Wafer Level Packaging

WAFER LEVEL PACKAGING ARTICLES



MicroScale begins bumping services in Korea

01/01/2002  MicroScale Co. Ltd., Korea's largest chip bumping house, has begun to operate a bumping line for semiconductor chips

The MEPTEC and Advanced Packaging Technologists of the Year Award

01/01/2002  The Third Annual Microelectronics Packaging Technologist of the Year Award, sponsored by the Microelectronics Packaging and Test Engineering Council (MEPTEC) and Advanced Packaging magazine, was presented in October during a special MEPTEC luncheon

Time flies

01/01/2002  We take great pleasure this year in celebrating the 10th anniversary of Advanced Packaging. Yes, it was way back in 1992 when AP hit the streets

Functional tuning of hybrids

01/01/2002  Functional laser tuning of traditional ceramic-based hybrid circuits has been accomplished with the use of a standard 1.064-µm wavelength Nd:YAG laser for more than two decades

Kulicke & Soffa, Amkor Technology complete flip chip technology transfer

12/05/2001  Dec. 5, 2001 - Willow Grove, PA & Chandler, AZ - Kulicke & Soffa Industries Inc. and Amkor Technology have successfully transferred K&S Flip Chip Division's wafer bumping and redistribution technologies to Amkor's wafer bump fabrication facility in Gwanju, Korea.

Electroglas named newest member of SECAP consortium

12/05/2001  Dec. 5, 2001 - San Jose, CA - Electroglas, a supplier of test and inspection equipment, has joined the Semiconductor Equipment Consortium for Advanced Packaging (SECAP).

IMAPS meeting Report

12/01/2001  The exhibit floor at the IMAPS Symposium was not exactly packed, but most conference attendees thought that the turnout and content made it worthwhile

Think TANK

12/01/2001  Four prominent trees grew on the perimeter of the city's Circular Park. The path due south from the cypress tree to the dogwood tree intersected the path due west from the baobab tree to the acacia tree at the Lion Fountain

LSI Logic licenses flip chip technology to AIT

12/01/2001  LSI Logic Corp. and Advanced Interconnect Technologies have signed a licensing agreement under which AIT will license LSI Logic's organic laminate flip chip FPBGA technology

KGD MEETING REPORT

12/01/2001  SIPs at forefront of KGD Packaging and Test Workshop

Kulicke & Soffa, Amkor expand flip chip technologies license agreement

11/08/2001  November 8, 2001 - Willow Grove, PA & Chandler, AZ - Kulicke & Soffa Industries Inc. and Amkor Technology have expanded the 10-year technology transfer agreement between Amkor and Flip Chip Technologies, L.L.C. (FCT), a wholly-owned subsidiary of Kulicke & Soffa.

Options in flip chip cleaning

11/01/2001  Meeting performance and reliability standards

PENNWELL MEMORIAL AWARD ESTABLISHED

10/31/2001  PennWell Establishes Fire Engineering Award Honoring NYFD
PennWell Corp. (parent company of Advanced Packaging, SMT, and Solid State Technology magazines) has established the Fire Engineering Courage and Valor Foundation in honor of the firefighters from the September 11 tragedy.

STATS sets up FastRamp test services; expands test operations

10/29/2001  October 29, 2001 - Singapore and Milpitas, CA - ST Assembly Test Services Ltd. (STATS) and ST Assembly, an independent semiconductor test and advanced packaging service provider, have established a wholly owned subsidiary, FastRamp Test Services Inc., to provide high-end engineering and pre-production test services in Silicon Valley.

ATTENTION APEX 2002 EXHIBITORS

10/25/2001  Editorial Call Deadline Today
If you are an exhibitor at APEX 2002 this year in San Diego, don't miss this opportunity to have one of your debut products listed in our special January issue. Click here for more details.

LSI Logic licenses flip chip packaging technology to Advanced Interconnect Technologies

10/17/2001  October 17, 2001 - Milpitas, CA - LSI Logic and Advanced Interconnect Technologies (AIT) announced a licensing agreement in which AIT will license LSI Logic's organic laminate flip chip FPBGA technology. AIT joins a growing number of companies licensing LSI Logic's flip chip technology, the companies said.

ASE launches volume production of wafer-level chip scale packages

10/11/2001  October 11, 2001 - Santa Clara, CA - Advanced Semiconductor Engineering Inc., a semiconductor packaging and testing company, will launch volume production of wafer-level chip scale packages (CSP) this quarter, ramping up to 2.4 million chips/month.

IMaps flip chip report

09/01/2001  IMAPS flip chip event targets an eager audience

Keeping advanced product development viable

09/01/2001  Nearly every manufacturing company today has resources and budgets assigned to examine future designs of existing products, or to develop new products for existing and new markets

Unitive supports production requirements for Amkor

08/29/2001  August 29, 2001 - Research Triangle Park, NC - Unitive Inc. and Amkor Technology announced the qualification of Unitive's wafer bumping technology for use in Amkor's flip chip product family.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

Sponsored By:

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