Wafer Processing

WAFER PROCESSING ARTICLES



IEDM 2012 slideshow: Sneak preview of 14 conference papers

12/04/2012 

We've scanned the entire conference program for next week's 58th annual IEEE International Electron Devices Meeting (IEDM), to present a quick sampling of some of the more intriguing papers.

"Cloning" could make structurally pure nanotubes for nanoelectronics

11/30/2012 

Researchers have demonstrated a technique for growing virtually pure samples of single-wall carbon nanotubes (CNT) with identical structures, a process likened to "cloning" them -- and possibly an important step toward controlling their manufacture for future electronic devices.

Applied consolidates solar and displays units, two execs leaving

11/30/2012 

Applied Materials is combining its Display and Energy and Environmental Solutions (EES) under one roof led by former KLA-Tencor exec Ali Salehpour, which also means the departure of those two units' current leaders, Mark Pinto and Tom Edman.

EV Group completes cleanroom expansion, opens new R&D labs

11/28/2012 

EV Group has completed its expanded cleanroom IV facility at its corporate headquarters in Austria, which doubled its cleanroom space for process development and pilot production services.

GSA, IC Insights team on 5th edition of IC Foundry Almanac

11/21/2012 

A reference book from the Global Semiconductor Alliance (GSA) and IC Insights puts foundry information at the fingertips of those who need it the most.

Electronic gases slowing to modest growth in 2012, 2013

11/21/2012 

Sales of electronic gases are seen growing a modest 3.2% growth overall in 2012, following a 15% increase in 2011 to $3.1B, according to an updated report from Techcet Group.

Will the $2 interposer be silicon or glass?

11/20/2012 

Dr. Phil Garrou reports from the 2nd annual Georgia Tech 2.5D Interposer Conference: what's the market projection for silicon and glass interposers, what's preventing high-volume manufacturing, and is there a crossover with flat-panel display glass manufacturing?

Antenna-on-a-chip promises faster light processing with silicon photonics

11/19/2012 

Researchers from Rice U. say they have developed a micron-scale spatial light modulator (SLM) built on SOI that runs orders-of-magnitude faster than its siblings used in sensing and imaging devices.

Semiconductor equipment demand: Shades of 2009?

11/16/2012 

The latest monthly numbers for semiconductor manufacturing equipment demand aren't pretty: lows in both orders and sales not seen since the last major downcycle three years ago, and the short-term comparisons continue to widen.

TELEFUNKEN expands Roseville facility

11/15/2012 

TELEFUNKEN Semiconductors is expanding its manufacturing capacity at the Roseville, California facility, to 220,000+ 8 inch wafers.

Brewer Science introduces CNT inks for printed electronics

11/15/2012 

Rolla, MO-based Brewer Science introduced a line of conductive CNT ink materials that are surfactant free, require no additional rinse steps, and are compatible with a broad range of printed electronic substrates.

Wafer shipments screech to halt in 3Q, still tracking to 1% growth in 2012

11/14/2012 

After a nice spurt in 2Q12, worldwide silicon wafer area shipments fell back to a -slight decline in 3Q12, according to updated data from SEMI, and remain on track for cautious projections of flat growth for the full year.

Pureplay, foundry firms still shine in IC sales rankings

11/13/2012 

Updating its "top 20" semiconductor supplier rankings from earlier this year, IC Insights finds most of the same trends holding true: a tough year overall for chipmakers, but fabless and foundry firms still showing very good growth.




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Environment, Safety & Health

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The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

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As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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