04/12/2001  Packaging: The Next Step
The editors of Solid State Technology and Advanced Packaging magazines joined forces to create a special supplement for our readers. From electroplating to flip chip to the basics, we're certain you'll learn something in this must-read issue. Enjoy!

04/01/2001  Mention the word "dot-com" lately and undoubtedly your co-workers will give you a mixed bag of comments, from the "I told you so" naysayers to the "You haven't seen nothin' yet" optimists

03/14/2001  March 14, 2001--Jasper, Indiana--Kimball International, Inc. today announced the opening of its new 40,000-sq.-ft. microelectronics facility in Valencia, CA. As Kimball Electronics Group's (KEG) Microelectronics Center of Excellence, the facility will support wafer and die processing, design and manufacturing of standard and custom monolithic devices, multi-chip modules (MCM's), chip-on-board (COB), and surface mount (SMT) assemblies.

03/14/2001  March 14, 2001--Santa Ana, California--Microsemi Corp. has received a patent for its breakthrough Monolithic Microwave Surface Mount semiconductor packaging technology that eliminates costly ceramic and metal packages commonly used for components operating at frequencies up to 12 GHz in high-speed microwave applications.

03/09/2001  NASHUA, NH - You can't win if you don't enter! Advanced Packaging magazine has launched a new awards competition to celebrate product excellence in semiconductor packaging. Entries need to be postmarked by this Monday (April 16).

03/02/2001  NORTHBROOK, IL - IPC announces that the APEX 2002 Exhibition and Conference will take place January 20-24, 2002 in San Diego, CA.

03/01/2001  There are a few things I can count on hearing when I talk it up with folks in the industry. Among the general niceties people bestow upon us, there is always a mix of good questions, such as "When are you going to cover such-and-such topic?" and "Does this product really work?"

03/01/2001  The decision to use flip chip packaging is not a simple one. Many equipment, product, and process variables affect the relative merits of flip chip vs. wire bonded packages

03/01/2001  In the past, most integrated circuit (IC) packages used wirebonding as the interconnect technology between chip and leadframe

02/21/2001  February 21, 2001--Amkor Technology has filed a packaging patent infringement suit against ST Assembly Test Services, Inc. in Milpitas, CA, and ST Assembly Test Services Ltd. in Singapore. In its suit, Amkor alleges that STATS infringes its U.S. Patent No. 6,143,981 by making, selling, offering for sale, or importation into the U.S. the Quad Leadless Package, which Amkor says infringes one or more of the 19 separate MicroLeadFrame packaging technology claims in the '981 patent.

02/20/2001  FEB. 20 Santa Clara, California--Advanced Semiconductor Engineering Inc. (ASE) and Conexant Systems, Inc. today announced a cross-licensing agreement in which both companies will exchange advanced semiconductor assembly technologies.

02/15/2001  FEB. 15 Willow Grove, Pennsylvania--Kulicke & Soffa Industries Inc. and its Flip Chip Technologies, LLC (FCT) joint venture today announced that Siliconware Precision Industries Co. Ltd. has signed a license for FCT's Ultra CSP wafer-level packaging technology. In addition, Siliconware is expanding capacity for wafers bumped with FCT's Flex-on-Cap (FOC) wafer bumping and redistribution technologies by 80%, under a 10-year technology transfer agreement with FCT signed in December 1999.

02/13/2001  FEB. 13 Sunnyvale, California--The U.S. Patent Office has awarded three new patents to Endwave Corp. that cover key aspects of its flip chip IC (FCIC) technology, the core technology that powers Endwave's ultra-broadband wireless systems. The technologies covered in the patents include: Patent No. 6,094,114--Slotline-to-Slotline Mounted Flip Chip; Patent No. 6,034,580--Coplanar Band Pass Filter; and Self-Biasing RF Transistor Circuit.

02/06/2001  Research Triangle Park, North Carolina--Unitive Inc., a provider of outsourced advanced semiconductor packaging technologies, has closed a $30 million round of equity financing led by Onex Corp. and now plans to build and acquire state-of-the-art wafer level bumping and flip chip fabrication facilities throughout the U.S., Europe, and Asia.

02/01/2001  NASHUA, N.H./TAIPEI, TAIWAN - PennWell Publishing and Arco Publishing introduce Chinese/English editions of Advanced Packaging magazine

02/01/2001  Exatron Inc., San Jose, Calif., has announced the appointments of Bo Mendoza to customer relations manager, Bob Garcia to particle interconnect product manager, and Denise Smith as particle interconnect coordinator

02/01/2001  Excitement abounds here at Advanced Packaging magazine whenever we work on something new. While each and every month we deliver a new magazine to your desk, lately we have also been working on some other projects related to the magazine

02/01/2001  New power and protection devices in wafer-level packaging (WLP) are aiding in the overall reduction of size and weight of portable equipment products

02/01/2001  The expansive growth rate of flip-chip in packaging (FCIP) continues to task flip chip attach (FCA) equipment suppliers with new challenges

02/01/2001  Technology licensing is prolific in many industries, including the pharmaceutical and biotechnology arenas, and is used heavily for consumer products