Wafer Processing

WAFER PROCESSING ARTICLES



Intel and IBM to lay out 14nm FinFET strategies on competing substrates at IEDM 2014

10/16/2014  The development of increasingly sophisticated and energy-efficient CMOS technology for mobile, client and cloud computing depends on a continuing stream of advances in the process technologies with which the complex integrated circuits are built.

Semiconductor market in India is expected to reach US$ 52.58B by 2020

10/14/2014  India has a very large industry base of electronics items, but there is little manufacturing base for semiconductors.

Managing oxide growth on in-process storage wafers for cost and yield impact

10/13/2014  A system is described that mitigates unintended oxide growth for bare wafers while in-process storage and potentially post process at tools using nitrogen purge.

Mentor Graphics wins $36M in patent infringement suit

10/13/2014  A Portland, Oregon jury today delivered a verdict in favor of Mentor Graphics in a patent infringement trial against Synopsys, Inc., awarding Mentor Graphics $35 million in damages and royalties.

China's wafer foundry market: 15% growth in 2014

10/09/2014  The wafer foundry market experienced a wavy development, jumping by 39.4 percent in 2010 following a 7.9 percent decline in 2009.

Altera CEO John Daane to receive Robert N. Noyce Award

10/08/2014  The Semiconductor Industry Association announced that John P. Daane, President, CEO, and Chairman of the Board of Altera, has been named the 2014 recipient of SIA's highest honor, the Robert N. Noyce Award.

SEMI announces rising annual silicon wafer shipment forecast

10/07/2014  SEMI recently completed its annual silicon shipment forecast for the semiconductor industry. This forecast provides an outlook for the demand in silicon units for the period 2014-?2016.

EV Group unveils room-temperature covalent bonder

10/06/2014  EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today introduced the EVG 580 ComBond.

Silicon Cloud International launches semiconductor collaborative platform in Singapore

10/03/2014  Silicon Cloud International (SCI), a provider of secure and private cloud computing infrastructure, announced today successful pilot program launch of its semiconductor workflow platform in Singapore.

Dow Corning releases new 150mm SiC wafers

10/02/2014  Dow Corning, a developer of silicon and wide-bandgap semiconductor technology, announced that it now offers 150mm diameter silicon carbide (SiC) wafers under its Prime Grade portfolio.

Kurita, SEMATECH partner on wafer surface contamination and cleaning technology in semiconductor processing

09/30/2014  SEMATECH, the global consortium of chipmakers, announced today that Kurita Water Industries Limited has partnered with SEMATECH to develop innovative technologies for low defectivity ultrapure water (UPW) applications used in semiconductor manufacturing.

Gigaphoton introduces "eGrycos" for ArF immersion lasers

09/29/2014  Gigaphoton Inc., a lithography light source manufacturer, announced today that it has completed development of an electricity-reduction technology for its flagship “GT Series” of argon fluoride (ArF) immersion lasers used for semiconductor lithography processing.

United States photomask market to reach around $475M by 2019

09/29/2014  According to the recently published TechSci Research report, "United States Photomask Market Forecast & Opportunities, 2019", the photomask market in the United States is forecast to reach $474.58 billion by 2019.

New discovery could pave the way for spin-based computing

09/26/2014  A University of Pittsburgh research team has discovered a way to fuse these two distinct properties in a single material, paving the way for new ultrahigh density storage and computing architectures.

Southampton scientists grow a new challenger to graphene

09/24/2014  A team of researchers from the University of Southampton's Optoelectronics Research Centre (ORC) has developed a new way to fabricate a potential challenger to graphene.

KYOCERA joins imec’s industrial affiliation program on advanced silicon solar cell technology

09/23/2014  Belgian nanoelectronics research centre imec and Kyocera Corporation announced today that Kyocera, the Japanese high-tech electronics company and manufacturer of photovoltaic (PV) cells, modules and systems, has joined imec’s industrial affiliation program (IIAP) to advance next-generation crystalline silicon solar cells.

Northeastern University researchers develop novel method for working with nanotubes

09/19/2014  Northeastern University researchers have developed a novel method for controllably constructing precise inter-nanotube junctions and a variety of nanocarbon structures in carbon nanotube arrays.

Photonics community celebrates bipartisan passage of Revitalizing American Manufacturing and Innovation Act

09/19/2014  Photonics community leaders including SPIE, the international society for optics and photonics, are celebrating bipartisan passage by the U.S. House of Representatives of a bill designed to stimulate development and commercialization of new technologies and promote growth of high-value jobs.

David Bell joins Triad Semiconductor's Board of Directors

09/17/2014  Triad Semiconductor, Inc. today announced that David B. Bell former President & CEO of Intersil and former President of Linear Technology Corporation was appointed to the company's board of directors.

Veeco Ion Beam Deposition technology reaches significant milestone to support EUV commercialization roadmap

09/17/2014  Veeco Instruments Inc. announced today that its new Odyssey Ion Beam Deposition (IBD) Upgrade for the NEXUS IBD-LDD System has repeatedly produced photomask blanks with zero deposition defects larger than 70nm.




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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