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Jan. 16, 2007 — DuPont Microcircuit Materials, part of DuPont Electronic Technologies, announced the introduction of its 7th Generation DuPont Fodel photoimageable thick-film pastes for the metallization of the front bus electrode used in plasma display panels (PDPs).

The 7G Fodel pastes provide improved image quality and enable substantial cost reductions through lower paste consumption and reduced precious metal content, according to the company. The 7G DuPont Fodel photoimageable thick-film paste is fully lead free and is intended to provide the same cost-effective, high-performance metallization for PDPs expected from the industry-standard DuPont Fodel system.

“The rapid growth in the PDP market has put pressure on suppliers to develop lower cost and higher performance materials solutions, including improved image quality through better bright and dark contrast and finer resolution for full high definition (Full HD) television,” said Walt Cheng, global business director, DuPont Microcircuit Materials, in a prepared statement.

“Customers using the 7G system have targeted reduced ruthenium (Ru) and other precious metal content, and lower paste usage as key strategies for cost reduction. Our 7G products allow PDP manufacturers to substantially reduce paste usage, to deliver world class image quality and finer line resolution for Full HD designs. We expect this to support the continued growth of the PDP industry and allow more consumers to enjoy the visual experience offered by high definition, flat panel plasma televisions.”

Unidym signs OLED agreement


January 15, 2007

Jan. 15, 2007 — Arrowhead Research Corp. of Pasadena, Calif., announced that its majority-owned subsidiary, Unidym, has entered into a collaborative agreement with the Institute of Materials Research and Engineering (IMRE) in Singapore to develop organic light emitting diodes (OLEDs) incorporating transparent electrodes made of carbon nanotubes.

Under the terms of the agreement, Unidym will provide IMRE researchers with access to its proprietary, carbon nanotube-based, transparent electrodes which IMRE will incorporate into its OLED devices.

According to iSuppli Corp., the market for OLEDs was $408 million in 2004 and is expected to reach $2.9 billion by 2011. Arrowhead says carbon nanotube-based transparent electrodes have the potential to improve the performance of OLEDs while also reducing their production costs.

“We believe IMRE is a world leader in OLED technology and are pleased that Unidym has entered this collaboration with such a distinguished institution,” said R. Bruce Stewart, Arrowhead Research chairman, in a prepared statement. “We will continue to look for strategic partners to integrate Unidym’s transparent electrodes into optoelectronic systems.” Arrowhead has an 88 percent ownership stake in Unidym.

Jan. 15, 2007 — Harris & Harris Group Inc. announced that it has invested $4 million as a lead investor in a Series D Preferred round of financing in Xradia Inc., of Concord, Calif., that includes an investment from an existing investor.

Xradia designs, manufactures and sells a suite of ultra high resolution 3D x-ray microscopes and fluorescence imaging systems capable of nondestructive micrometer and nanometer scale imaging of internal structures of semiconductor ICs and packages as well as biological specimens.

As part of the deal, Alexei Andreev of Harris & Harris Group will join the board of directors.

Jan. 12, 2007 — Nanophase Technologies, a Romeoville, Ill., maker of nanomaterials and advanced nanoengineered products, announced that Kevin Wenta has joined Nanophase as executive vice president, sales and marketing

Wenta served as a general manager at Eastman Chemical Company, successfully leading a turnaround of its $520 million resins, monomers and textiles businesses. He also held the position of director of corporate strategy.

Before joining Nanophase he was a partner of Accenture, a global consultancy. In his 20 year career, he has also held positions with ChemConnect (formerly CheMatch), a global electronic chemical exchange, financial positions at ARCO and sales positions with Elemica and Shell Chemical. He holds a degree in chemical engineering from the University of Texas at Austin and an M.B.A. from the University of Chicago.

Jan. 12, 2007 — Heidelberg Instruments, a German manufacturer of maskless lithography systems, announced a record order intake in 2006.

The company said system order intake increased by more than 70 percent compared to the 2005 fiscal year and roughly 25 percent over the previous record set during the 2000 fiscal year.

It said various geographic markets, particularly Europe and North America, had significant growth. There was expansion in the research and development market, and a healthy increase in the production related segment, according to a company statement.

“Outstanding performance by development, marketing and production, as well as the strong commitment of our sales partners in the individual countries, made this good result possible. We look forward to an even better 2007,” said Michael Fangerau, chief executive officer, in a prepared statement.

With an installation base in more than 30 countries, Heidelberg Instruments is a leader in production of high precision maskless lithography systems. These systems are used for direct writing and photomask production by universities and industrial organizations in the areas of microelectronic packaging, MEMS, bioMEMS, nanotechnology, ASICS, TFT, plasma displays, micro optics, and many other related applications.

smalltimes wire story

Jan. 11, 2007 — Nanosys Inc. and DoCoMo Capital Inc., a wholly owned US subsidiary of NTT DoCoMo Inc., announced they have entered into an exclusive collaboration agreement among Nanosys, DoCoMo Capital, and NTT DoCoMo Inc. to develop Nanosys’ nanotechnology platform for potential product opportunities in wireless communications for mobile telephone applications in Japan.

Under the terms of the agreement, NTT DoCoMo and DoCoMo Capital will fund development efforts at Nanosys and NTT DoCoMo. In addition, DoCoMo Capital announced its equity investment in Nanosys. Financial details of the agreements were not disclosed.

“NTT DoCoMo actively promotes the development and introduction of new services and technologies ahead of its competitors, and recognizes the potential of Nanosys’ technology in addressing numerous emerging wirelesss communications opportunities,” said Calvin Chow, Nanosys’ chief executive officer, in a prepared statement.

Jan. 11, 2007 — Molecular Imprints Inc. (MII), an Austin, Texas, maker of nano-imprint lithography systems, announced the shipment of an Imprio 250 for Next Generation Lithography (NGL) to a leading semiconductor memory manufacturer.

The company says its Step and Flash Imprint Lithography (S-FIL) technology can replicate the ultra high resolution of e-beam lithography with the low cost of ownership of optical lithography to provide a manufacturing solution that can be extended through multiple technology generations. The expected initial use of the system will be process development and device prototyping at 32nm and below.

“MII has made tremendous progress over the last 12 months to provide an NGL solution to the semiconductor industry. This tool sale is a clear validation of our progress” said Mark Melliar-Smith, CEO of Molecular Imprints, in a prepared statement. “We believe MII’s S-FIL technology is an ideal complement to 193i optical lithography for critical layer applications at the 32nm generation and a complete solution at 22nm.”

In addition to semiconductor applications, Molecular Imprints says its high resolution and low cost S-FIL technology is gaining broader market acceptance by enabling advances in high performance hard disk drives (HDD) and light emitting diodes (LED), which further validates the capability and value of its Imprio products.

Jan. 10, 2007 — Tokyo Electron (TEL), the world’s second largest supplier of semiconductor production equipment, announced the company has acquired Epion Corporation, supplier of gas cluster ion beam (GCIB) technology for diverse semiconductor applications and emerging nanotechnology markets.

Epion’s GCIB is a highly versatile atomic-scale processing technique that is ideal for production applications where surface and film quality are crucial, the company said. Key applications for GCIB include etching, smoothing, doping and physical and chemical surface modification.

“As our customers continue to aggressively shrink geometries and adopt new materials and novel device structures, we believe Epion’s unique technology will find its way into several high volume production applications,” said Lou Steen, vice president of marketing for TEL US and newly-appointed president of TEL Epion, in a prepared statement. “We believe that TEL’s worldwide service and support organizations will greatly enhance customer satisfaction of Epion’s nFusion System and Ultra Trimmer products.”

Jan. 10, 2007 — Virtus Advanced Sensors of Pittsburgh announced it has entered into a strategic collaboration agreement with several Taiwan-based UMC Group companies including Unimicron, Taiwan’s largest printed circuit board (PCB) manufacturer and affiliated MEMS foundry ChipSense. UMC is the world’s second largest semiconductor foundry and parent company of Unimicron.

The companies will collaborate on producing 3-axis accelerometers for a variety of consumer electronics oriented market applications including cell phones, laptop computers and car navigation systems. The agreement includes collaboration on product design, production, marketing and sales activities.

“We believe this alliance will produce the results we are looking for this time next year. Our goal is to eventually establish our technology as the global standard for 3-axis accelerometers for consumer electronics applications. This partnership is a first step toward that goal,” said Virtus President & CEO Louis Ross in a prepared statement.

According to Mr. Ross, “ChipSense has the capability and capacity to deliver reliably volume production,” and has the full support of its parent companies UMC and Unimicron. ChipSense Chairman Simon Chou believes the “collaboration allows both ChipSense and Virtus to benefit a lot from each others complementary strengths. With this collaboration, Virtus has a reliable and capable manufacturing partner, ChipSense, and this is also a further validation of Virtus’ technology. For ChipSense, it will build up very valuable technological know-how and access to a fast-growing market.”

ChipSense President Robert Hsieh believes the collaboration represents “…a historical moment for both Virtus and ChipSense” and looks to introduce 3-axis accelerometer products from the collaboration to the market by Q4 of 2007. ChipSense has expanded its operations over the past several years and is increasing its investment in new equipment and personnel.

The parent company of ChipSense is Unimicron, the 6th largest printed circuit board (PCB) manufacturer in the world and member of the UMC Group.

Unimicron also recently acquired Asia Pacific MicroSystems, Taiwan’s largest MEMS foundry, and now employs more than 350 people working on MEMS.

Production will take place in Hsinchu Science Park, established in 1980. The park is home to most of Taiwan’s producers of wafers, integrated circuit foundries, mask read-only memory, ADSL modems, Web cards, and small thin-film liquid-crystal displays.

By Andreas von Bubnoff
Small Times Contributing Editor

Jan. 9, 2007 — U.S. federal government officials who coordinate nanotechnology research held a public meeting on Jan. 4 to get comments on what types of research are most important to study nanotechnology risks.

The meeting convened experts and stakeholders in Arlington, Va., to present what they thought such research should focus on.

It came more than three months after a report on nanotech risk research needs was issued by the agencies that are part of the National Nanotechnology Initiative, or NNI, the U.S. government program that coordinates nanotech research and development.

The report had been completed just in time for a Sept. 21 Congressional hearing on nanotech risk research. It had been expected to set nanotech risk research priorities. But at the hearing, congressmen complained that it was just a list that failed to set priorities.

“That’s the process we are working on now,” said Norris Alderson, associate commissioner for science at the FDA and chair of the interagency working group that prepared the report. The document identified about 75 nanotech risk research needs, Alderson said, and the Jan. 4 meeting was convened to get input from experts and stakeholders as to how to set priorities among them. “We really need to hear from you, we are serious about this,” Alderson said.

The agenda and presentations from the Jan. 4 meeting are available on the NNCO’s Web site, along with a form for the public to submit comments.

The report identifies research needs in five areas: How to detect and measure nanomaterials; how to reduce the risk of exposure and accidents; effects on health; effects on the environment; and surveillance of human and environmental exposure to nanomaterials.

Many of the presenters mentioned similar areas as ones that need to be addressed. Andrew Maynard, chief science advisor for the Wilson Center’s Project on Emerging Nanotechnologies, said a good test to prioritize risk research is to see if it aims to protect people and the environment from harm. He referred to a recent report where he wrote that research priorities over the next two years should include how to measure exposure, evaluate toxicity, control the release of nanomaterials, and how to develop ways to handle them safely. Other areas that need to be studied include developing instruments that can measure nanoparticles in air and water and predicting the toxicity of new nanomaterials using models, he and others wrote in a recent article in Nature.

Another priority should be research into life cycle analysis of nanotech products, because that will inform about exposures better than toxicology, said Jo Anne Shatkin of the Cadmus Group, an environmental consulting firm.

Several speakers said the safety of workers who manufacture nanotech products needs to be addressed. “Employees have potentially the highest exposure rates because they are exposed to nanomaterials at the workplace,” said Eric Landree of the RAND Corporation, a non-profit think tank. George Kimbrell of the International Center for Technology Assessment agreed, but said that consumer product safety and environmental impacts are also important.

Whatever the case, many research needs should become quite obvious by taking a look at nanotech products, Maynard said. To illustrate the point, he mixed a powdered dietary supplement allegedly containing nano-sized calcium and magnesium particles into a glass of water. Looking at the dietary powder, he said, some questions that come to mind are, what happens in the lungs once the powder is inhaled; does it penetrate the skin; and what does the liquid do in the gut once swallowed? “There are some complex questions associated with prioritization,” he said, “but when you look at products, some of that complexity disappears.”

Much of the risk research should be applied, some speakers said. Just doing exploratory research could lead to investing millions of dollars, Maynard said, only to ask how that research might be useful after it has been completed. “This is a little bit of the wrong way around for some specific questions,” Maynard said.

But others cautioned that without basic research, unexpected results could be missed. Past environmental research has resulted in many surprises, said Arnold Kuzmack, who works for the EPA but said he was giving his personal opinion. “It’s hard to look for something when you don’t know what you are looking for,” Kuzmack said. “I would venture to predict that there will be some big surprises in nanotechnology.”

Still, with a limited supply of money, you first “have to put the money where the immediate issues are,” Maynard said.

Alderson said the meeting was a success. “We feel very good about what we got today,” he said. “We hope we’ll get more in the written comments.” Comments can be submitted on the Web until Jan. 31. But after that, there is no specific timeline, Alderson said, other than “as fast as we can get it done.”

“Once we have your input and the information from the budget agencies we will look at the gaps and that will be our final document,” Alderson told the meeting.

But Maynard said he didn’t think the presenter’s comments were all that helpful, perhaps because the meeting was convened at the last minute just after a major holiday on the first day of Congress.

“A lot of the presentations were using the opportunity to make statements about the state of nanotech risk research,” he said, “as opposed to providing practical guidance of what research needs to be done and how to prioritize that research.”