03/19/2012 

University of Texas at Austin researchers demonstrated high-quality, wafer-scale graphene deposition on evaporated copper films, using an AIXTRON cold-wall vertical BM (Black Magic) Pro reactor.

03/19/2012 

SUSS MicroTec launched the RCD8 manual resist coat and develop platform for R&D and low-volume use in MEMS, semiconductor packaging, LEDs, and other applications.

03/19/2012 

CVD Equipment Corporation (Nasdaq:CVV) purchased a new facility in Central Islip, NY, doubling the space for its CVD and gas control equipment assembly, and unifying its nano-materials lab.

03/16/2012 

AIXTRON's training and demonstration center in Suzhou, China, will focus on improving MOCVD in advanced semiconductor and LED manufacturing operations around China, as well as on employee and environmental safety in electronics production environments.

03/16/2012 

Infineon Technologies ordered the Probus-SiC epitaxy film growth tool from TEL for mass production of advanced SiC power devices.

03/16/2012 

TEL will acquire semiconductor packaging equipment supplier NEXX Systems. NEXX makes advanced deposition equipment, including ECD and PVD tools, for wafer-level packaging (WLP).

03/16/2012 

VLSIresearch released its 2011 Top Semiconductor Equipment suppliers rankings, noting important acquisitions and strong spending in lithography tools in 2011. Semiconductor equipment spending was driven by aggressive capacity expansion in the foundry and logic sectors.

03/15/2012 

Execs from Samsung, IBM, GlobalFoundries and ARM looked to the future at The Common Technology Platform Forum in Santa Clara. They focused on the innovation pipeline for 20nm and 14nm technology nodes, and the role that EUV, FinFETs, TSVs, CNTs and DSA will play.

03/15/2012 

SAFC Hitech opened a multi-million dollar 270000sq.ft. expansion at its facility in Kaohsiung, Taiwan, increasing capacity for high-quality LED precursor production.

03/14/2012 

MATHESON debuted the Lasso System, a customer-centric supply chain and inventory management system that can monitor the location and operating status of gas products and other assets in the REAL-Time Gas and Asset Management System.

03/14/2012 

Twin Creeks Technologies, semiconductor and solar cell manufacturing equipment supplier, debuted its first commercial silicon wafer production system that reduces solar module and semiconductor device wafers by up to 90%.

03/13/2012 

Riber, MBE tool supplier will work with imec on epitaxy process technologies for next-generation III-V semiconductor CMOS devices.

03/13/2012 

RASIRC determined that a new wet thermal oxidation process on a RASIRC Steamer enables 87% better wafer throughput than dry oxidation of uniform thin oxides.

03/13/2012 

Worldwide sales of semiconductor manufacturing equipment totaled $43.53 billion in 2011, representing a year-over-year increase of 9%, shows SEMI. North America surpassed Taiwan as the region with the highest amount of spending.

03/13/2012 

Worldwide semiconductor revenue is projected to total $316 billion in 2012, a 4% increase from 2011, according to Gartner Inc. This outlook is up from Gartner's previous forecast, made in Q4 2011, for 2.2% growth.

03/12/2012 

The Global Semiconductor Alliance (GSA), global semiconductor industry association, appointed Ajit Manocha, CEO of GLOBALFOUNDRIES, to its board of directors. 

03/12/2012 

03/09/2012 

Fraunhofer Center Nanoelectronic Technologies is collaborating with bubbles & beyond to jointly develop novel cleaning solutions for the microelectronics industry, specifically, removing lithographic materials from semiconductor wafers.

03/09/2012 

Siltronic, subsidiary of Wacker Chemie AG, will stop producing 150mm silicon wafers at its Portland, OR, facility in Fall 2012, and will consolidate 150mm production at its Burghausen, Germany, site.

03/07/2012 

Singulus Technologies Aktiengesellschaft (SINGULUS) received 2 orders for its TIMARIS vacuum deposition system from the semiconductor industry.