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Nov. 9, 2006 — The SAES Getters Group, a provider of getter technology for high vacuum applications, and SUSS MicroTec, a supplier of precision manufacturing and test equipment for the semiconductor and emerging markets, are working together to develop their technologies for wafer-level packaging applications for the MEMS industry.

“SAES Getters is extremely pleased with SUSS’ introduction of the M-Lock system for MEMS chip fabrication, since this technology ensures ultra-clean bonding conditions and can therefore support the further spread of wafer-level packaged MEMS products”, said Marco Moraja, MEMS business development area manager at SAES Getters, in a prepared statement.

As a consequence of ultra-clean bonding environments, he said, SAES Getters’ PaGeWafer can completely deploy its gettering capacity inside MEMS devices without losing any gettering capacity during the bonding process.

SUSS MicroTec’s M-Lock system is intended to provide ultra-clean, low-moisture and low-organics environment for vacuum and inert gas wafer bonding. It is intended for high-performance and high-reliability MEMS devices with on-chip getters, such as silicon gyros, resonators, RF switches, display devices, infrared sensors and microbolometers. The M-Lock system maintains high vacuum in the bonder chamber at all times by means of a secondary load lock chamber and also by heating the vacuum chamber walls to reduce the effect of outgassing during wafer bonding.

SAES Getters’ PaGeWafer has been engineered to guarantee long term stability to vacuum or to inert gas atmosphere in wafer-to-wafer hermetically bonded MEMS devices. It consists of a wafer with a patterned getter film, a few microns thick, that is placed onto specific cavities, defined in shape and depth according to customer requirements. By acting as the cap wafer of the MEMS package, PaGeWafer provides maximized sorption of active in order to increase device reliability and lifetime.

Amir Mirza, international product manager for wafer bonders at SUSS MicroTec, said in a prepared statement that the company is will optimize its wafer bonding processes for SAES Getters’ materials technology.

Nov. 8, 2006 — Axsun Technologies Inc., a Billerica, Mass., manufacturer of MEMS-based micro-optoelectronic “spectral engines,” announced the closure of a $15 million Series D financing round.

Electro Scientific Industries Inc., a leading supplier of innovative production laser systems for microengineering applications, led the Series D equity round, which was joined by current investors Prism Venture Partners, Vantage Point Venture Partners and Stata Venture Partners along with other private investors. In addition to the equity financing, Axsun closed an asset backed loan agreement with Bridge Bank.

Axsun said it will use the proceeds to enhance its core spectral engine offerings in industrial process spectroscopy, including the PAT Pharmaceutical, homeland security and optical communications markets.

Axsun has named Steve Harris, vice president of R&D at ESI, to join its board of directors, where he joins Ray Stata, Axsun CEO Dale Flanders, Bill Seifert of Prism Ventures and David Fries of Vantage Point Venture Partners.

Nov. 8, 2006 — Ecology Coatings Inc., an Akron, Ohio, developer of nano-engineered industrial coatings for cleaner, more efficient manufacturing, announced it has entered into a letter of intent with OCIS Corp. (OTCBB: OCIC.OB) to become publicly held through a reverse merger.

Under the terms of the agreement, Ecology Coatings shareholders will exchange their stock for OCIS stock in a merger transaction. As a result of the exchange, the Ecology Coatings shareholders will control OCIS and change its name to “Ecology Coatings Inc.”

As part of the transaction, Ecology Coatings is completing a private placement of its securities to a group of accredited investors. The management of Ecology Coatings will become the management of the public company.

Richard Stromback, Ecology Coatings’ chairman, said in a prepared statement that the transaction will give the company access to the capital markets, provide a platform for it to achieve higher public visibility and allow investors to value the company in relation to its publicly-traded peers.

The transaction is subject to the parties entering into a definitive agreement, which will contain conditions typical in a transaction of this nature. The parties intend to close the deal within 90 to 120 days.

Nov. 8, 2006 — Acacia Research Corp. announced that Acacia Patent Acquisition Corp., a wholly owned subsidiary that is part of the Acacia Technologies licensing group, has acquired rights to a patent relating to aligned wafer bonding technology.

This company said the technology relates to the precision alignment and bonding of micromechanical, electrical and optical structures. An Acacia statement said the technology can be used for the bonding of surface features in the fabrication of MEMS and semiconductor devices.

The Acacia Technologies group develops, acquires, and licenses patented technologies. Acacia controls 53 patent portfolios, which include U.S. patents and certain foreign counterparts, covering technologies used in a wide variety of industries.

Nov. 8, 2006 — 3DIcon Corp., a Tulsa, Okla., development-stage communications technology company, announced that University of Oklahoma researchers, under a sponsored research agreement, have filed a provisional patent application with the U.S. Patent and Trademark Office describing a display system that uses a combination of digital light processors and nanotechnology materials to create full-color, static volumetric, realistic 3D images that can be viewed from any unencumbered perspective.

Principal research and engineering for this system will continue on OU’s Norman and Tulsa campuses. 3DIcon owns the exclusive marketing rights for any commercialization of this intellectual property.

“The University has made several advances which should improve the current state-of-the-art in static-volume 3D displays,” said Philip Suomu, 3DIcon’s director of technology, in a prepared statement. “Recent developments using micro- and nanostructure materials offer new ways of building 3D display systems that were not possible previously. By employing the cross-discipline field of nanotechnology, researchers at the University of Oklahoma are developing methods to produce unique and viable full-color, three-dimensional displays that can be viewed in real time in 360 degrees.

Nov. 7, 2006 — NanoDynamics Inc., a Buffalo, N.Y, diversified nanotechnology and nanomaterials manufacturing company, announced that it will introduce its new NDRevolution 50H portable hybrid solid oxide fuel cell system at the 2006 Fuel Cell Seminar, to be held Nov. 13 to Nov. 16 in Honolulu, Hawaii.

“This system proves the viability of micro tubular SOFCs in portable power applications, successfully moving the technology from the realm of science project to a commercially available product,” said Caine Finnerty, director of technology, in a prepared statement.

The unit is compatible with a variety of commonly available gaseous hydrocarbon fuels including propane and butane. The 50-watt system offers, a fully regulated 12 Volt / 50 Watt power output with a 150 percent overload capacity. This is intended to make the Revolution 50H an ideal power source for recreational, military, commercial and industrial power needs including remote signage, communications, sensing and marine applications.

Nov. 7, 2006 — IMEC, Europe’s leading independent nanoelectronics and nanotechnology research institute, announced it has signed a memorandum of understanding with SemIndia and the Indian Institute of Science in Bangalore as part of an effort to expand its R&D collaborations with Indian semiconductor companies and institutes.

SemIndia is planning to build a semiconductor fab in Hyderabad, India, and wants to take up research with IMEC on the next generations of semiconductor process technologies, according to a press release. IMEC and the Indian Institute of Science will perform joint research on various nanoelectronics process steps.

IMEC’s initiative to strengthen its position on the Indian semiconductor market comes in the wake of India’s plans to give a major boost to the semiconductor industry by expanding nanotechnology R&D at the international science and technology centers and by setting up modern semiconductor fabrication facilities.

SemIndia intends to set up a semiconductor foundry in 2007 with production ramp up beginning of 2009 and with IMEC as a strategic fab technology research partner. Initial collaboration would focus on developing foundry-compatible 130nm and 90nm CMOS processes for logic and mixed-signal products. SemIndia intends to build on IMEC’s long-term expertise in developing and transferring advanced CMOS processes. In a second phase, SemIndia intends to collaborate with IMEC on the 65nm and 45nm semiconductor processes.

The Indian Institute of Science in Bangalore has recently set up an international nano-science centre for R&D projects in nanotechnology applications. IMEC and the Institute intend to perform joint research on new materials for (sub-)45nm CMOS technologies as well as nanotechnology for the post-CMOS era. In addition, RF-CMOS and MEMS have been identified as potential joint research topics. PhD students and researchers will be exchanged and the use of facilities will be shared between the two institutes.

Nov. 7, 2006 — Researchers working on nanowires and compound semiconductors for next generation electronics reported at SEMI NanoForum in San Jose last week that they’re getting practical results by turning their focus to relatively simpler applications, such as batteries and lighting.

MIT professor Angela Belcher reported that improved control of the phage display process to make nanowires has created a new toolkit for an expanding range of potential new applications less complex than advanced circuit assembly, from flagging semiconductor defects to assembling alloys for thin film battery anodes. And compound semiconductor researchers said nanoscale surface engineering is starting to enable economical low-energy white LED lighting.

“This isn’t your usual beyond-CMOS stuff,” noted Robert Doering, senior fellow and technology strategy manager at Texas Instruments, and one of the organizers of the trade group’s meeting on nano manufacturing issues. “It’s more like beyond CMOS — sideways.”

Belcher reported her lab at MIT, in conjunction with colleagues Paula Hammond and Yet-Ming Chiang, has developed viruses that stick to dislocations in silicon, for easily locating defects in germanium on silicon wafers. They’ve also gotten good results, at least under laboratory conditions, with viruses that attach to fatiguing sections of alloys in aircraft engine parts, to quickly flag potential failure areas. And taking the biological process with its expanded repertoire of inorganic materials back to the medical world, they’re developing a detector that marks the different stages of colon cancer.

Belcher noted that evolving viruses to selectively stick to just about any desired material is now very easy to do. “We have high school students do it, or visiting physicists, and we teach it in our undergraduate labs,” she said. They pick a group of likely viruses from libraries developed by the drug industry, expose the viruses to the desired material to find ones that stick, wash off all those that don’t, feed the few that do into bacteria to grow a new generation, and repeat the processes. It typically takes about five rounds to get an organism that attaches stably to the desired metal, insulator, or semiconductor. Add a fluorescent tag, spray a solution of the viruses on a surface that might containing a material of interest, and they’ll mark it if it’s there.

The MIT group has reported steady progress in the trickier work of getting the viruses to coat themselves with particular materials from solution by cloning back into their DNA to change receptors on their surface. Initially the viruses just attached the nanoparticles to their head, or at scattered spots along their 880nm length. Making too many changes to their coating DNA created unstable organisms that fell apart.

But researchers have now gotten better at making bigger changes, creating viruses that can not only coat themselves with an orderly arrangement of material all along their rod-shaped bodies, but can now do so with two different materials at once. “New genetic engineering in the last year now allows alloys,” said Belcher. The group is working on the synthesis of three materials at once, such as InGaN for solar cells, but that’s proving more difficult.

Designing a virus that can coat itself with both cobalt (as Co3O4) and gold from solution enables researchers to make a densely packed monolayer of crystalline nanowires for a thin film battery anode that has 2X to 2.5X higher energy density than current electrode materials.

It’s made by a simple low-cost process of dipping a polymeric electrolyte film into several solutions. Currently the thin-film electrolyte and anode are attached to a conventional cathode, while researchers work on developing viruses that can grow the trickier three-material cathode. Still, Belcher projected the current proof of concept work could lead to a working thin film battery prototype in two years or so. “I like starting with a simple system, where things don’t have to be perfectly aligned,” she said. “We’re working now on a problem we think we can solve.”

Improving nano-control of semiconductor deposition and doping processes, and nano-engineering of surfaces, could make high efficiency LED lighting economic in about two years, potentially saving billions in energy costs and carbon dioxide emissions, argued Steven DenBaars, of the University of California Santa Barbara. Progress in atomic-level control of deposition, parts per billion control of doping, and nano structuring of the device surface, have brought the efficiency of white gallium nitride (GaN) LEDs up to 130 lumens per watt in recent months, to surpass fluorescent bulbs as the most efficient light source.

That means a 7W LED can put out the same amount of light as a conventional 60W light bulb, or as a 15W compact fluorescent. The LED bulb still costs around $60, but DenBaars pointed out it’s dropped from more than $100 last year, and figured it’s likely to get down to $20 in about two years, shrinking the payback period to about a year.

Making a layer of micro cones across the GaN device surface lets more light out much more effectively with less scattering, as does a mega cone of zinc oxide, or an imprinted diffraction grating. “The ability to fabricate at the nano-level gives a great increase in light output,” said DenBaars, noting 2X to 3X improvements from such surface treatments.

The current generation of white LEDs are mostly used in cell phone backlights, but the new low power, high brightness versions are showing up in off-grid streetlights in Japan, powered by solar cells and battery packs, and a hundred will reportedly line the main entry road for the Beijing Olympics. The low power lights are also likely to be particularly useful in hybrid cars, and are slated to be used on the 2007 Toyota Camry.

Yang Yang of UCLA argued that organic LEDs could likely reach the same levels of high efficiency with similar nano surface engineering. Currently his lab is producing light at 20 lumens per watt efficiency from a simple polymer coating between two electrodes. But noted Yang, “It’s just coated on, and most of the light is trapped in the glass. Substrate engineering should improve it significantly.” He pointed out that the OLED is a planar, not a point source, and its production is very cheap and very high yield.

– SEMI

Nov. 6, 2006 — NaturalNano Inc. a Rochester, N.Y., nanotechnology and materials science company, announced its strategy to focus on the nanocomposite market for its first products.

The company said its first products will be a family of turn-key additives, consisting of halloysite nanotubes concentrated and mixed with different polymer materials, which are intended for use in the manufacture of nanocomposite materials for industries such as automotive, aerospace, electronics, and sporting goods.

NaturalNano believes that these products will provide a unique combination of performance, processing, and cost advantages over nanocomposite materials currently on the market. The company says it is currently running manufacturing scale trials and anticipates it will be possible to introduce its first product into the nanocomposite market in 2007.

Nov. 6, 2006 — nGimat Co. of Atlanta announced it has been awarded a one year, $390,000 Phase II Small Business Innovative Research (SBIR) project with a second optional year consisting of an additional $360,000 to develop yttrium aluminum oxide nanopowder that can be processed into transparent, small grained polycrystalline, laser host materials. The research project is funded by the Office of the Secretary of Defense and is monitored by the Army Research Laboratory in Adelphi, Md.

Successful completion of Phase II objectives would position nGimat to sell nanopowder for production of military and commercial High Energy Laser (HEL) systems. Solid-state lasers are used in a variety of industrial applications including materials processing, healthcare, basic research, instrumentation, and microelectronics.

In the previous Phase I effort, nGimat succeeded in producing high purity, crystalline nanopowders that were pressed and sintered into polycrystalline Nd doped YAG pellets. The Phase II program is intended to enable further development and manufacturing scale up to produce commercial quantities of ultrapure unagglomerated yttrium aluminum oxide nanopowder with a particle size less than 100 nm in diameter.