01/27/2014  At the SEMI Industry Strategy Symposium Europe (ISS Europe 2014) on February 23-25 in Salzburg, semiconductor industry executives will examine the conditions required to achieve the EU’s 10/100/20 strategy.

01/24/2014  We asked leading industry experts and analysts to give us their perspectives on what we can expect in 2014.

01/23/2014  Synthetic diamond is ideally suited for thermal management of semiconductor packaging, as it combines exceptionally high thermal conductivity with electrical isolation.

01/23/2014  Improving economic competitiveness through cost reduction, cycle time improvement and more eco-friendly processing.

01/23/2014  A new plasma-enhanced atomic layer etch method delivers atomic-level etch precision with process times that are practical for use in a manufacturing environment.

01/23/2014  In addition to extending the fin-based design investments, augmenting the FinFET for improved performance allows an evolution of the process infrastructure for a few more nodes.

01/23/2014  The development of an 85µm diameter, 100µm deep SiC back-side via etch process for production is described.

01/23/2014  Should foundries establish and share best practices to manage sub-nanometer effects to improve yield and also manufacturability?

01/23/2014  At Semicon Europa, Paul Farrar, general manager of G450C, provided an update on the consortium’s progress in demonstrating 450mm process capability. He said 25 tools will be installed in the Albany cleanroom by the end of 2013, progress has been made on notchless wafers with a 1.5mm edge exclusion zone, they have seen significant progress in wafer quality, and automation and wafer carriers are working.

01/21/2014  Today, at the SEMI European 3D TSV Summit, nanoelectronics research center imec and Besi, a global equipment supplier for the semiconductor and electronics industries, announced they are joining forces to develop a thermocompression bonding solution for narrow-pitch die-to-die and die-to-wafer bonding with high accuracy and high throughput.

01/21/2014  On January 14, 2014, we read on the Investors.com headlines page - Intel Seen Gaining Huge Pricing Advantage Over TSMC. Just three days later comes the responding headline: TSMC: We're "Far Superior" to Intel and Samsung as a Partner Fab.

01/16/2014  ARM and global semiconductor foundry UMC this week announced an agreement to offer the ARM Artisan physical IP platform along with POP IP for UMC’s 28nm high-performance low-power (HLP) process technology.

01/15/2014  SEMI today announced that two teams — from the University of Florida and Xilinx — are recipients of the 2013 SEMI Award for North America.

01/14/2014  Macroeconomic and microelectronic industry growth opportunities and innovation challenges underscored diverse perspectives from analysts, economists, technologists, semiconductor manufacturers and supply chain executives speaking at the SEMI Industry Strategy Symposium (ISS) that opened yesterday.

01/14/2014  Nanotechnology research and development center imec, today announced the celebration of its 30th anniversary.

01/13/2014  Patterning options for N10/N7 nodes, advanced packaging solutions and 3D NAND memory to be targeted.

01/10/2014  Toppan Photomasks, Inc. (TPI) is saddened to announce the death of President and CEO David Murray after a long battle with cancer. Mr. Murray was 55 years old.

01/09/2014  Worldwide, the semiconductor industry growth rate back in 1973 was about 30 percent and slipped into 1975 with negative sales growth rates.

01/09/2014  The top 10 companies now hold 67% of worldwide IC industry capacity, up from 54% in 2009.

12/20/2013  Mentor Graphics Corporation yesterday announced Greg Helton as president and managing director for Mentor Graphics Japan.