03/07/2012 

Meaglow Ltd., MOCVD and epitaxy supplier, launched a range of nitrogen-rich indium nitride (InN) wafers for research and industry development around the compound semiconductor material.

03/07/2012 

Researchers from North Carolina State University have developed the first functional oxide thin films that can be used efficiently in electronics, opening the door to an array of new high-power devices and smart sensors.

03/06/2012 

Owens Design Inc. released multiple customized film frame automated handlers to customers in the semiconductor and LED manufacturing tool industries.

03/06/2012 

Semiconductor fab equipment spending will remain flat in 2012, says SEMI. But look for a record spend from semiconductor makers in 2013, jumping from $38.85 billion spent in 2012 to $45 billion in 2013.

03/05/2012 

After only 2 months, semiconductor foundries are already considering raising their 2012 capex budgets, says Terence Whalen, Semiconductor Equipment analyst for North America at Citi.

03/01/2012 

EV Group (EVG) shipped an EVG301 semi-automated single-wafer cleaning system to Tokyo Institute of Technology, for research on advanced optical communication ICs.

03/01/2012 

Air Products will acquire all of DuPont's interest in DuPont Air Products NanoMaterials LLC (DA NanoMaterials), a 50-50 JV that the companies set up for the semiconductor and wafer polishing industries.

02/29/2012 

GLOBALFOUNDRIES appointed Magnus Matthiasson, formerly of Philips Lumileds, as chief procurement officer (CPO), reporting to CFO Dan Durn.

02/28/2012 

The Handbook of Physical Vapor Deposition (PVD) Processing, Edition No. 2 has been released, covering all aspects of PVD process technology, from characterization and preparation of the substrate material, through deposition and film characterization, to post-deposition processing.

02/27/2012 

A common theme among the presenters at SEMI's ISS Europe was how Europe might bridge the so-called “valley of death” between basic research and volume manufacturing.

02/24/2012 

North America-based manufacturers of semiconductor equipment posted $1.18 billion in orders, $1.24 billion in billings, and a book-to-bill of 0.95 in January 2012, according to SEMI.

02/23/2012 

SEMICON China takes place March 20-22 in Shanghai. Check out the special pavillions and events, and keynote speakers scheduled.

02/23/2012 

SEMI’s International Strategy Symposium (ISS) meets for its Europe session February 26-28 in Munich, Germany. Following are some of the 450mm wafer presentations scheduled to take place.

02/23/2012 

AIXTRON SE sold 2 BM Pro 4"-wafer deposition tools to the Italian Institute of Technology for the development and production of graphene used in novel hydrogen storage systems.

02/22/2012 

MCLR's factory in Vladimir, Russia, will manufacture substrates and panels for LEDs requiring thermal management, as well as other electronic devices such as 3D ICs and MEMS. It began operation at 10,000 panels/month.

02/17/2012 

Wright Williams & Kelly, Inc. (WWK) opened its 2012 semiconductor industry survey on equipment and process timing. Only participants will receive the full results, free of charge.

02/16/2012 

Picosun Oy announced record particle levels -- 1-2 added particles (>70nm) per wafer -- with its PICOSUN P-300B ALD batch tool installed at Fraunhofer IPMS.

02/15/2012 

The UpTime sub-atmospheric dopant gas delivery system from Praxair Electronics will be Applied Materials' (AMAT's) factory default standard for the Varian VIISta ion implant platform.

02/15/2012 

IC manufacturers closed 49 wafer fabs between 2009 and 2011, according to IC Insights. Smaller wafer fabs (?200mm) suffered the most closures, and Japan and North America led the way.

02/15/2012 

Tool obsolescence is increasingly important to semiconductor manufacturers running 200mm wafer fab lines, reports ISMI, which has chartered an Equipment Obsolescence Forum for alternative sourcing.