10/27/2015  mCube announced the industry’s first 3-axis accelerometer which is less than a cubic millimeter in total size.

10/22/2015  Total wafer shipments this year are expected to exceed the market high set in 2014 and are forecast to continue shipping at record levels in 2016 and 2017.

10/22/2015  A report that resulted from a workshop funded by Semiconductor Research Corporation and National Science Foundation outlines key factors limiting progress in computing and novel device and architecture research that can overcome these barriers.

10/20/2015  An advance look at some of the most newsworthy topics and papers that will be presented at this year's IEEE International Electron Devices Meeting.

10/19/2015  We are in a historic era for consolidation among semiconductor manufacturers, and the reasons are surprising.

10/19/2015  Applied Materials, Inc. announced it plans to establish a new R&D laboratory in Singapore in collaboration with the Agency for Science, Technology and Research (A*STAR).

10/12/2015  According to a new market research report published by MarketsandMarkets, the market is expected to grow at a CAGR of 6.83% between 2015 and 2020, and reach $4.94 Billion by 2020.

10/12/2015  Penn State materials scientists have discovered a way to give the transistor a boost by incorporating vanadium oxide.

10/07/2015  CEA-Leti announced that it has joined the GLOBALSOLUTIONS ecosystem as an ASIC provider, specifically to support GLOBALFOUNDRIES' 22FDX (TM) technology platform.

10/06/2015  DCG Systems announced the release of the Meridian M (TM) system for isolation of routine and challenging electrical faults at the wafer level.

10/06/2015  Entegris, Inc. has expanded its wafer shipper family of products with the SmartStack (R) 300 mm Contactless Horizontal Wafer Shipper.

10/06/2015  The 2015 market for dielectric precursors is expected to total $230M, of which over $45M is attributed to low-k dielectrics.

10/05/2015  Altatech announced the expansion of its Eclipse series with a new, high-speed inspection system dedicated to ultra-thin, transparent and bonded substrates inspection for 3D applications in power, MEMS, and mobile technologies.

10/05/2015  Showa Denko has developed a new grade of silicon carbide (SiC) epitaxial wafers for power devices with very low defect density.

10/05/2015  The path to alternative scaling is now open.

09/30/2015  Novati Technologies Inc. announced the availability of an advanced Integrated Sensor Platform, placing a wide variety of sensors onto multi-layer stacks of wafers in order to consume less power and perform significantly faster while reducing overall footprint.

09/29/2015  D2S announced that it has partnered with Advantest to integrate D2S' Wafer Plane Analysis engine into Advantest's Mask MVM-SEM (Multi Vision Metrology Scanning Electron Microscope) systems.

09/29/2015  Acquired patents to enhance Rudolph’s inspection capabilities in advanced packaging and extend inspection into new applications

09/28/2015  The official Call for Papers has been issued for the 2016 Symposia on VLSI Technology and Circuits, to be held at the Hilton Hawaiian Village June 13-16, 2016 (Technology) and June 15-17, 2016 (Circuits).

09/28/2015  The Full Service Foundry division of ams AG today announced a further expansion of its industry-leading 0.35µm High-Voltage CMOS specialty process platform.