07/14/2015  SEMICON West 2015 kicked off Tuesday morning with a keynote panel session that addressed the challenges of "Scaling the Walls of Sub-14nm Manufacturing."

07/14/2015  SEMI projects three consecutive years of growth in worldwide semiconductor equipment sales according to the mid-year edition of the SEMI Capital Equipment Forecast, released today at the SEMICON West exposition.

07/14/2015  Because it can achieve extreme deformation, Equal Channel Angular Extrusion (ECAE) can deliver submicron, high strength and uniform microstructures. The resulting improvements in strength allow for monolithic targets with a longer target life of 20-100%.

07/14/2015  The demand for 4-mask layer Cu-plated wafer-level chip scale packaging (WLCSP) is increasing rapidly, and the current capability for in-line Cu height measurements is not suitable for high volume manufacturing (HVM).

07/13/2015  Applied Materials, Inc. today announced a next-generation etch tool, the Applied Centris Sym3 Etch system, featuring an entirely new chamber for atomic-level precision manufacturing.

07/13/2015  Imec and Panasonic Corp. announced today that they have fabricated a 40nm TaOx-based RRAM (resistive RAM) technology with precise filament positioning and high thermal stability.

07/13/2015  Applied Materials, Inc. today unveiled the Applied Olympia ALD system, featuring a unique, modular architecture that delivers high-performance ALD technology to manufacturers of leading-edge 3D memory and logic chips.

07/09/2015  Graphene, the only one atom thick carbon network, achieved overnight fame with the 2010 Nobel Prize. But now comes competition: Such layers can also be formed by black phosphorous.

07/09/2015  IBM Research today announced that working with alliance partners at SUNY Polytechnic Institute’s Colleges of Nanoscale Science and Engineering (SUNY Poly CNSE) it has produced the semiconductor industry’s first 7nm (nanometer) node test chips with functional transistors.

07/08/2015  SEMI today announced the cornerstone safety Standard S2 (Environmental, Health, and Safety Guideline for Semiconductor Manufacturing Equipment) will be updated this month.

07/07/2015  New material could make it possible to pack more transistors on a chip, research suggests.

07/07/2015  Using a single molecule as a sensor, scientists in Jülich have successfully imaged electric potential fields with unrivalled precision.

07/06/2015  We, in the semiconductor supply chain, are constantly immersed in detailed numbers. It’s important to pull back and look at the major trends that have profoundly changed and are reshaping our industry.

07/06/2015  Moving to the next design rule can be stressful for the inspection and metrology engineer. Like everything else in the fab, process control generally doesn’t get any easier as design rules shrink and new processes are introduced.

07/02/2015  If you attended just about any mask making conference in the last five to seven years, you would have heard the lament about exploding data volumes and their impact on mask writing time and, by extension, mask costs.

07/01/2015  EPFL scientists have now developed a simple, unconventional method to fabricate high-quality, efficient solar panels for direct solar hydrogen production with low cost.

07/01/2015  GLOBALFOUNDRIES today announced that it has completed its acquisition of IBM’s Microelectronics business.

06/29/2015  A new route to ultrahigh density, ultracompact integrated photonic circuitry has been discovered by researchers with the Lawrence Berkeley National Laboratory (Berkeley Lab) and the University of California (UC) Berkeley.

06/29/2015  Scientists have made exotic new materials by creating laser-induced micro-explosions in silicon, the common computer chip material.

06/29/2015  When the new iPhone came out, customers complained that it could be bent -- but what if you could roll up your too big 6 Plus to actually fit in your pocket? That technology might be available sooner than you think, based on the work of USC Viterbi engineers.