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April 13, 2012 — Georgia Institute of Technology researchers have used magnetic repulsion force as a fixtureless, noncontact tool for measuring the adhesion strength between thin films in microelectronic devices, photovoltaic cells, and micro electro mechanical systems (MEMS).

The magnetically actuated peel test (MAPT) could help electronics engineers understand and predict delamination/debonding, and improve resistance to thermal and mechanical stresses.

Figure 1. A specimen fabricated for the magnetically actuated peel test (MAPT). The silver cylinder in the center is the permanent magnet. SOURCE: Thin Solid Films.

The right materials will enable smaller, higher-performance, reliable electronic devices, said Suresh Sitaraman, a professor in the George W. Woodruff School of Mechanical Engineering at the Georgia Institute of Technology. “This technique would help manufacturers know that their products will meet reliability requirements, and provide designers with the information they need to choose the right materials to meet future design specifications over the lifetimes of devices.”

Thermal stresses occur when different layers within an electronic device have mismatched coefficients of thermal expansion (CTE), and will cause layers to separate. Researchers want to know if these layers will separate as the device is used over time, eventually causing failure, said Sitaraman.

Figure 2. Georgia Tech School of Mechanical Engineering professor Suresh Sitaraman (left) and doctoral student Gregory Ostrowicki (right) examine a specimen (seen in Figure 1) fabricated for the magnetically actuated peel test (MAPT). SOURCE: Thin Solid Films.

Sitaraman and doctoral student Gregory Ostrowicki have used their technique to measure the adhesion strength between layers of copper conductor and silicon dioxide (SiO2) insulator. They also plan to use it to study fatigue cycling failure, which occurs over time as the interface between layers is repeatedly placed under stress. The technique may also be used to study adhesion between layers in photovoltaic systems and in MEMS devices.

The Georgia Tech researchers used standard microelectronic fabrication techniques to grow layers of thin films that they want to evaluate on a silicon wafer. At the center of each sample, they bonded a tiny permanent magnet made of nickel-plated neodymium (NdFeB), connected to three ribbons of thin-film copper grown atop silicon dioxide on a silicon wafer.

The sample was then placed into a test station comprising an electromagnet below the sample and an optical profiler above. Voltage supplied to the electromagnet was increased over time, creating a repulsive force between the like magnetic poles. Pulled upward by the repulsive force on the permanent magnet, the copper ribbons stretched until they finally delaminated.

With data from the optical profiler and knowledge of the magnetic field strength, the researchers can provide an accurate measure of the force required to delaminate the sample. The magnetic actuation has the advantage of providing easily controlled force consistently perpendicular to the silicon wafer.

Many samples can be made at the same time on the same wafer, generating a quantity of adhesion data in a timely fashion.

To study fatigue failure — a common failure mode wherein delamination occurs over time with repeated heating and cooling cycles, Sitaraman and Ostrowicki plan to cycle the electromagnet’s voltage on and off. “A lot of times, layers do not delaminate in one shot,” Sitaraman said. “We can test the interface over hundreds or thousands of cycles to see how long it will take to delaminate and for that delamination damage to grow.”

The test station fits into an environmental chamber, allowing the researchers to evaluate harsh-environment electronics under the effects of high temperature and/or high humidity. “We can see how the adhesion strength changes or the interfacial fracture toughness varies with temperature and humidity for a wide range of materials,” Sitaraman explained.

Sitaraman and Ostrowicki have studied thin film layers about one micron in thickness, but say their technique will work on layers that are of sub-micron thickness. Because their test layers are made using standard microelectronic fabrication techniques in Georgia Tech’s clean rooms, Sitaraman believes they accurately represent the conditions of real devices. These are representative processes and representative materials, mimicking the processing conditions and techniques used in actual microelectronics fabrication.

“As we continue to scale down the transistor sizes in microelectronics, the layers will get thinner and thinner,” he said. “Getting to the nitty-gritty detail of adhesion strength for these layers is where the challenge is. This technique opens up new avenues.”

The research has been supported by the National Science Foundation, and was reported in the March 30, 2012 issue of the journal Thin Solid Films.

Learn more about Georgia Institute of Technology at http://www.gatech.edu/.

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April 11, 2012 — Research and Markets released the "ST L3G3250A 3-axis MEMS Gyroscope Reverse Costing Analysis" report, providing a teardown of STMicroelectronics’ micro electro mechanical system (MEMS) gyroscope in a land-grid array (LGA) package.  

The package has a 3.5 x 3 x 1mm footprint, which is the smallest 3-axis gyroscope including VTI’s CMR3000, the report says. It is 27-40% smaller by volume (35% smaller by footprint) than the other main gyroscopes for consumer applications in production today, which typically have a 4mm2 footprint.

Also read STMicroelectronics’ article: Introduction to MEMS gyroscopes

The L3G3250A is suitable for various applications including gaming and virtual reality input devices, motion control with man-machine interface (MMI), GPS navigation systems, appliances, and robotics.

This report provides complete teardown of the MEMS gyroscope. For more information visit http://www.researchandmarkets.com/research/386cc1a5/st_l3g3250a_3axis

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April 11, 2012 – BUSINESS WIRE — Tegal Corporation (TGAL) formed a partnership with HealthTech Capital (HTC), an investing group for emerging healthcare technology in Silicon Valley.

Micro electro mechanical systems (MEMS) power numerous new healthcare innovations. MEMS are "essential" to bringing the patient and healthcare closer together, said Philips Research Laboratories’ Hans Hofstraat at the inaugural MEMS Executive Congress Europe. MEMS can minimize the invasiveness of surgery, quickly screen for diseases (through microfluidics and lab-on-a-chip devices), and track motion.

HealthTech Capital invests in early-stage healthcare technology companies, with a focus on mobility and information technologies that improve healthcare delivery and decrease healthcare costs. Companies in its portfolio improve existing healthcare providers’ workflow or empower consumers to manage their chronic conditions or improve wellness.

Tegal has one portfolio company in healthcare technology, NanoVibronix Inc., a private company that develops medical devices and products that implement its proprietary therapeutic ultrasound technology. Tegal is intensifying its investment focus on healthcare technologies, said Thomas Mika, president and CEO, noting that government mandates and efficiency requirements can be served by semiconductor and MEMS technologies.

HealthTech Capital is a Silicon Valley-based angel investing group focused on emerging healthcare technology market where innovation improves healthcare delivery, empowers patients, and lowers costs. For more information, please visit www.HealthTechCapital.com.

Tegal Corporation develops and applies emerging technologies for microprocessors, magnetic memories, radio frequency ID chips, acoustic wave devices, sensors, LEDs, and an array of other semiconductor and MEMS devices. Internet: www.tegal.com.

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April 9, 2012 – Marketwire — Coventor, Inc., micro electro mechanical system (MEMS) and semiconductor device fabrication software provider, launched the latest release of its SEMulator3D software, SEMulator3D 2012. It features improved predictive process modeling tools with increased capacity, speed, and automation for leading-edge process technology nodes.

The SEMulator3D 2012 release makes it possible to model devices in finer detail, down to the sub-nanometer level, and work with larger areas on the die. Assignment of boundary conditions for all process steps is now fully automated.

Unlike conventional TCAD simulation software, SEMulator3D models the complete front-end fabrication sequence at once. It can be used accurately on any device type — deployed now for 22nm logic devices, memory, etc — and can model all possible device variations. This allows users to predict process defect modes and reduce the number of scrap wafers.

SEMulator3D software is now being applied to accelerate development of the 14nm and 10nm nodes. SEMulator3D is also used by leading MEMS integrated device manufacturers (IDMs) and MEMS foundries for process development and design verification prior to tape out. Emerging applications for SEMulator3D include design rule development, failure analysis, and metrology.

Also read: Coventor updates CoventorWare 2012 MEMS design software

Coventor Inc. makes automated design tools for micro electro mechanical systems (MEMS) and virtual fabrication of MEMS and semiconductor devices. More information is available at http://www.coventor.com.

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April 5, 2012 — STMicroelectronics (NYSE:STM, ST) expanded its consumer and mobile micro electro mechanical systems (MEMS) lead in 2011, thanks in part to significant sales to Apple Inc. ST enjoys exclusive design wins in the iPhone, iPad and iPod lines. Apple alone accounted for half of STMicroelectronics’ MEMS revenue in 2011.

STMicroelectronics’s consumer and mobile MEMS chips brought in $638.7 million in 2011, an 81% increase in revenue over 2010’s $353.3 million, according to the IHS iSuppli MEMS & Sensors Service. ST saw the most growth among the top 10 suppliers of consumer and mobile MEMS, increasing its market share and leadership margin over #2 Knowles Electronics (see the table).

Table. Top 10 consumer and mobile MEMS suppliers by revenue for 2011 ($M). Source: IHS iSuppli Research, April 2012.

Rank Company   2011 Revenue ($) 2010 Revenue ($) Y/Y Growth/Decline (%)
1 STMicroelectronics  638.7 353.3 80.8%
2 Knowles 270.9 191.5 41.5%
3 Texas Instruments 204.6 161.4 26.8%
4 Avago 190.6 207.3 -8.1%
5 InvenSense 142.8 92.9 53.7%
6 Bosch 127.2 118.5 7.3%
7 TriQuint 85.2 74.7 14.1%
8 Panasonic 85 86.5 -1.7%
9 Kionix 74.6 63.8 16.9%
10 Analog Devices 59 50.4 17.1%
Revenue Total from Top 10 1878.6 1,400.3 34.2%
Revenue Total from Overall Market 2,159.9 1,642.5 31.5%

The Top 10 suppliers of consumer/mobile MEMS devices accounted for 86% of the market’s overall revenue in 2011, making about $1.9 billion of the $2.2 billion total revenue for the sector. Combined revenue from the Top 10 this year was up 34%. Consumer and mobile — smartphones, media tablets, etc — are the most dynamic and largest MEMS applications.

In 2011, STM held 30% market share of the overall consumer and mobile MEMS market, up 8 percentage points year-over-year. STMicroelectronics has held the #1 spot since 2009. ST was “the first company to fully believe in the consumer MEMS business,” said Jérémie Bouchaud, director and senior principal analyst for MEMS & sensors at IHS. STMicroelectronics had no difficulties ramping up and producing MEMS in mass volume when the market exploded starting in 2007.

STMicroelectronics is the top supplier of motion-sensing accelerometers to cellphones, tablets, laptops and video game consoles. ST “invested heavily” in 3-axis gyroscopes, enabling wins in the iPhone 4 and the Sony PlayStation Move controller. STMicroelectronics is the only provider of accelerometers and gyroscopes — which improve the motion-based interface — for Apple’s iPhones, iPads and iPods. Also read: Gyroscope MEMS depose accelerometers in 2011 revenues

STMicroelectronics also cooperates with other MEMS companies to shorten time to market, working with Honeywell in the electronic compass business, and Omron on MEMS microphones.

STMicroelectronics last year shipped an estimated 15 million digital MEMS microphones into handsets made by Nokia Corp., as well as into laptops from Hewlett-Packard and Taiwanese computer maker Asustek Computer Inc. In the process, STMicroelectronics became the top MEMS microphone supplier to Nokia ahead of former front-runner Knowles, achieving the feat in less than one year.

Knowles rose one spot from #3 in 2010, with a 42% jump in MEMS revenue to a record $270.9 million. Despite erosion in its market share last year, Knowles still largely dominates the MEMS microphone business with 73% share of revenue, remaining highly competitive with a roster of top customers such as Samsung Electronics, Apple and LG Electronics. Knowles also introduced a fourth-generation MEMS microphone last year into the iPhone 4S featuring a 35% reduction in silicon area compared to its previous-generation product.

Texas Instruments jumped one spot as well, with a 27% increase in consumer and mobile MEMS revenue. Pico projectors are its principal revenue growth driver, as the company’s digital light processing (DLP) technology currently dominates the projector space.

Avago slipped from #2 in 2010 to #4. Avago remains the top manufacturer of bulk acoustic wave filters, but price erosion was stronger than unit growth in 2011, causing Avago’s revenue to drop to $190.6 million, down 8% from $207.3 million in 2010.

InvenSense saw 54% revenue growth last year, to $142.8 million. While STMicroelectronics was the sole supplier of 3-axis gyroscopes for Apple, InvenSense dominates the 3-axis gyroscope market for other original equipment manufacturers. InvenSense also ships dual-axis gyroscopes into sectors like gaming, and has achieved some success with single-axis gyroscopes for toy helicopters and other consumer goods. The company has managed to reverse its heavy dependence on gaming, diversifying into mobile handsets and tablets last year.

IHS (NYSE: IHS) is a leading source of information, insight and analytics in critical areas that shape today’s business landscape. Learn more at www.ihs.com.

The overall market for MEMS grew 17% to $10.2 billion in 2011, according to Yole Développement. The top 2 suppliers — Texas Instruments (TXN, TI) and STMicroelectronics (STM, ST) — neared $1 billion in sales each.

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April 5, 2012 — While micro electro mechanical system (MEMS) devices are seen in some high-volume applications, the industry is restrained by its reliance on semiconductor manufacturing technology, which requires high capital investments to produce MEMS. MEMS structures are diverse, adding specialization to the cost of manufacture. Researchers at Massachusetts Institute of Technology (MIT) say new maskless patterning techniques and improved computer-aided design (CAD) tools would break through these limitations.

Henry Smith, a professor of electrical engineering at MIT, is developing a scalable MEMS manufacturing technique without photomasks. The process produces patterns using an array of 1,000 tiny lenses. A wafer moves back and forth beneath the lenses, as the light for patterning switches on and off. Smith’s technique can impart a single pattern to the entire surface of a 6" wafer. The lenses and light patterning method can switch pattern from wafer to wafer.

Smith founded a company, called LumArray, to commercialize his system. The firm has sold one machine to the National Institute of Standards and Technology (NIST) and is delivering another to the Defense Microelectronic Activity.

Martin Schmidt, a professor of electrical engineering and associate provost at MIT, is making MEMS by depositing metallic nanoparticles on a substrate via ink-jet printing. The "rudimentary MEMS structures" Schmidt has created "have functionally the same behavior as MEMS formed using conventional techniques." Vladimir Bulović’s laboratory is investigating low-cost methods of manufacturing MEMS by stamping patterns into plastics.

Research at MIT is also going into shared MEMS fabs and retrofitting of older chip manufacturing facilities. Jacob White, the Cecil H. Green Professor of Electrical Engineering and Computer Science, has worked on CAD systems for MEMS. White notes that IC designers have such complete CAD and simulation tools available, that their 1st attempt at fabricating a new device is likely to work. This kind of assurance in MEMS design and development could enable higher production yields on MEMS devices, and component designs that are better tailored to the processes available at particular manufacturing facilities.

Learn more about MIT’s MEMS work via these links:
Martin Schmidt: http://www-mtl.mit.edu/mems/documents/schmidt.pdf
NanoStructures Laboratory: http://nanoweb.mit.edu/
Luis Fernando Velásquez-García: http://www-mtl.mit.edu/wpmu/lfv/research
Computational Prototyping Group: http://www.rle.mit.edu/cpg/

Courtesy of Larry Hardesty, MIT News Office.

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April 4, 2012 — CALIENT Technologies Inc. promoted Jitender K. Miglani to vice president of engineering, reporting to Gregory Koss, chief development officer. Miglani made significant contributions to the development of CALIENT’s new S320 optical switch, demonstrating "his technical expertise and ability to lead," said Koss.

Miglani is now responsible for all new product development activities, as well as providing technical direction, guidance and support throughout product implementation. The goal is to bring photonic switches into the mainstream for high-speed networking. CALIENT enables photonic networks with its 3D micro electro mechanical system (MEMS) switches, which have shown 8 years of successful continuous operation in more than 80,000 optical terminations. In late 2011, CALIENT raised a $19.4 million round of venture financing to expand into data center and cloud computing markets and ramp its new portfolio of 3D MEMS photonic switching systems and modules.

Miglani joined CALIENT Technologies in 2010 as director of software engineering and was responsible for overseeing all aspects of software-related projects for the company’s full range of photonic switches. He has previous experience in data center connectivity at Juniper Networks; engineering and operations at 3Com’s India Development Center; and software engineering at Lucent Technologies, Bay Networks/Nortel, and Essar Telecom. Miglani holds a bachelor’s degree in computer science from the Regional Engineering College in Kurukshetra, India.

CALIENT Technologies provides adaptive photonic switching with systems that build service providers, cloud computing, content delivery and government networks. For more information, visit http://www.calient.net.

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April 3, 2012 – PRNewswire — Combining sensors with analog technology to enable sensor fusion will create intelligent devices for automotive, consumer, and industrial markets, said Vijay Ullal, group president of consumer and automotive solutions at Maxim Integrated Products Inc. (MXIM).

Ullal spoke at the 2012 DESIGN West Conference in San Jose, CA in March.

Motion, touch, pressure, and temperature sensors are used in applications from cars and smartphones to smart homes and medical instruments. Analog integration with sensor fusion will pave the way for a new world of devices with which humans will interact in a natural way, Ullal said. Technology’s next phase enables it to "virtually disappear," said Ullal, with pervasive sensors and controls in smartphones and wireless networks. Highly integrated systems on chips (SoCs) will enable these new interactions.

Applications:
In the home, lighting, heat and air, security, and safety monitoring systems will become accessible and manageable via a cell phone. Clean, conscious and connected automobiles will save many of the more than two million lives lost each year due to traffic accidents and outdoor air pollution. In healthcare, portable diagnostic and imaging devices will enable in-home monitoring, thus enhancing patient care. In our communities, the measurement of energy creation, distribution, and usage will be available via highly integrated metering systems-on-chips (SoCs).

Maxim makes highly integrated analog and mixed-signal semiconductors. In July 2011, Maxim acquired SensorDynamics, a privately held semiconductor company that develops proprietary sensor and microelectromechanical systems (MEMS). For more information, go to www.Maxim-ic.com.

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April 3, 2012 — The innaugural MEMS Industry Group (MIG) MEMS Executive Congress Europe, held in March in Zurich, included keynotes on automotive, healthcare, and consumer micro electro mechanical system (MEMS) applications.

Smart industrial systems will use sensors and software algorithms to interpret data from electronic devices, said Siemens’ Thomas Scheiter. Scheiter called MEMS “the nervous system of machines.” Along the same vein, VTI Technologies’ Hannu Laatikainen called MEMS a way for automobiles to "see, feel, hear, smell and taste."

Gyroscopes and radio-frequency (RF) MEMS enable biofeedback for athletes in multi-level sensor networks, noted Suunto’s Terho Lahtinen. This is one of many healthcare applications, where MEMS are "essential" to bringing the patient and healthcare closer together, said Philips Research Laboratories’ Hans Hofstraat. MEMS can help promote self-management of chronic disease, and are the basis of many effective, minimally invasive therapies, Hofstraat said.

Speaking on the industry as a whole, Karen Lightman, managing director of MEMS Industry Group, noted that "MEMS is growing at an exponential pace," in consumer, automotive, smart industrial systems, and quality of life (QoL)/biomedical devices. "MEMS is enabling functionality that we have only just begun to imagine, such as cars that drive themselves, or biomedical systems that minimize surgery and miniaturize therapy for diseases such as diabetes and Parkinson’s. While the design of these applications is vastly different, a common interest in integration, mass production, safety and reliability applies across the board.”

Read Lightman’s op-ed on the MEMS conference here

MEMS Executive Congress Europe 2012:
Attendees: 150+
Ssponsors:
Platinum- EV Group.
Gold- Applied Materials and SPTS Technologies.
Silver- Analog Devices and Semefab.
More- ACUTRONIC, AEPI, A.M. Fitzgerald & Associates, Asia Pacific Microsystems, Bosch, Bosch Sensortec, CEA Léti, CSEM, Freescale Semiconductor, Fries Research & Technology (FRT), GSA, IHS iSuppli, imec, iNEMI, IVAM, Plan Optik, Maxim, MST BW, NMI, Okmetic, Smart Systems Integration, SEMICON Europa, Solid State Technology, SVTC and Yole Développement.

The US edition of MEMS Executive Congress will be held November 7-8, 2012 at The Westin Kierland Resort & Spa, Scottsdale, AZ. MEMS Industry Group (MIG) is a trade association for advancing MEMS across global markets. For more information, visit www.memsindustrygroup.org.

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April 3, 2012 — The MEMS packaging sector is growing 2x faster (~20% CAGR) by unit shipments than the larger IC packaging industry, shows Yole Développement in its report “MEMS Packaging.” Wafer level packaging (WLP) and through-silicon via (TSV) technologies will see the fastest growth, with leadframe and organic laminate-based packages hitting 16% CAGR over the next 5 years.

There are plenty of MEMS and sensors to be found in recent smartphone designs: MEMS accelerometers, gyroscopes, pressure sensors, electronic compass magnetometers, multiple silicon MEMS microphones, FBAR / BAW filters & duplexers, RF switches and MEMS oscillators: there is no doubt that MEMS content is growing faster than standard IC content.

Figure. Key elements of a MEMS package. SOURCE: MEMS Packaging Report, Yole.

In terms of how the packaging is involved, it’s all about orchestrating the assembly of MEMS sensor and their related ASIC inside a module. But this is costly: packaging, assembly, test and calibration steps account for nearly 35% to 60% of a total MEMS packaged module’s cost.

MEMS types of packaging are more complex than most standard IC packages because they require “System-in-Package” type of assembly. Additionally, most MEMS packages are connecting sensors to their final environment, bringing very specific constraints at the module level such as building a cavity, a hole in the substrate or metal lead for pressure sensor and microphones, an optical window for optical MEMS, a full vacuum hermeticity at the die level.

The application scope of MEMS is broad and very diversified. Since its early beginnings, the MEMS industry faced the issue of being a highly fragmented market, with NO manufacturing standards clearly emerging.

However, the MEMS law “One MEMS = 1 Device with 1 Process with 1 Package” is now changing as several packaging platform standards are now clearly emerging (such as WLP & TSV interconnects, SiP module assembly based on molded or cavity packaging for e.g.)
This Yole Développement’s report is featuring a full analysis of packaging, assembly & test requirements application by application as well as a dedicated focus on MEMS package substrates such as ceramic, leadframe and organic laminates.

While there are a lot of developments happening for high reliability, low cost MEMS packages in the automotive, medical and industrial application space, the number of MEMS and sensors going into mobile, consumer and gaming applications is expected to continue to skyrocket, driving integration of an incredibly high number of MEMS and sensor devices in unprecedented volume. As a result, OSAT and wafer foundry players are getting more and more interest in MEMS module packaging, as volume and complexity of
MEMS SiP modules is increasing dramatically, implying several key trend in this space:
— IDMs needs to find second sources partners and qualify some OSATs in order to secure their supply chain
— Standardization (coming from both foundries, OSAT, WLP houses or substrate suppliers) is critical and necessary to implement in order to keep the packaging, assembly, test and calibration cost of MEMS modules under control.

More than ever, system-level integration (including package co-design & software competencies, SiP module assembly, passive integration and 3D TSV / WLP capabilities) will be key to leverage a high added value solution to final OEM customers as well as an efficient infrastructure to support the high volume grow of consumer MEMS applications. “There are many different players with different designs, and it’s not likely we’ll see one solution adopted by all the players. Expect to see a blooming of several “big niches” standards in the future, driven by the biggest and most successful players,” says Laurent Robin, Activity Leader,

Report authors:
Jérôme Baron is the business unit manager of the advanced semiconductor packaging market research at Yole Développement. He has been following the 3D packaging market evolution since its early beginnings at the device, equipment and material levels. He was granted a Master of Science degree from INSA-Lyon in France as well as a Master of Research from Lyon Institute of Nanotechnology.

Laurent Robin is in charge of the MEMS & Sensors market research at Yole Développement, with a focus on inertial sensors and RF-MEMS related technologies. He holds a Physics Engineering degree from the National Institute of Applied Sciences in Toulouse, plus a Master Degree in Technology & Innovation Management from EM Lyon Business School, France.

Companies cited in the report:
AAC Acoustic Technologies, Aichi MI, AKM, Akustica, Amkor, Analog Devices, ASE, Avago Technologies, bTendo, Bosch, Carsem, Canon, China WLCSP, Colibrys, DALSA / Teledyne, DelfMEMS, Denso, Discera, DRS, Epcos – TDK, EPWorks, FLIR Systems, Freescale, Fujifilm Dimatix, Fujikura, GE Sensing, Goodrich-AIS, Hana Microelectronics, Honeywell, Hosiden, HP, Infineon, Invensense, Ion Torrent, JCAP, J-Devices, Kionix, Knowles Electronics, KYEC, Kyocera, Lemoptix, Lexmark, Lingsen, MEM Hitech, Melexis, MEMJET, MEMSiC, Microvision, Miradin, Murata, NEC / Schott, Oak-Mitsui, NXP Semiconductor, Olympus, Omron, Panasonic, PlanOptik, PoLight, Pyreos, Qualcomm MEMS Technologies, Raytheon, Rohm, Rood Microtec, Sand9, Sencio, Seiko-Epson, Sensata, Sensonor, Sensor Dynamics, Shinko, SiTime, Silex Microsystems, Silicon Sensing Systems, Sony, SPIL, StatsChipPAC, STMicroelectronics, Systron Donner Inertial, Taiyo-Yuden, Tecnisco, Teramikros, Texas Instruments, Tong Hsing Electronics, Triquint Semiconductor, Tronics Microsytems, TSMC, ULIS, Unimicron, Unisem, UTAC, VTI Technologies, WiSOL, Wispry, X-Fab, Xintec, Yamaha…

Yole Développement is a group of companies providing market research, technology analysis, strategy consulting, media and finance services. Learn more at www.yole.fr.

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