Wafer Processing

WAFER PROCESSING ARTICLES



SEMATECH goes EUV

04/09/2002  International SEMATECH, Austin, TX, has placed the first purchase order for an MS-13 EUV Microstepper, to be built by Exitech, Oxford, England, and installed in SEMATECH's Resist Test Center.

Cree to open Japan office

04/09/2002  April 9, 2002 - Durham, NC - Cree Inc. plans to open a Japan office in Tokyo to bring Cree's technology and engineering support closer to the Japanese customer.

Jusung Engineering to establish JV in China's Jiangsu

04/08/2002  April 8, 2002 - China - South Korea-based Jusung Engineering and China's Zongyi Group are to establish a joint venture named Jusung Nantong Technology Co. Ltd. in Jiangsu province.

UMC calls off sales of old chip equipment

04/05/2002  April 5, 2002 - Taipei, Taiwan - United Microelectronics Corp. (UMC) has called off a deal involving the sale of its 200mm wafer equipment to a chip-equipment broker, citing mounting demand for chips that use 0.25- and 0.35-micron technology.

AMAT does not obtain preliminary injunction against LTD Ceramics

04/04/2002  April 4, 2002 - Santa Clara, CA - LTD Ceramics Inc., a manufacturer of technical ceramic materials and components, said that Applied Materials has failed in its attempt to obtain a preliminary injunction against the company.

Mainland chipmakers prepare for Taiwanese rivals

04/04/2002  Taipei, Taiwan - Mainland Chinese chipmakers are accelerating expansion plans and slashing foundry prices to preempt challenges from Taiwan's top two chipmakers, which are expected to move part of their 200mm wafer facilities to the mainland.

IBM, Sony, SCE, and Toshiba to develop process technology

04/04/2002  April 3, 2002 - East Fishkill, NY, and Tokyo, Japan - IBM, Sony Corp., Sony Computer Entertainment Inc., and Toshiba Corp. have signed a multi-year agreement to jointly develop advanced semiconductor technologies based on SOI and other IBM materials advances.

Report: TSMC raises 2002 capex

04/02/2002  Taiwan Semiconductor Manufacturing Corp. has raised its capex for this year by more than US$400 million in light of strengthening demand for ICs.

Taiwan fabs up and running after quake

04/01/2002  April 1, 2002 -- HSINCHU, Taiwan -- An earthquake measuring 6.8 on the Richter scale rocked Taiwan over the weekend. However, the quake registered 4 where many of the foundries are located in Hsinchu.

Progress on thin wafer handling

04/01/2002  There has been much progress in the past year on wafer thinning, with portable electronics providing the driving force for thin die

Packaging industry leading the way

04/01/2002  A common topic of discussion on these pages and in the industry as a whole is the convergence of wafer processing and packaging technology

Energy conservation: Cost is not the real issue

04/01/2002  For some time now we've been concerned about energy conservation in semiconductor manufacturing cleanrooms. Papers have been written, seminars have been conducted, consultants have proliferated and engineers have gone back to drawing boards where they've produced solutions-some quite innovative and others rather exotic

Tsao steps down as UMC head

04/01/2002  Hsinchu, Taiwan - United Microlectronics Corp. (UMC) announced today that effective April 1st, Robert Tsao will no longer serve as the company CEO. The position will be taken over by Vice Chairman John Hsuan, while Tsao will continue to serve as chairman for the company.

Zarlink sells UK fab to X-FAB in $30M deal

03/29/2002  Ottawa, Canada - Zarlink Semiconductor announced the sale of its wafer fab in Plymouth, UK, as well as IP and related foundry businesses, to companies controlled by X-FAB Semiconductor Foundries AG of Erfurt, Germany for US$30 million, represented by US$12 million in cash on closing and a secured note of US$18 million repayable over three years.

Taiwan allows conditional 200mm investment in China

03/29/2002  Taipei, Taiwan - The Taiwanese government has relaxed a ban on fab investment on the mainland, according to reports from the Associated Press.

Taiwan government eases ban on companies wishing to do business in China

03/29/2002  March 29, 2002 --Taiwan -- In a late night speech, Taiwan's Premier Yu Shyi-kun said Taiwan companies that want to do business in China will be "allowed to produce less-advanced computer chips in China if they move on to make more sophisticated products in Taiwan," according to Taiwan AP.

US laws may impact foundry investment in China

03/26/2002  March 26, 2002 - Taiwan - US export laws may play a small role in the controversy surrounding plans to allow Taiwan's semiconductor companies to expand into mainland China.

Chartered, Cadence partner for process design kit offering

03/25/2002  March 25, 2002 - Singapore and San Jose, CA - Cadence Design Systems Inc. and Chartered Semiconductor Manufacturing are working together to help the mixed-signal market reduce cycle times on designs with new Chartered foundry process design kits (PDKs).

KLA-Tencor announces new CD analysis systems

03/25/2002  KLA-Tencor has unveiled a new set of automated tools for process window construction and analysis. The Process Window Monitor series automates the construction of process windows based on focus exposure matrices analyzed using KLA-Tencor CD or optical CD metrology tools.

SMIC places follow-on order with M+W Zander

03/21/2002  March 21, 2002 -- Shanghai, China -- M+W Zander, a Jenoptik subsidiary, has received a follow-on order from China-based Semiconductor Manufacturing International Corporation (SMIC) to engineer and construct a cleanroom.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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