02/12/2013 

Worldwide silicon wafer revenues declined by 12 percent in 2012 compared to 2011, according to the SEMI Silicon Manufacturers Group (SMG) in its year-end analysis of the silicon wafer industry.

02/07/2013 

Although many are small companies manufacturing low-pin count devices, all of the world’s “Top 10” OSAT, Outsourced Semiconductor Assembly and Test, players have one or more assembly and testing facilities in China.

02/07/2013 

In the first of two installments, we examine the global issues facing the semiconductor industry, as released by Linx Consulting in The Econometric Semiconductor Forecast.

02/07/2013 

A new econometric semiconductor industry forecast predicts semiconductor wafer area production to grow slightly less than 6% in 2013, according to Linx Consulting.

02/06/2013 

SEMATECH announced today that Araca Inc., a leading provider of products and services for chemical mechanical planarization research and development, and the International SEMATECH Manufacturing Initiative (ISMI) are partnering to deliver CMP processing and productivity solutions to help chip manufacturers increase yields, reduce equipment downtime and lower consumables costs.

02/05/2013 

Dow Corning and IBM scientists unveiled a major step in photonics yesterday at the Photonics West conference, using a new type of polymer material to transmit light instead of electrical signals within supercomputers and data centers.

02/05/2013 

Spending on research and development by semiconductor companies grew 7% in 2012 to a record-high $53.0 billion, even though the semiconductor market declined 1% to $317.6 billion.

01/30/2013 

IPC recently released the C revision of IPC-7095, Design and Assembly Process Implementation for BGAs.

01/30/2013 

STATS ChipPAC and UMC announced the world's first demonstration of TSV-enabled 3D IC chip stacking technology developed under an open ecosystem collaboration.

01/30/2013 

Renesas and J-Devices signed a memorandum of understanding regarding the transfer of the semiconductor back-end production business of three facilities operated by Renesas’ wholly owned manufacturing subsidiaries

01/24/2013 

Imec and PVA Tepla say they have achieved void detection in through-silicon vias at wafer level, after TSV copper plating, thanks to a nondestructive high-frequency scanning acoustic microscopy (SAM) technique.

01/24/2013  Looking at 2014, we see challenges and innovations in both the front-end semiconductor and 3D TSV markets.

01/18/2013 

Novati Technologies Inc. has licensed Ziptronix's direct bonding technologies, "direct bond interconnect" (DBI) and "direct oxide bonding (ZiBond), to offer 3D stacking services and test to customers.

01/11/2013 

GlobalFoundries says it plans to build a $2 billion "Technology Development Center" R&D facility at its Fab 8 campus in Saratoga County, NY, for semiconductor technology development and manufacturing:  EUV lithography photomasks to new interconnect and packaging technologies enabling 3D chip stacking, "and everything in between."

01/03/2013 

80 percent of the devices used for portable and mobile applications are currently manufactured on 200mm or smaller wafers. How this plays out going forward could change who the dominant players will be.

01/02/2013 

Advanced packaging requirements are driving the evolution of back end manufacturing to become more similar to the front end.

01/02/2013 

The development of innovative technologies that solve the critical issues for the transition and adoption of 450-mm manufacturing will be the defining factor for whether a company merely survives or thrives.

12/24/2012 

Are we closer than we think to our needed mass production costs for silicon interposers? Phil Garrou gleans some insights from the year-ending RTI Architectures for Semiconductor Integration and Packaging conference.

12/19/2012 

Singapore's Institute of Microelectronics (IME) has launched a new multiproject wafer service for 2.5D through-silicon interposers, to provide a cost-effective platform for R&D prototyping and proof-of-concept in the technology.

12/17/2012 

Tezzaron Semiconductor has licensed patents regarding Ziptronix's direct bonding technologies, "direct bond interconnect" (DBI) and "direct oxide bonding (ZiBond), for use in 3D memory.