packaging technology at the wafer level. The functional integration of extremely small features requires automatic defect inspection at small dimensions with high throughput and limited effect on the wafers. Hermetic wafer level vacuum packaging (with integrated getter) requires an inspection tool that is highly flexible in both hardware and software features.

“Silicon and glass cap wafers are not only fragile, but have deep cavities and sensitive features on both sides of the wafer, requiring a unique wafer handling concept,” said Dr. Wolfgang Reinert, team leader-advanced electronic packaging, Fraunhofer ISIT. “The cap wafer inspection results need to be mirrored and interfaced with the ISIT final electrical test equipment for single device traceability and inkless assembly.”

Sascha Mühlmann, MEMS engineer, Fraunhofer ISIT, added, “The capabilities of Rudolph’s Discover® all-surface defect analysis and data management software on the NSX platform support these tasks during the device development phase and after the technology transfer to MEMS pilot production.” The NSX Series is a fast, repeatable macro defect inspection solution used throughout the semiconductor device manufacturing process. Macro defects can be created during wafer manufacturing, probing, bumping, dicing, or by general handling, and can have a major impact on the quality of a microelectronic device. The NSX, specifically designed for back-end manufacturing and often selected by automotive device manufacturers for 100 percent inspection, can handle whole wafers and thinned wafers on film frames. It can quickly and accurately detect yield-inhibiting defects to provide quality assurance and valuable process information.

The Fraunhofer Institute for Silicon Technology (ISIT) works on design, development and production of microelectronic components as well as micro-sensors, micro-actuators and other components for microsystems technology. Further services offered by the institute are analysis and development of technology pertaining to the quality and reliability of electronic assemblies as well as packaging and mounting technology for microsystems, sensors and multichip modules.  www.isit.fraunhofer.de

Rudolph Technologies, Inc. designs, develops, manufactures and supports defect inspection, process control metrology, and data analysis systems used by semiconductor device manufacturers. For more information, visit www.rudolphtech.com.

(July 12, 2010) — Alchimer S.A., a provider of nanometric deposition technology for through-silicon vias (TSV), semiconductor interconnects, and other electronic applications, announced that Panasonic Corporation (NYSE: PC) has become an equity investor in the company.

“Throughout the electronics supply chain, manufacturers are increasingly in need of high-quality nanometric metal films that can be mass-produced at low cost,” said Patrick Suel, venture partner with Panasonic Venture Group. “We see this at the wafer level, on substrates, and in 3D packaging, which is emerging as an important technology to lower costs for future ICs and systems. We believe that Alchimer’s nanometric films have tremendous potential to change the traditional cost-performance ratio at many points along the value chain.”

Alchimer’s breakthrough technology, electrografting (eG), is an electrochemical process that enables the growth of extremely high quality polymer and metal thin films on both conducting and semiconducting surfaces. The company’s deposition technology reduces overall cost of ownership for high-aspect-ratio TSV metallization by up to two-thirds compared to conventional dry processes, and shortens time to market. 

In addition to electrografting, Alchimer has developed chemical grafting (cG), an electroless process sequence that enables the growth of highly adherent, low-resistivity copper-diffusion barrier films on isolating surfaces through the formation of strong chemical bonds between the films. 

Funding has been facilitated by the Panasonic Venture Group, a Silicon Valley-based unit of global consumer electronics leader Panasonic R&D Company of America, which invests in companies that may present a technology-based advantage to Panasonic. Through its investments, Panasonic Venture Group champions technology partnerships between private companies and R&D units of Panasonic. The dollar amount of the investment and Panasonic Venture Group’s equity holding were not disclosed.

 “The Panasonic Venture Group is known for its investments in companies that present potential strategic competitive advantages to Panasonic, and we are very pleased to have them as an investor as we commercialize our technologies,” said Steve Lerner, CEO of Alchimer. “We believe that electrografting offers substantial promise as an enabling technology for TSVs and 3D interconnects, which we expect to move quickly into high-volume production in the next few years.”

Alchimer develops and markets innovative chemical formulations, processes and IP for the deposition of nanometric films used in semiconductor interconnects and 3D TSVs (through-silicon vias), as well as other applications in the electronics value chain. Visit the company at SEMICON West in San Francisco this week, Moscone Center, South Hall, Booth 1811.

Get all the latest news from SEMICON West at http://www.electroiq.com/index/Semiconductors/semiconwest2010.html