09/13/2017  Cadence Design Systems, Inc. today announced new capabilities that complete its holistic, integrated design flow for TSMC's advanced wafer-level Integrated Fan-Out (InFO) packaging technology.

09/12/2017  2017 fab equipment spending (new and refurbished) is expected to increase by 37 percent, reaching a new annual spending record of about US$55 billion.

09/01/2017  In 2018, 7.7 percent growth is expected, resulting in another record-breaking year—totaling $53.2 billion for the global semiconductor equipment market.

08/28/2017  The ConFab – an exclusive conference and networking event for semiconductor manufacturing and design executives from leading device makers, OEMs, OSATs, fabs, suppliers and fabless/design companies – announces the 2018 event will be held at THE COSMOPOLITAN of LAS VEGAS on May 20-23.

08/22/2017  Samsung remains the “wild card” with regard to 2H17 capital expenditures.

08/21/2017  TowerJazz to gain up to 50% of the planned fab loading capacity.

08/16/2017  Chipmakers want every part of the wafer to yield good die. Advances in process technologies have just about made this a reality, even as feature dimensions continue to shrink and devices grow more complex.

08/04/2017  Q2 sales are highest on record, 5.8 percent more than previous quarter, 23.7 percent higher than Q2 of last year.

07/31/2017  TECHCET's model shows all slack soon gone from supply-chain for both 300mm and 200mm diameter.

07/27/2017  Fan-out packaging is an established technology for many mobile applications. Whereas early semiconductor packages have been single-chip packages, the continuing trend of expanding the wiring surface to support increased functionality has led to more complex packages, stacked packages, systems inpackageaswellashigh-performancepackages. With this development, fan-out technology is bridging a gap between cost-competitive packaging and high performance.

07/26/2017  Through the first half of the year, 2017 equipment billings are 50 percent above the same period last year.

07/21/2017  Atlas 0.3 mm pitch spring probe validated at customer site.

07/20/2017  Advances in semiconductor and related devices are driving significant progress in our increasingly digital world, and the place to learn about cutting-edge research in the field is the annual IEEE International Electron Devices Meeting (IEDM), to be held December 2-6, 2017 at the Hilton San Francisco Union Square hotel.

07/20/2017  Grant from Energy Department's Advanced Research Projects Agency-Energy supports further development of cutting-edge gallium nitride-based power electronics at SUNY Poly.

07/18/2017  The Semiconductor Industry Association (SIA) announced Mark Durcan, former CEO of Micron Technology, Inc., and a longtime leader in advancing semiconductor technology, has been named the 2017 recipient of SIA's highest honor, the Robert N. Noyce Award.

07/14/2017  Leti today announced that the European FP7 project PLAT4M has now been completed with results that exceeded expectations.

07/12/2017  Worldwide sales of new semiconductor manufacturing equipment are projected to increase 19.8 percent to total $49.4 billion in 2017, marking the first time that the semiconductor equipment market has exceeded the market high of $47.7 billion set in 2000.

06/28/2017  Each year at SEMICON West, the “Best of West” awards are presented by Solid State Technology and SEMI.

06/20/2017  What if the automotive industry had achieved the incredible pace of innovation as the semiconductor industry during the last 52 years?

06/20/2017  Industry experts answer questions about the new standard in a virtual roundtable.