03/29/2016  Texas Instruments Incorporated (TI) announced that Devan Iyer has been elected vice president of the company.

03/08/2016  Paul Lindner, executive technology director at EV Group, is the recipient of the 2015 European SEMI Award.

02/25/2016  What’s the single area that is being most disrupted by emergent technologies like the Internet of Things (or the Internet of Vehicles) and Silicon Photonics? We think it’s packaging.

02/23/2016  Recent capital spending trends indicative of maturing semiconductor industry.

02/18/2016  Fairchild Semiconductor's board of directors has determined that the unsolicited proposal received from China Resources Microelectronics Ltd and Hua Capital Management Co., Ltd. does not constitute a “Superior Proposal” as defined in the company’s agreement with ON Semiconductor.

02/16/2016  According to the latest market study released by Technavio, the global wafer-level manufacturing equipment market is set to post a CAGR of over 4 percent by 2020.

02/11/2016  EVG joins Leti, STMicroelectronics and Mentor Graphics to develop advanced 3D wafer-to-wafer bonding technologies.

02/08/2016  A new 5D solution utilizes multiple types of metrology systems to identify and control fab-wide sources of pattern variation, with an intelligent analysis system to handle the data being generated.

02/08/2016  TSMC this weekend announced that the earthquake of 6.4 magnitude which struck southern Taiwan at 3:57 am on February 6, 2016 did not cause any serious personnel injuries nor any structural or facility damage to the Company’s Fab 14 and Fab 6 manufacturing sites in the Tainan Science Park.

02/08/2016  A research team at the Department of Electrical and Electronic Information Engineering at Toyohashi University of Technology has developed a wafer-level packaging technique to integrate a silicon large-scale integration (LSI) chip in a very thin film of a thickness 10 ?m.

02/04/2016  The health of the IC industry is increasingly tied to the health of the worldwide economy. Rarely can there be strong IC market growth without at least a “good” worldwide economy to support it.

02/02/2016  Presto Engineering Inc. announced this week that it has significantly expanded its turnkey capabilities with the opening of two new manufacturing hubs and a world-wide logistics center in Asia.

02/02/2016  TowerJazz, the global specialty foundry leader, announced today that it completed its previously announced acquisition of an 8-inch wafer fabrication facility in San Antonio, Texas, United States from Maxim Integrated Products, Inc.

01/15/2016  Will work with Leti, STMicroelectronics and Mentor Graphics to develop advanced 3D die-to-wafer stacking technologies using direct Cu-Cu bonding

01/13/2016  The mobile sector is driving production and market growth; however a new market driver, IoT is on the horizon and is expected to have a significant impact on the advanced packaging industry.

01/12/2016  Worldwide semiconductor capital spending is projected to decline 4.7 percent in 2016, to $59.4 billion, according to Gartner, Inc.

01/11/2016  Technavio's market research analysts estimate the semiconductor capital spending market in the US, to grow at a CAGR of around 9% between 2015 and 2019.

01/08/2016  Worldwide semiconductor revenue totaled $333.7 billion in 2015, a 1.9 percent decrease from 2014 revenue of $340.3 billion, according to preliminary results by Gartner, Inc.

01/07/2016  GlobalFoundries, TSMC, SK Hynix show greatest gains in wafer capacity in 2015.

01/07/2016  “In like a lion, out like a lamb” is just half the story for 2015. While initial expectations forecasted a double-digit growth year, the world economy faded and dragged our industry down to nearly flat 2015/2014 results.