03/17/2006  March 17, 2006 - Honeywell Electronic Materials has developed a new screen printable phase-change material to give chipmakers more flexibility in applying the heat-conducting materials during the semiconductor packaging process.

03/09/2006  Clinton, NY — Indium Corp. of America will exhibit its wafer and chip bumping and semiconductor packaging materials offerings at IMAPS' International Conference and Exhibition on Device Packaging (DPC 2006), to take place March 20–23, 2006, in Scottsdale, Arizona, at booth #35.

03/01/2006  When considering cleaning lead-free residues, what needs to be asked first: must I, should I, can I, can I afford to, or can I afford not to?

03/01/2006  It’s official - the nanos are coming. While not yet battering our packaging gates, they are within sight of our walls, and advancing rapidly.

03/01/2006  Various flip chip systems have been used for advanced packages, including chip scale packages (CSPs) and ball grid arrays (BGAs).

02/28/2006  MEPTEC Symposium Wrapup
By Julia Goldstein, Ph.D., Advanced Packaging contributing editor
Thermal management continues to be a "hot" area, and MEPTEC's second annual "The Heat is On" symposium on February 16^th packed the hall despite the plethora of events covering the topic.
(February 28, 2006)

02/22/2006  February 22, 2006 - NEC Corp. has developed what it claims is the world's smallest fiber-optic electric field probe, to be used for evaluating electrical characteristics inside high-density LSI packages.

02/16/2006  San Jose, CA — Tessera Technologies and UTStarcom have signed a licensing and development agreement, in which Tessera will license its Tessera Compliant Chip (TCC) semiconductor packaging technologies to UTStarcom. Both companies have collaborated on developing UTStarcom's MobileCard technology, which is an ultra-miniaturized mobile phone module that is equivalent to the size of two SIM cards.

02/09/2006  February 9, 2006 -- PennWell Corporation has named veteran publisher David Barach to the position of group publisher of Solid State Technology and Advanced Packaging Packaging magazines, effective February 1.

02/09/2006  Nashua, NH — PennWell Corp. has named veteran publisher David Barach to the position of Group Publisher of Advanced Packaging Magazine, effective February 1^st.

02/01/2006  Meeting the Challenge

01/23/2006  Carlsbad, CA — Palomar Technologies has named Bruce W. Hueners as its new president, having most recently held the position of COO. Since joining the company in 1981 when it was Hughes Aircraft, he has played significant roles in elevating Palomar to its market position in the optoelectronics industry, bringing about a series of acquisitions and partnerships, and in expanding the company's business in the U.S., Europe, and Asia.

01/20/2006  Nashua, NH — Advanced Packaging, in collaboration with Connector Specifier and SMT Magazines, will host a "Lead-free Success Stories" webcast on February 15, 2006, at 1:00 p.m. EST.

01/09/2006  January 9, 2006 -- /MARKET WIRE/ -- MILPITAS, Calif. -- Intersil Corporation (NASDAQ: ISIL), a world leader in the design and manufacture of high-performance analog solutions, has introduced a new family of single and dual port dual protocol transceivers featuring the industry's highest ESD (electrostatic discharge) rating and best price/performance in a tiny, space saving, QFN package.

01/01/2006  Like baseball and apple pie, innovation has long been a hallmark of American culture.

01/01/2006  The never-ending quest to reduce manufacturing costs while still maintaining fast product development cycles and delivering reliable products is a dilemma that faces all electronics manufacturers.

01/01/2006  Providing a Critical Link

12/01/2005  In the month of December, as one year nears its close, I begin to think about where the world of advanced packaging has been and will go.

12/01/2005  Latest Technologies in Optical Inspection

12/01/2005  Whichever way you read the data or interpret the signs, modern product lifecycles are diminishing quickly enough to stretch the limits of feasibility.