03/01/2005  The search for lead solder alternatives is stimulating interest in isotropic conductive adhesive assembly for flip chip interconnection.

02/09/2005  (February 9, 2005) Chandler, Ariz.—Amkor Technology Inc. recently reported Q4 sales of $453 million, down 8% from Q3 of 2004, and down 1% from Q4 of 2003. The company's Q4 net loss was $36 million, or ($0.21) per share, compared to net income of $23 million or $0.13 per share in Q4 of 2003.

02/08/2005  (February 8, 2005) Austin, Texas — IMAPS is sponsoring its Topical Workshop (TW) on Flip Chip Technologies, to be held June 20-23, 2005, in Austin, Texas. This meeting is a continuation of the annual Flip Chip Workshop, now in its tenth year, which showcases the latest developments in flip chip technology.

02/07/2005  (February 7, 2005) New Tripoli, Pa. — The semiconductor equipment market grew 52.7% to $33.9 billion in 2004, according to the report, "The Global Market for Equipment and Materials for IC Manufacturing," recently published by the Information Network (www.theinformationnet.com), a New Tripoli, Pa.-based market research company.

02/01/2005  I recently talked to many engineers and forecasters to see how this year has begun and what forces are at work.

01/19/2005  January 19, 2005 - Casio Computer Co. Ltd. and Renesas Technology Corp. have agreed to an arrangement whereby Casio will license its wafer level package (WLP) semiconductor device packaging technology to Renesas. The agreement marks the first time Casio has made its WLP technology available to another Japanese semiconductor device manufacturer.

01/14/2005  (January 14, 2005) Singapore — Advanced Interconnect Technologies (AIT) announces that it has entered into a technology partnership with Towa-Intercon to offer customers cost-effective services and singulation technologies.

01/01/2005  We all know array packaging

01/01/2005  Research and development is critical to future technologies of every sort. In the realm of electronics, R&D is both the heart and life

12/30/2004  The editors and staff at Advanced Packaging would like to wish you all a happy and healthy 2005.

12/30/2004  December 30, 2004 - Parlex Corp. and Infineon Technologies AG have agreed to establish a joint venture company to manufacture and sell advanced technology substrates for secure mobile electronic identification products, said Parlex officials earlier this week. The joint venture will be headquartered in Hong Kong with manufacturing facilities in China.

12/30/2004  (December 30, 2004) Irvine, Calif. — Newport Corp. has updated its financial guidance for Q4 2004, confirming that it expects its sales for Q4 2004 to be within the range announced in October 2004 of $100 million to $103 million.

12/06/2004  (December 6, 2004) Austin, Texas — TechSearch International's new study, Flip Chip and Wafer Level Packaging Trends and Market Forecasts, projects a compound growth rate of over 28% in this market between 2004 and 2009. The report profiles drivers for the demand and requirements by market, investigates the state of the technology, and details the supply base.

12/01/2004  There are few things that mark a person's character more than the way they accept defeat; unless, of course, it's the way they persist through each day and each challenge.

11/18/2004  (November 18, 2004) Willow Grove, Pa.—Kulicke & Soffa recorded net income of $29.1 million in the March quarter and $22.7 million in the June quarter, but now it's back to lean times. Reported net income of $3.3 million or $0.05 per fully diluted share on net revenues of $147.5 million for the quarter ended September 30, 2004.

11/16/2004  There's good news for nano center builders. New construction in the U.S. and the world at universities and national labs is adding more business to the economy. Building nano center facilities is a tricky job. Much of the complexity stems from the fact that the new or remodeled labs are often in the middle of existing campuses.

11/15/2004  (November 15, 2004) Munich, Germany—The Semiconductor Equipment Consortium for Advanced Packaging (SECAP) announces the conclusion of the venture between Amkor, its Unitive subsidiaries, and SECAP to establish the world's first high-volume, 300-mm electroplated solder bumping line using Unitive's technology.

11/11/2004  (November 11, 2004) The Semiconductor Research Corporation (SRC) and the Semiconductor Industry Association (SIA) announce their co-sponsorship of a contest open to North American university students and faculty to create novel, low-power SoC designs that demonstrate the value of greater systems integration in IC design.

11/11/2004  November 11, 2004 - Amkor Technology Inc., its Unitive subsidiaries, and the Semiconductor Equipment Consortium for Advanced Packaging (SECAP) have established a high-volume 300mm electroplated solder bumping line, according to SECAP. The line, which was set up in 2003 at Unitive Semiconductor Taiwan (UST), located in Hsinchu, Taiwan, has reached volume production.

11/10/2004  (November 10, 2004) Singapore—STATS ChipPAC says that it has expanded its die stacking technology to include two leadframe-based performance packages, called the exposed pad thin quad flat pack (TQFP-ep) and the quad flat no-lead (QFN). Die stacking in TQFP-ep and QFN-type packages offers high performance and low cost for consumer, communication, wireless handheld, and portable consumer applications.