11/07/2012 

Deca Technologies has introduced a new chip-scale packaging (CSP) product line for applications where its existing wafer-level CSP option isn't a good fit. Details and analysis to come.

11/01/2012 

X-Fab Silicon Foundries says it has become the majority shareholder in German MEMS Foundry Itzehoe GmbH (MFI), the latest in a series of recent moves to raise its profile as a top MEMS foundry.

10/22/2012 

With the approach of full commercial production of 3DIC products, Dr. Phil Garrou shifts his attention to thermal performance questions and proposed thermal solutions for the future.

10/16/2012 

SEMI has extended the deadline to submit proposed papers to next spring's China Semiconductor Technology International Conference 2013, and added a new symposium on circuit design, system integration, and application.

10/12/2012 

The advent of leading-edge semiconductor packaging technologies dictates efficient use of capital, and only the top-tier semiconductor assembly and test services (SATS) companies will have the financial wherewithal to develop required expertise and capacity, says one analyst.

10/10/2012 

Nanium says it has shipped its 200 millionth embedded wafer-level ball grid array technology (eWLB) component, a 10% year-over-year productivity increase that reflects full conversion to the company's eWLB overmold technology that allows thinner and more robust packages.

10/09/2012 

Devan Iyer, director of Semiconductor Packaging in Texas Instrument’s Manufacturing Group, has joined the advisory board of The ConFab.

10/08/2012 

Four of the leading micro- and nanoelectronics regions in Europe are joining forces to form a cluster alliance called “Silicon Europe.”

10/02/2012 

Sand 9 is partnering with GlobalFoundries for high-volume manufacturing of its microelectromechanical systems (MEMS) timing technology, which incorporates silicon-on-insulator (SOI) and through-silicon vias (TSV).

09/27/2012 

Researchers at the Karlsruhe Institute of Technology (KIT) say they have developed a novel optical connection process for semiconductors using "photonic wire bonding" that achieves data transmission rates of several Tbit/sec.

09/20/2012 

The first working 3D NAND flash memory at sub-40nm feature sizes will be described by Macronix researchers at this year’s International Electron Devices Meeting (IEDM).

09/20/2012 

At this year’s IEDM, a team led by Korea’s Gwangju Institute of Science and Technology will detail a high-speed pattern-recognition system comprising CMOS “neurons” and an array of resistive-RAM (RRAM)-based “synapses,” which demonstrated STDP, a brain-like function.

09/20/2012 

At the upcoming International Electron Device Meeting, Macronix researchers will describe how they built flash memories that could heal themselves by means of tiny onboard heaters that provide thermal annealing just at the spots where it is needed.

09/17/2012 

The 58th annual IEDM will take place December 10-12, 2012 at the San Francisco Hilton Union Square, preceded by a full day of Short Courses on Sunday, Dec. 9 and by a program of 90-minute afternoon tutorial sessions on Saturday, Dec. 8.

09/14/2012 

Singapore’s A*STAR’s Institute of Microelectronics (IME), and Hitachi Chemical Co., will be collaborating on a joint research program to develop high performance material technologies for thin wafer processing for 3D IC packaging.

09/10/2012 

09/06/2012 

An unidentified "premier global industry research center in Asia" will use Rudolph Technologies' MetaPulse G metrology system in its advanced packaging process development activities.

09/04/2012 

Ultra Tec Manufacturing has released a new endpoint detection module for its ASAP-1 IPS selected area preparation system, for improving electronic package decapsulation and sample preparation.

09/04/2012 

Wafer probe card maker FormFactor has agreed to acquire fellow probe card supplier MicroProbe, with a combined entity rivaling top-seller Micronics in the high-growth probe card market.

08/29/2012 

STATS ChipPAC says it has expanded its through-silicon via (TSV) capabilities with a 300mm mid-end manufacturing operation targeting mid-end-of-line semiconductor manufacturing, including microbump technology down to 40?m, temporary bond/de-bonding, backside via reveal, isolation, and metallization.