06/14/2013 

In a keynote at the IEEE International Interconnect Technology Conference (IITC), Douglas Yu from TSMC talked about Moore’s Law scaling becoming increasingly difficult.

06/06/2013 

Advanced packaging technology is undergoing dramatic changes as the smart phones and new sensor technologies demand continued improvements in form and function.

06/04/2013 

Fab equipment spending will grow two percent year-over-year  (US$ 32.5 billion) for 2013 and about 23 to 27 percent in 2014 ($41 billion) according to the May edition of the SEMI World Fab Forecast.

05/29/2013 

The semiconductor industry’s march toward broader 3D IC integration marked an important milestone this week at ECTC 2013, with the report of an advanced new temporary bonding solution for 3D TSV semiconductor packaging.

05/29/2013 

OMRON Corporation today announced that they have finished development work on the world's first infrared sensor manufactured with wafer-level vacuum packaging technology to create a 16x16 element MEMS non-contact infrared thermal sensor capable of highly precise 90-degree area detection.

05/29/2013 

Mentor Graphics Corp. today announced significant achievements in its continued collaboration with TSMC on 20nm physical verification kit optimizations.

05/28/2013 

Signetics Corporation today announced that it has again approved capex plans that will further expand their capacity for flip chip package assembly at their factory in Paju, South Korea.

05/20/2013 

Mentor Graphics Corp. and Tezzaron Semiconductor Corp. today announced they are collaborating to integrate the Mentor Calibre 3DSTACK product into Tezzaron’s 3D-IC offerings.

05/18/2013  The most functionality at the least cost is the promise of wafer-level packaging (WLP) when dealing with complex integrated circuits (IC) with a high number of input/output connections to the outside world.

05/15/2013 

Yole Développement announced its 2.5D, 3DIC and TSV Interconnect Patent Investigation report. For this analysis of 3D packaging technology patents, more than 1800 patent families have been screened.

05/14/2013 

Sales in March 2013 were up slightly compared to February 2013 and March 2012.

05/13/2013 

Silex Microsystems, the world’s largest pure-play MEMS foundry, today announced that it has joined an international European Union-funded program aimed at developing a new MEMS manufacturing platform based on advanced inkjet-based printing technologies.

05/02/2013 

MOSIS, a provider of low-cost prototyping and small volume production services for custom ICs, has teamed up with imec, Ireland's Tyndall National Institute and ePIXfab, the European Silicon Photonics support center providing low-cost prototyping services for photonic ICs.

05/02/2013 

Endicott Interconnect Technologies, Inc. (EI) announced that its System-In-Package (SiP) technology performed successfully in a military test of a small hit-to-kill interceptor designed to defeat rocket, artillery and mortar attacks.  

05/02/2013 

The worldwide semiconductor assembly and test services (SATS) market totaled $24.5 billion in 2012, a 2.1 percent increase from 2011, according to final results from Gartner, Inc.

05/01/2013 

Amkor Technology, Inc. today announced that Stephen D. Kelley has been appointed to serve as president and chief executive officer and as a director of the company, effective May 8, 2013.

04/19/2013 

North America-based manufacturers of semiconductor equipment posted $1.14 billion in orders worldwide in March 2013 (three-month average basis) and a book-to-bill ratio of 1.14, according to the March Book-to-Bill Report published today by SEMI.

04/11/2013 

Over the last few years, glass has gained considerable interest from the semiconductor industry due to its very attractive electrical, physical and chemical properties, as well as its prospects for a relevant and cost-efficient solution. The application scope of glass substrates in the semiconductor field is broad and highly diversified.

04/11/2013 

Increased spending in NAND and flash by Micron, LEDs by Philips and Osram, and continued investments by GLOBALFOUNDRIES will create new opportunities for equipment and materials suppliers in Southeast Asia.

04/03/2013 

The Temescal Division of Ferrotec Corporation today announced the Temescal UEFC-5700, a ultra-high efficiency electron beam metallization system for lift-off compound semiconductor applications.