Tag Archives: Small Times Magazine

July 13, 2006 – Nano-Tex Inc., a textile technology company providing nanotechnology-based enhancements to the apparel and commercial interiors markets, announced that James Curley has been appointed president and chief executive officer of the company and named to its board of directors.

Curley joined Nano-Tex as chief financial officer in June 2005 and was responsible for all financial and administrative functions of the company, as well as supply chain management. In December 2005, Curley was named interim CEO, responsible for the company’s leadership and direction, after Nano-Tex’s contract with previous CEO Donn Tice expired and Tice left the company.

In his new position, Curley will continue to oversee all aspects of the company’s worldwide business operations including its continued expansion into the apparel and commercial interiors markets.

Prior to joining Nano-Tex, Curley was chief financial officer of LeapFrog Enterprises Inc., where he was part of the senior team that led LeapFrog to become the nation’s third largest toy manufacturer with sales of $680 million. From 1992 to 1998 he was chief financial officer and chief administrative officer of The Gymboree Corp.

July 12, 2006 – Synova, a Lausanne, Switzerland, developer of water jet-guided laser technology, announced that it will open its first micro-machining center in the United States, specifically in the San Francisco Bay Area.

Slated to open in January 2007, the center will serve as a competence center for demonstration, sample testing and application development. In addition, this facility will offer micro-machining services to local industry. Until now, the company’s application labs were based at Synova’s headquarters in Switzerland.

The company said the establishment of a customer support center in the U.S. fortifies its global expansion efforts, providing an optimum environment for the company to better serve its customers throughout the world.

Synova’s proprietary Laser MicroJet technology is intended to replace traditional cutting technologies, such as conventional lasers and diamond blade saws. Featuring an application laboratory with two of Synova’s most recent Laser MicroJet tools-a LDS 300 A and a LCS 300-the center will provide its customers with quick and effective access to the company’s water jet-guided laser technology and expertise. The new facility will be set up during the next six months and fully operational in the first quarter of 2007.

July 12, 2006 – ASM America Inc., a subsidiary of ASM International N.V. and CEA-Leti have engaged in a joint development research program for the advancement of new front end of line CMOS process technology for nodes at 45nm and below.

The program aims to develop sub-45nm epitaxy and epitaxy pre-clean technologies with the goal of finding alternative processing schemes to obtain improved transistor performance. The project’s main objectives are to facilitate development of new advanced transistor and substrate architectures, CMOS technologies and processes involving advanced low temperature epitaxy and epitaxy pre-clean technologies.

The companies aim to develop selective and blanket strained silicon processes for recessed and elevated source drain applications and use of SiGe and Ge films to design advanced CMOS channels and substrate schemes. The first phase of research will be conducted on ASM’s 200 mm Epsilon tool, migrating to the advanced Epsilon 300 mm tool in later phases. Work will be conducted at CEA-Leti MINATEC research facilities in Grenoble, France.

July 10, 2006 – Tessera Technologies Inc., a provider of miniaturization technologies for the electronics industry, unveiled Shellcase CF, a wafer-level technology for optical components integrated into electronic products such as miniaturized cameras in camera phones, digital still cameras and video camcorders.

Suitable for image sensors, certain types of MEMS and other optical devices, Shellcase CF is intended to protect the components from contamination from the initial stage of processing and is compatible with conventional Chip-on-Board (COB) assembly processes.

Tessera says an immediate targeted application of the technology is for CMOS and CCD image sensors used in camera phones. For these applications, Shellcase CF is engineered to provide up to a 40 percent improvement in yield over existing COB technology. The company says the yield improvement is realized through the protection of the sensor’s active area from contamination and the ability to perform wafer-level image testing prior to module assembly, both of which significantly improve camera module yield and dramatically reduce overall cost.

Shellcase CF is the newest addition to Tessera’s Shellcase wafer-level technology family and shares some similarities with COB construction. However, unlike COB technology, Shellcase CF encapsulates the image sensor, MEMS or other optical device with a glass cover that is elevated from the silicon surface using cavity walls. The cover design leaves the image sensor bond pads exposed allowing for standard wire-bond assembly. The protected die is then singulated and mounted to the board using standard die attach processes.

Tessera is currently licensing the technology to interested parties. Prototype samples for evaluation are available.

July 11, 2006 – Entegris Inc. announced the introduction of its LiquidLens UPW (ultrapure water) purification system. The company says the immersion lithography innovation combines advanced technology and process expertise from both Entegris and the former Mykrolis as a result of their merger in August 2005.

The LiquidLens system is intended to provide the highest water purity level at the temperature and pressure required. Entegris says it has delivered several LiquidLens systems for evaluation and process development use to several major customers. According to Entegris, these leading companies are turning to the LiquidLens system to ensure that precisely controlled UPW is provided to advanced lithography processes as the companies move to production.

Immersion is the newest lithography technique for printing 45 nm or smaller features on semiconductor wafers, using ultra pure water between the optical lens and the wafer. The UPW lens is utilized to significantly improve image resolution. The water must be extremely pure as the smallest impurity can damage image resolution, react with the photoresist, or contaminate the lens.

July 11, 2006 – Soitec, the France-based manufacturer of silicon-on-insulator (SOI) wafers and other engineered substrates, unveiled its new expansion development strategy aimed at addressing the growing worldwide demand for SOI and other engineered substrates.

The company reported it is expanding its existing production capacity base in France, while also augmenting its global industrial presence with a new production plant based in Singapore.

“Our strategic investment plan is built around the concept of first developing the engineered substrate technologies the semiconductor industry needs, and then investing in the production capacity to meet customer demand for these technologies.” said Andre-Jacques Auberton-Herve, president and CEO of Soitec, in a prepared statement. “Our historical research alliance with the CEA Leti Research Laboratory, together with our location in the Grenoble area — and its unwavering support for public and private partnerships — remains a cornerstone of our ability to maintain our leadership.”

As of March 2006, total investments in Soitec’s Bernin plants top more than 350 million Euros. The company’s investments are expected to exceed 500 million Euros when fully equipped, with a total workforce in Bernin of approximately 1,000 people. The Group confirmed that two additional 300 mm lines will be installed in Bernin II during the first half of the current year.

In order to raise production capacity and R&D even further and support recently acquired Grenoble-based TraciT Technologies, the company has also recently purchased, for approximately 13 million Euros, 1,300 square meters of equipped cleanroom space from MEMSCAP (Euronext: MEMS), which is located adjacent to Soitec’s Bernin facility. This boosts Soitec’s potential maximum production capacity to an estimated (mid-term range) of one million 300 mm wafers annually, compared to current potential of 720,000 wafers per year.

Complementing the company’s concurrent expansion efforts in Bernin, Soitec has selected Singapore as the site for its new 300 mm SOI fab, referred to as Fab 3. Slated to break ground in late August, the fab will feature more than 4,000 square meters of cleanroom space, with additional land for future expansion, if needed. The total investment is expected to reach 350 million Euros once the fab is running at full capacity. With production starting mid-2008, final capacity is expected to be one million wafers per year — which will ramp over a two-year period in sync with growing market demand. By 2009, the facility is expected to employ approximately 500 people.

July 11, 2006 – Freescale Semiconductor has broken away from the pack in the race to commercialize magnetoresistive random access memory, or MRAM.

The Austin, Texas-based company announced on Monday that it is in volume production of the world’s first commercially available MRAM chip. The chip is intended to combine at least three qualities that previously had been unavailable together.

“For the first time, we have a semiconductor memory with fast read-write, non-volatility and unlimited read and write times,” said Saied Tehrani, director of MRAM technology for Freescale, a Motorola spin-off. “We’ve never had all those characteristics together on one chip before.”

Tehrani said initial markets for the new chip, the MR2A16A, will include printing, gaming, home-security and networking systems. The device’s non-volatile memory will be valuable in systems that have data-logging capabilities and must be re-set to previous configurations, he said. Additional opportunities include using MRAM as cache memory for larger density memories and, eventually, “instant on” capabilities for a wide range of devices. “Your device would no longer have to boot up,” Tehrani says. “It would always be ready in the correct configuration.”

Further advantages are that MRAM can be manufactured as a single-component system on a chip, doing away with multiple component configurations such as SRAM powered by batteries. Freescale’s MRAM can also be integrated with existing CMOS processes.

Will Strauss, president of semiconductor analysis firm Forward Concepts, calls MRAM the “Holy Grail” of computer memory. In addition to MRAM’s speed, non-volatility and endurance, Strauss says integration with CMOS is critical. “We’ve always thought MRAM was going to be great,” Strauss said. “The breakthrough here is you can stack it on top of your processors.”

Bob Merritt of Semico Research called the product announcement a major milestone. He said commercially available MRAM — even in smaller configurations such as Freescale’s initial 4-Mb chip — represents the next step in moving computer memory toward emerging device designs.

“What we have now [in memory technology] was perfected while the semiconductor industry was supporting box-level computer stuff,” Merritt said. “We don’t live in that world anymore. We are all moving to mobile, portable platforms, without access to wall power, where all data comes from existing wireless connections.”

That future, Merritt continued, will demand memory that is always-available, fast, dense, and, eventually, reprogrammable and re-configurable on-the-fly.

One disadvantage of MRAM — compared to today’s SRAM, DRAM or Flash — is cost. Freescale is pricing its initial 4-Mb MRAM chip at about $25 each for quantities of 1000. However, Strauss and Merritt both see MRAM prices going down as production ramps up, and Merritt says Freescale is doing the right thing by focusing first and foremost on embedded applications rather than going after the commodity-priced volume memory market.

“You have to have something that is approaching SRAM speeds at a cost ratio somewhere between DRAM and SRAM,” Merritt noted. “If you have those two things, and the memory is also non-volatile, durable and can be put on an existing processor, you really have something.” Merritt likes the automotive semiconductor market in particular for the new chip, foreseeing significant growth in the amount of controllers on each vehicle and thus steep demands from the automotive sector for fast, affordable and non-volatile memory.

Richard Gordon, managing vice president of the semiconductor group for Gartner, also liked the prospects for Freescale’s chip, which is being manufactured at Freescale’s 200mm Chandler Fab in Arizona. “If you look at the last big new memory market, NAND Flash, it is now worth $10 billion,” he noted. “It takes about five to ten years to get to commercial market volume, so Freescale is being realistic. They are going after markets that absolutely need the technology, need the robustness of the device and can pay $25 for a chip.”

Freescale announced 40 customers for its new chip, and said it expected sales to complete by the end of the year. In addition to producing embedded processor applications, the company plans to license the technology to partners in the semiconductor, consumer technology, military and networking fields, among others. It has already announced one such partnership with Honeywell.

Merritt expects the announcement to spur efforts by other companies to step up their MRAM capabilities. Companies like IBM, Infineon, NEC, Samsung, Sony and dozens of others, he said, have been working on ways to manufacture MRAM in commercial quantities for many years. Most have been quiet of late, but Merritt thinks Freescale’s announcement may wake up the space.

“You get in a room with all these semiconductor or memory companies, and they all are announcing they can do something better, faster, denser,” Merritt said. “Then you ask who is ready to take customer orders, and Freescale is the only hand that goes up. I think this may generate a lot more interest in commercially-available MRAM.”

July 10, 2006 – Veeco Instruments Inc. of Woodbury, N.Y., announced the launch of its new Caliber low-cost, high-value scanning probe microscope (SPM).

The company says the Caliber is able to perform a variety of SPM research and industrial applications on samples of various sizes.

“Our new Caliber ‘mini-SPM’ provides a highly affordable, compact and flexible research solution for materials, surface sciences, and polymer studies,” said Jeannine Sargent, executive vice president of metrology & instrumentation, in a prepared statement.

“Furthermore, the Caliber’s attractive price point will make Veeco’s industry leading SPM technology attainable to a broader group of industrial researchers and makes an excellent entry-point SPM for new users in an educational setting or in emerging high-tech growth markets such as China and India.”

The Caliber’s open-platform, closed-loop design is intended to allow researchers to customize hardware and optimize electronics for application versatility. Other features include real-time software with line-by line analysis, oscilloscope, FFT, and leveling functions.

July 10, 2006 – The first commercial magnetoresistive random access memory (MRAM) device is now in volume production and available from Freescale Semiconductor.

The device, the MR2A16A, is intended for a variety of commercial applications such as networking, security, data storage, gaming and printers. The part is engineered to be a reliable, economical, single-component replacement for battery-backed SRAM units. The company says it could also be used in cache buffers, configuration storage memories and other applications which require the speed, flexibility and non-volatility of MRAM.

Manufactured at Freescale’s 200 millimeter Chandler Fab in Arizona, the device is available at an SRP of $25 in volumes of 1,000 units.

“Competition to become the first company to market MRAM technology was fierce,” said Bob Merritt of Semico Research in a prepared statement. “This is a significant achievement that certainly confirms the dedication of Freescale’s engineering team.”

MRAM uses magnetic materials combined with conventional silicon circuitry to deliver the speed of SRAM with the non-volatility of Flash in a single device. The commercialization of the technology could hasten new classes of electronic products that offer significant advances in size, cost, power consumption and system performance.

– David Forman

July 7, 2006 – Altair Nanotechnologies Inc., a supplier of ceramic nanomaterials and high-power battery systems technology, announced it has received a $750,000 initial order for its fast charge, high powered batteries from Phoenix Motorcars, a Calif. company that intends to make full function, freeway ready electric automobiles.

The battery packs will be engineered and manufactured at Altairnano’s Anderson, Indiana facility and will utilize Altairnano’s proprietary nano-lithium ion battery technology. Phoenix Motor Cars is using the engineering services of Boshart Engineering, Inc., based in Ontario, California, to develop the battery integration, validation, certification and regulatory testing.

In early 2005, Altairnano announced that it had developed innovative battery electrode material that in independent testing exhibited very fast charge characteristics. In September 2005, the company announced it had taken additional steps to commercialization by acquiring a leading-edge battery design and implementation group which it co-located in Reno, Nevada and Anderson, Indiana. On February 1st, 2006 Altairnano announced that it had started the manufacture of battery cells in its Anderson facility, and on May 23rd, Altairnano announced that these battery cells had passed key safety tests conducted by Altairnano.

The next step, before engaging with an electric vehicle supplier, was to partner with an expert in electric drive-trains and a company who had an established track record in vehicle roadworthy compliance. On May 8th, 2006 Altairnano announced it had signed an agreement with Boshart Engineering. Together Boshart and Altairnano proposed an integrated drive-train and battery system to Phoenix Motorcars.