10/24/2016  180nm CMOS and HV-CMOS MPW runs are now manufactured in ams' 200mm fabrication facility in Austria.

10/24/2016  SEMICON Europa co-locating with productronica and electronica, expanding electronics focus.

10/19/2016  SEMI Korea has hosted a SEMI member event every year for its members since 2008 to provide networking opportunities and insight on the ever-changing issues in the industry.

10/13/2016  Semiconductor Manufacturing International Corporation, the largest and most advanced foundry in Mainland China, today held the groundbreaking ceremony of a new 12-inch wafer fab in Shanghai to meet SMIC Shanghai's increasing production and development needs.

10/07/2016  The company announced today that it has leased a former Qualcomm-owned manufacturing facility in Silicon Valley and will relocate its current US headquarters and NFC Innovation Center in the first quarter of 2017.

10/06/2016  The parties decided to it was not in the best interests of their respective stakeholders to continue pursuing the merger after the U.S. Department of Justice advised KLA-Tencor and Lam Research that it would not continue with a consent decree that the parties had been negotiating.

10/05/2016  Today, SEMI announced an exceptional lineup of keynotes at SEMICON Japan's "SuperTHEATER" focusing on innovation and insights into the future of the electronics supply chain.

09/21/2016  At the 2016 ECTC Conference, TSMC discussed their UFI (UBM-Free Integration) Fan-In WLCSP technology which they claim enables large die fine pitch packages.

09/21/2016  The conference and networking event, will be held at the iconic Hotel del Coronado in San Diego on May 14-17, 2017.

09/20/2016  Ted Shafer of ASML reports on the highlights from the ?200mm manufacturing session during SEMICON West, organized by the SEMI Secondary Equipment and Applications Special Interest Group.

09/19/2016  The organizations will expand the scope of their R&D collaboration to focus on advancing Fan-Out Wafer-Level Packaging (FOWLP), a key technology inflection expected to help make chips and end-user devices smaller, faster and more power efficient.

09/19/2016  As we have predicted two and a half years back, the industry is bifurcating, and just a few products pursue scaling to 7nm while the majority of designs stay on 28nm or older nodes.

09/16/2016  Nordson Corporation today announced it plans to combine its existing screw and barrel operations in Youngstown, Ohio; New Castle, Pennsylvania; and Pulaski, Virginia into a single expanded manufacturing center of excellence in Austintown, Ohio.

09/14/2016  SEMI today announced that twenty-one start-ups have been selected to pitch to investors and exhibit their products at SEMICON Europa's INNOVATION VILLAGE in Grenoble, France at the Alpexpo from 25-27 October, 2016.

09/01/2016  SEMI announced today that the deadline for presenters to submit an abstract for the annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC) is October 17.

08/23/2016  2016 is a turning point for the Fan-Out market since both leaders, Apple and TSMC, changed the game and may create a trend of acceptance of Fan-Out packages

08/23/2016  Total pure-play foundry market expected to jump 9% this year, up from 6% growth in 2015.

08/19/2016  ARM and Intel Custom Foundry this week at the Intel Developer Forum in San Francisco an agreement to accelerate the development and implementation of ARM SoCs on Intel’s 10nm process.

08/17/2016  SEMI announced today that over 43,000 visitors are expected to attend SEMICON Taiwan September 7-9 at the TWTC Nangang Exhibition Hall in Taipei.

08/16/2016  New wafer processing technologies overcome FOWLP’s technical hurdles, paving the way for a new generation of ultra compact, high I/O electronic devices.