 Trillions of holes create insulating vacuums around nanowires. (Photo: IBM) |
May 4, 2007 — IBM claims the first-ever application of self-assembling nanotechnology to conventional chip manufacturing. The company says it has harnessed the natural pattern-creating process that forms seashells, snowflakes, and tooth enamel to form trillions of holes and thereby create insulating vacuums around the miles of nano-scale wires packed next to each other inside each computer chip.
IBM researchers say the electrical signals on such chips can flow 35 percent faster, or the chips can consume 15 percent less energy, compared to the most advanced chips using conventional techniques.
“The IBM-patented self-assembly process moves a nanotechnology manufacturing method that had shown promise in laboratories into a commercial manufacturing environment for the first time, providing the equivalent of two generations of Moore’s Law wiring performance improvements in a single step, using conventional manufacturing techniques,” the company asserts.
This new form of insulation, commonly referred to as “airgaps” by scientists, is a misnomer, as the gaps are actually vacuums, absent of air. The self-assembly process enables the nano-scale patterning required to form the gaps; this patterning is considerably smaller than current lithographic techniques can achieve.
A vacuum is believed to be the ultimate insulator for wiring capacitance, which occurs when two conductors, in this case adjacent wires on a chip, sap energy from one another, generating heat and slowing data transmission.
Until now, chip designers often were forced to fight capacitance issues by pushing ever more power through chips, creating a range of undesireable side effects. They have also used insulators with better insulating capability, but these insulators have become tenuously fragile as chip features shrink.
The self-assembly process already has been integrated with IBM’s manufacturing line in East Fishkill, New York and is expected to be fully incorporated in IBM’s manufacturing lines and used in chips in 2009. The chips will be used in IBM’s server product lines and thereafter for chips IBM builds for other companies.
“This is the first time anyone has proven the ability to synthesize mass quantities of these self-assembled polymers and integrate them into an existing manufacturing process with great yield results,” said Dan Edelstein, IBM Fellow and chief scientist of the self-assembly airgap project.
Edelstein led the IBM team that invented the technique to use copper wiring in computer chips instead of aluminum, now a standard method for producing chips, ushering in a decade of chip innovations from the IBM labs that transformed how chips were built and used across many industries and applications.