07/28/2016  The 2016 global semiconductor market is forecast to decrease by 2.4 percent from the previous year according to the World Semiconductor Trade Statistics (WSTS).

07/28/2016  SJ Semiconductor Corp. and Qualcomm Technologies, Inc. jointly announced that SJSemi has begun mass production of 14nm wafer bumping for Qualcomm Technologies.

07/27/2016  Over the past 20 years, China has become increasingly frustrated over the gap between its IC imports and indigenous IC production

07/27/2016  Worldwide silicon wafer area shipments increased during the second quarter 2016 when compared to first quarter 2016 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

07/26/2016  University of Illinois researchers have developed a way to etch very tall, narrow finFETs, a type of transistor that forms a tall semiconductor "fin" for the current to travel over. The etching technique addresses many problems in trying to create 3-D devices, typically done now by stacking layers or carving out structures from a thicker semiconductor wafer.

07/26/2016  Peregrine Semiconductor Corp. today announced the promotion of Takaki Murata to vice president and general manager of the high performance analog (HPA) business unit.

07/22/2016  Worldwide semiconductor capital spending is projected to decline 0.7 percent in 2016, to $64.3 billion, according to Gartner, Inc. This is up from the estimated 2 percent decline in Gartner's previous quarterly forecast.

07/22/2016  Billings activity for equipment companies based in North America are at their highest level since February 2011.

07/21/2016  Paper-submission deadline is August 10 this year; Supplier exhibition to be held in conjunction with technical program.

07/21/2016  Final installment of biannual report outlines short-term and long-term challenges and opportunities facing semiconductor technology.

07/18/2016  Silicon Valley specialty semiconductor foundry Noel Technologies, a provider of process development and substrate fabrication for a variety of high-technology industries, celebrates its 20th anniversary this month.

07/15/2016  Applied Materials has disclosed commercial availability of new Selectra selective etch twin-chamber hardware for the company’s high-volume manufacturing (HVM) Producer platform.

07/13/2016  Fan-out wafer level packaging (FOWLP) is gaining traction, leading to higher I/Os and larger formats, and new mobile displays are pushing the limits of pixel per inch (PPI) while also moving to larger formats.

07/13/2016  Gear up for Day 2 of SEMICON West with this list of must-see conference events.

07/13/2016  Buoyed by strong investments in China, 200mm wafer production is seeing a re-awakening, with overall 200mm capacity expected to match its previous 2006 peak level by 2019.

07/13/2016  Cisco VP urges conference goers to invest in digitized supply chains to stay relevant.

07/12/2016  Semiconductor manufacturers and their suppliers – both process tool vendors and providers of sub-fab systems – are looking to an open-source industrial networking methodology, EtherCAT, developed by Beckhoff Automation to address the increasingly stringent control requirements of emerging high-precision processes.

07/12/2016  On Monday, imec – the Leuven Belgium-based research consortium – hosted its annual imec Technology Forum (ITF) USA, a half-day conference at the Marriott Marquis.

07/12/2016  The near-term outlook for semiconductor manufacturing is challenging, with revenues down slightly but equipment spending up a bit, as reported by experts during the SEMI/Gartner Market Symposium held yesterday afternoon.

07/11/2016  AppliedMicro's innovative silicon products enabled by TSMC's advanced technology.