08/02/2010 

Semiconductor packaging and test provider Unisem (M) Berhad announced results for the second quarter, ended 30 June 2010 (2Q10).

08/02/2010 

James Moyne, Applied Materials, highlights a new technology: virtual metrology. Virtual metrology, on which Moyne presented at ASMC/SEMICON, enables tighter semi fab control using line data analysis. The summarized data is synched with real metrology data. Virtual metrology is now adaptive.

08/01/2010  With varying process conditions, the quantitative analysis of the interfacial adhesion energy of Cu-Cu thermo-compression bonds was performed. Bioh Kim, et al, EV Group, Inc., Tempe, AZ USA; Eun-Jung Jang, et al, Andong National University, Andong, Korea

08/01/2010  Unit processes, integration schemes, and equipment are in place to enable development and pilot production of TSV technologies and all parts of the value chain do exist today at 300mm to enable integration technology qualification, end-product samples, and limited pilot production. Sesh Ramaswami, Applied Materials, Santa Clara, CA USA

08/01/2010  Michael A. Fury, Techcet Group, LLC, Del Mar, CA

08/01/2010  Wafer selection at the beginning of a process could help minimize the effects of shape changes during the wafer processing that may affect overlay error. Venkat R. Nagaswami, et al, KLA-Tencor Corp., Milpitas, CA

07/30/2010 

The Diamond series atmospheric robots use ultra low inertia, high-response brushless servomotors coupled with zero-backlash Harmonic Drive gears to achieve greatly enhanced dexterity and precision.

07/30/2010 

TSMC beat estimates with its 2Q10 results, but analysts are taking a more cautious stance amid worries of inventories on the rise and capacity additions slowing down.

07/29/2010 

Graphene has been found to have a unique property that could make it even more suitable for future electronic devices. When subjected to a 3-point stretch, graphene sprouts nanobubbles with electrons moving as if subjected to a strong magnetic field. The discovery was made by physicists at the University of California, Berkeley, and the Lawrence Berkeley National Laboratory.

07/28/2010 

In this video interview, Philip Garrou, microelectronics consultant and Advanced Packaging blogger, offers information on his blog, Insights from the leading edge, and summarizes reasonable roadmaps for 3D technology and TSV in particular. 2012 mainstream adoption seems too aggressive to Garrou.

07/28/2010 

McPherson’s vacuum ultraviolet (UV) spectrometer, Model 234/302, is now available with improved efficiency over a wide wavelength range. New platinum-coated gratings suit use at windowless wavelengths, shorter than 120nm (>10eV).

07/27/2010 

In this video interview, Dave Stepniak, Texas Instruments, talks about a wafer-level packaging (WLP) trends paper he presented at SEMICON West. He summarizes the paper for senior technical editor Debra Vogler.

07/23/2010 

With the US reeling from record unemployment, many are wondering how the MEMS job market is fairing. Neha K. Choksi talks with Jason Weigold, founder and president of MEMStaff, about his observations based on clients' hiring and consulting needs.

07/23/2010 

Mark Privett, Brewer Science, says that new technologies allow use of higher temperatures as well as room-temperature processes, such as wafer de-bonding. The 3D industry is nearly ready for high-volume, yet still without industry standards.

07/16/2010 

SEMICON West 2010 wrapped this week in San Francisco. This article includes JC Kim, SEMI Board of Directors Chair, discussing the show and the semiconductor industry future. We also have POVs from the show floor by the ElectroIQ.com bloggers.

07/16/2010 

In this video, Timothy Dunn, Marcy Nano Center, discusses building an eco system for advanced semiconductor manufacturing in the US. Marcy Nano Center is pre-permitted and site-ready to build a semiconductor site with a packaging focus, with its academic and industry partners.

07/16/2010 

While we were not allowed to snap photos of the proprietary processes inside Applied Materials, Solid State Technology editor in chief Pete Singer put together these photos with information from the Applied Materials tour. Highlights include a solar-panel roof on the parking area, and discussion of AMAT's new products.

07/15/2010 

In this video from SEMICON West 2010, Sagar Kekare, Synopsis, presents ideas from his paper on rapid root cause analysis and process change validation using design-centric volume diagnostics.

07/15/2010 

In this video from SEMICON West 2010, Marcus Wimplinger, EV Group, summarizes the results of SEMATECH work using EVG's 300mm bonding systems that enables submicron alignment. Highly accruate wafer bonding is used for Cu-to-Cu bonding and other packaging applications.

07/15/2010 

Tom Jefferson, ISMI's 450mm program manager, gives SST an exclusive rundown of ISMI's closed-door update on 450mm progress at SEMICON West.