Wafer Processing

WAFER PROCESSING ARTICLES


TSV moves to "real engineering," but reliability data needed

07/11/2011 

Jan Vardaman, president and founder of TechSearch International, summarizes highlights from her SEMICON West presentation on TSVs, speaking to RDL development, LED packaging, and TSV-alternative PoP.
450mm transition: 4 changes you must know

07/10/2011 

Bill Shaner, VP and GM, Microenvironments Division, Entegris, discusses key changes in the semiconductor manufacturing industry's move from 300 to 450mm wafers: Wafer fragility, wafer sag, increased weight, and higher capital investment.
Plasma tool from Nordson MARCH handles 5 wafer sizes

07/07/2011 

Nordson MARCH introduced the FlexTRAK-WF low-cost, cassette-based automated plasma treatment system that handles five wafer sizes with minimal hardware change-over.
2011 Best of West award finalists announced

07/06/2011 

Solid State Technology and SEMI today announced the finalists for the 2011

Avantor, SACHEM selective etch chemisty doubles as wafer cleaner

07/06/2011 

Avantor Performance Materials will launch the first in its new J.T.Baker SLCT Series of selective etch surface treatment chemistries, SLCT 128 sigma etchant, at SEMICON West. The product results from a partnership with etch specialist SACHEM.
Applied heats up RTP for 2Xnm with backside wafer heating

07/01/2011 

Applied Materials' new Vantage Vulcan RTP tool switches the heating to the backside of the wafer, to improve heat distribution and uniformity, widen the temperature range, and shorten residence times -- all of which are important as process technologies shrink to and below the 2Xnm generation, the company says.
Semiconductor sputtering targets headed for 2012 market peak

07/01/2011 

The semiconductor sputtering target market is outgrowing semiconductor fab equipment as a whole, with double-digit growth through 2013. The skyrocketing price of tantalum is a major factor, but not the only one, says Techcet Group.
Semiconductor gases bounce back, wet chemicals on their way

06/30/2011 

Semiconductor wet chemicals saw 13% growth year-over-year in 2010, while the electronics fab gasses market grew 16%, according to 2 new reports from Techcet Group.
Semiconductor industry investing over $40 billion annually, says SEMI

06/30/2011 

The semiconductor industry will invest about $44 billion in production equipment globally in 2011, which industry organization SEMI calls a "record sum."
DuPont perfluoroelastomer parts won't erode in wafer processing

06/29/2011  DuPont Performance Polymers (DuPont) will introduce DuPont Kalrez 9300 and 9500 perfluoroelastomer parts for semiconductor wafer processing at Semicon West.
AMAT RTP heats wafer backside for better temp uniformity

06/29/2011 

Applied Materials Inc. (AMAT) launched the Applied Vantage Vulcan rapid thermal processing (RTP) system for wafer annealing. Backside heating with AMAT's honeycomb lamp reduces "hot spots," enabling 20nm transistor designs.
CEA-Leti Annual Review: IDMs' top 3 challenges

06/28/2011 

At CEA-Leti's Annual Review, STMicroelectronics CTO Jean-Marc Chery reviewed the challenges facing IDM companies focused on SoC markets, and the three primary challenges for IDMs: FinFETs, EUV lithography, and 450mm.
CEA-Leti Annual Review: The heart of Europe's semiconductor industry challenges

06/28/2011 

At CEA-Leti's Annual Review, Leti CEO Laurent Malier noted how the important role that research and technology organizations should play in strengthening industry in Europe, and how their roles differ from groups in other regions.
Semiconductor industry executives: Can't miss events at SEMICON West

06/27/2011 

To maintain profitability and growth in the next 10 years, semiconductor executives must understand and successfully execute lab-to-fab transitions of new technologies. 2 SEMICON West sessions aim to tackle these issues.
GLOBALFOUNDRIES' new leadership

06/24/2011 

The board of directors of GLOBALFOUNDRIES appointed new leadership to run GlobalFoundries, the company's first CEO change since its inception.
3M opens temporary wafer bonding lab in Taiwan

06/24/2011 

The 3M Semiconductor Innovation Center will serve the Asia region with 3M's Wafer Support System (WSS) materials and processes for temporary bonding for ultra-thin wafer handling applications.
Photoresist market snapshot for semiconductor fab

06/23/2011 

Photoresist revenues will grow at about 5% for the next several years, says Techcet Group. Consolidation is long overdue among resist suppliers, and EUV may be the last straw. For materials, supply is abundant.
300-450mm manual wafer test probe configuration out from SemiProbe

06/22/2011 

SemiProbe released a 300mm manual test probe configuration of its Probe System for Life, M-12. The M-12 is field-upgradable to 450mm.
Thin-wafer bond/debond metrology from EVG opens process control, supply chain possibilities

06/21/2011 

EV Group (EVG) added an in-line metrology module for its EVG850TB/DB automated temporary bonding and debonding systems.
3D IC prototyping process result of MENT, Tezzaron, MOSIS collaboration

06/16/2011 

Mentor Graphics Corporation (NASDAQ:MENT), in a cooperative effort with Tezzaron Semiconductor and MOSIS, created a process for economically developing and manufacturing 3D-IC prototypes on multi-project wafers (MPWs).



WEBCASTS


Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Sponsored By:

Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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