Wafer Processing

WAFER PROCESSING ARTICLES



SPTS Technologies named among the 2015 10 Best Suppliers of chip making equipment by VLSIresearch

06/10/2015  SPTS also ranked as a 2015 Best Supplier in the Fab Equipment Category.

Slip sliding away: Graphene and diamonds prove a slippery combination

06/10/2015  Scientists at the U.S. Department of Energy's Argonne National Laboratory have found a way to use tiny diamonds and graphene to give friction the slip, creating a new material combination that demonstrates the rare phenomenon of "superlubricity."

imec presents large area industrial crystalline silicon n-PERT solar cell with record 22.5% efficiency

06/10/2015  Nano-electronics research center imec announced today at Intersolar Europe, a new efficiency record for its large area n-type PERT (passivated emitter, rear totally diffused) crystalline silicon (Cz-Si) solar cell, now reaching 22.5 percent (calibrated at ISE CalLab).

The impact of consumer demand for cutting-edge display technology on the gases market

06/09/2015  How gases are used in the manufacture of displays is being impacted by new technologies, consumer demand, and the burgeoning China market.

Futuristic components on silicon chips, fabricated successfully

06/08/2015  IBM researchers develop a technique for integrating 'III-V' materials onto silicon wafers, a breakthrough that may allow an extension to Moore's Law.

Imagination and TSMC collaborate on advanced IoT IP platforms

06/08/2015  Imagination Technologies (IMG.L) and TSMC announce a collaboration to develop a series of advanced IP subsystems for the Internet of Things (IoT) to accelerate time to market and simplify the design process.

Reduced defectivity and cost of ownership copper CMP cleans

06/05/2015  A new, low pH, BTA free, noble-bond chemistry produced equivalent yield at substantially lower costs.

A major advance in mastering the extraordinary properties of an emerging semiconductor

06/05/2015  Black phosphorus reveals its secrets thanks to a scientific breakthrough made by a team from Universite de Montreal, Polytechnique Montreal and CNRS in France.

Fab equipment growth continues into 2015

06/04/2015  Fab equipment spending is forecast to depart from the typical historic trend over the past 15 years of two years of spending growth followed by one of decline. For the first time, equipment spending could grow every year for three years in a row: 2014, 2015, and 2016.

Is it time to switch to OASIS.MASK?

06/04/2015  A summary of OASIS standard advantages and weaknesses is presented, based on six years of experience with customer databases.

Global semiconductor sales increase in April; Steady growth projected

06/03/2015  The Semiconductor Industry Association (SIA) announced worldwide sales of semiconductors reached $27.6 billion for the month of April 2015, 4.8 percent higher than the April 2014 total of $26.3 billion and 0.4 percent lower than last month's total of $27.7 billion.

Avago Technologies acquisition of Broadcom creates new semiconductor powerhouse

06/02/2015  Merger activity in the semiconductor industry moved to a new level with the announcement of the agreement for Avago Technologies to acquire Broadcom.

Eulitha delivers PHABLE Photolithography System to MESA+ NanoLab

06/02/2015  EULITHA, a Swiss startup company offering innovative lithography equipment and services for the nanotechnology, photonics and optoelectronic markets announced today the delivery of its unique PhableR 100 photolithography tool to the MESA + NanoLab of the University of Twente in the Netherlands.

North America: A critical player in the advanced semiconductor market

06/01/2015  As the fabless business model has transformed the semiconductor manufacturing landscape, Taiwan and South Korea have undeniably grown into key semiconductor producing regions. However, it should be noted that North America is home to Intel, Texas Instruments, Micron, GLOBALFOUNDRIES, Freescale, Fairchild, Microchip, ON Semiconductor, significant operations of Samsung, and other manufacturers.

Avago Technologies to acquire Broadcom for $37B

05/29/2015  Avago Technologies Limited and Broadcom Corporation today announced that they have entered into a definitive agreement under which Avago will acquire Broadcom in a cash and stock transaction that values the combined company at $77 billion in enterprise value.

Digital Specialty Chemicals receives investment from Intel Capital

05/26/2015  Digital Specialty Chemicals Limited (DSC), a dual bottom line corporation and leading provider of advanced materials to the semiconductor, pharmaceutical, and specialty chemical markets, announced that it has received an equity investment from Intel Capital, Intel Corporation’s global investment organization.

Dow Corning introduces next-generation thermal interface material

05/26/2015  Dow Corning, a developer of silicones, silicon-based technology and innovation, today unveiled new Dow Corning TC-3040 Thermally Conductive Gel, a next-generation thermal interface material.

SEMI April 2015 book-to-bill report shows continued improvements in bookings and billings

05/21/2015  A book-to-bill of 1.04 means that $104 worth of orders were received for every $100 of product billed for the month.

Research institutes globally invest in Oxford Instruments' plasma systems for graphene and 2D materials development

05/21/2015  As developments in graphene and 2D materials technology continue to increase, research institutes globally are investing in Oxford Instruments’ plasma processing Nanofab equipment using CVD, PECVD and ICPCVD techniques to further their work in this important area.

Samtec joins IRT Nanoelec Silicon Photonics Program

05/21/2015  Samtec, Inc., a supplier of high-speed interconnects, microelectronics, and micro-optical solutions, is pleased to announce its entrance in the Silicon Photonics Program of the IRT Nanoelec.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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