Wafer Processing

WAFER PROCESSING ARTICLES



ASML, Carl Zeiss confirm 193nm capability

02/07/2002  Netherlands & Germany -- ASML Holding NV and lens partner Carl Zeiss confirmed the availability of 193nm imaging systems in 2002 to satisfy increased market demand for leading edge 0.10-micron ArF imaging solutions.

CyOptics opens $10 million fab

02/06/2002  February 6, 2002--WALTHAM, MA--CyOptics Inc., a developer of indium phosphide-based active optical components has opened a $10 million wafer fabrication facility to produce high performance modulators, lasers and detectors packaged both as stand-alone devices and as hybrid super components.

Thinking the unthinkable: Japanese consider joint production, gov't support

02/05/2002  Seems like every morning brings another surprising report from Japan about some potential idea for government-industry cooperation, not just in R&D, but in actual production. Worried about how they're going to come up with the capital needed to invest in next generation fabs while they're losing so much money, Japan's chipmakers are talking about ideas ranging from government support for the memory industry to some sort of national foundry for 0.1-micron system chips.

ChipPAC, SMIC form alliance in China

02/05/2002  Feb. 5, 2002 - Fremont, CA, - ChipPAC Inc. and Semiconductor Manufacturing International Corp. (SMIC) have entered into a non-exclusive alliance designed to support customers with end-to-end solutions from wafer fab to packaging and test and final distribution in China and global market.

AMD, UMC to collaborate on 300mm

02/01/2002  Singapore - AMD and UMC have formed a comprehensive alliance to establish a joint venture to own and operate a 300mm wafer fab in Singapore for high-volume production of PC processors and other logic products.

Micro inspection for wafer bumping

02/01/2002  Inspection requirements for wafer-level packaging processes

Semiconductor worker health: An issue far from settled

02/01/2002  The controversy arises not from the cleanroom concept itself, but from the production processes conducted within this specific type of cleanroom. A cleanroom can be a healthy environment, even aseptic.

Chipmakers to maintain full production

01/31/2002  Jan. 31, 2002 - Taipei, Taiwan - Several chipmakers in Taiwan have decided to postpone the annual overhaul of their production equipment until March or April in order to boost output of semiconductors during the first quarter.

Semtech to become completely fabless

01/30/2002  Jan. 30, 2002 - Newbury Park, CA - Semtech Corp., a supplier of analog and mixed-signal semiconductors, expects to get 100% of its silicon wafers from outside sources by the end of calendar year 2002.

SEMX to sell Dutch ops

01/29/2002  Jan. 29, 2002 - Armonk, NY - SEMX Corp. has entered into a letter of intent with an undisclosed party to sell the stock of American Silicon Products, B.V., its European-based wafer reclaim services operation which is located in the Netherlands.

Philips Semiconductors, Mitsumi Electric to collaborate

01/28/2002  Jan. 28, 2002 - San Jose, CA - Philips Semiconductors, a division of Royal Philips Electronics, and Mitsumi Electric Co. Ltd. have entered into a joint agreement covering planned collaborations on development, manufacturing, marketing, and sales of analog and mixed-signal ICs.

Foundries find bottom, anticipate the bounce

01/28/2002  It's actually a good sign for the semiconductor industry that one of the top three foundries already hit its capacity utilization bottom - and the other two big foundries aren't far behind.

Sumitomo, Mitsubishi merge silicon operation

01/28/2002  Fremont, CA - The silicon operations of Sumitomo Metal Industries Ltd. and Mitsubishi Materials Corp. officially merged under the new name Sumitomo Mitsubishi Silicon Corp. (SUMCO) on Feb. 1, 2002.

Sumitomo, Mitsubishi set to merge

01/25/2002  Jan. 25, 2002 - Tokyo, Japan - Final approval has been obtained for a merger between the silicon operations of Sumitomo Metal Industries Ltd. and Mitsubishi Materials Corp., a marriage that will bring the industry's number three and four companies to the number two position in sales of silicon wafers.

Intel plans Philippines investment

01/24/2002  Manila, Philippines - Intel Philippines is set to invest an additional $78 to $97.5 million at its plant to produce Pentium 4 microprocessors made on 0.13-micron technology, and other microprocessors, on Intel's 300mm wafer fab technology.

Big excitement over tiny explosives

01/24/2002  Chemists at U-Cal, San Diego have discovered that silicon wafers can be easily made into tiny explosives that might be used one day to chemically analyze samples in the field or serve as power sources for teensy electronic sensors the size of a speck of dust.

Agere seeks buyer for Orlando operations

01/24/2002  Jan. 24, 2002 - Allentown, PA - Agere Systems is trying to find a buyer for its wafer fab in Orlando, FL.

SiGen, Umicore partner for thick-SOI wafers

01/22/2002  Jan. 22, 2002 - Campbell, CA - Silicon Genesis Corp. (SiGen), a developer of SOI wafer technologies, and Umicore, a Belgian-based metals and materials supplier, are collaborating to manufacture thick silicon-on-insulator wafers for electronic, photonic, and MEMS applications.

Tower completes pilot line for its Fab 2 project

01/17/2002  Jan. 17, 2002 - Migdal Haemek, Israel - Tower Semiconductor has successfully completed the installation of a pilot production line for its new 0.18-micron process technology.

Message from IEDM: CMOS needed, still viable

01/16/2002  Looking for an application that will bring the IC industry out of its current slump? Consider the projected growth of broadband and in particular the microelectronics necessary to establish "residential gateways" and "simple to use home networks."




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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