ITS USE IN TBGA AND CSP APPLICATIONS PROVIDES MORE I/O CONNECTIONS

BY TIMOTHY G. LENIHAN

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Typical flex-based packages can be made of pliable base materials, like polyimide or Mylar, onto which conductive metals are deposited and patterned. Such packages are used in many applications that require electrical connections between printed circuit boards (PCBs) containing die or semiconductor chips. Examples of these applications include portable computer screens, processor boards, cellular phones that open during operation, high-performance graphics cards and engine control units in cars. In fact, the world's largest flex circuits – measuring 150 feet long – can be found on the solar panels of the international space station currently under construction.

While there are many combinations of pliable base materials and electrical conductors available, including copper, gold and silver, this article focuses on polyimide base materials with copper conductors. Such conductors have nickel and gold plated on top of them to allow wire bond and solder ball attachments.

Flex Packaging

While flex-based electronic packages can be very large, they can also be very small. This article focuses on the small variety, where the die or semiconductor chip is attached directly to the flex package.

Single metal layer (SML) flex or tape electronic packages have been available for years. One common application for SMLs is the smart card, because smart cards are thin, lightweight and low in cost compared with traditional PCB technologies. However, as semiconductor chips, die-like microprocessors, memory, application-specific integrated circuits (ASICs) and digital signal processors (DSPs) increase in function, the number of input and output (I/O) connections to them also increases. This requires bringing smaller connecting lines closer to the die on the electronic package or increasing wiring density. Connections are typically made using wire bonding with thin gold wires, or with solder ball connections using low melting lead/tin balls.

Figure 1. Flex-based packaging types.Click here to enlarge image

The need to bring the package connections closer to the die is driven by system performance. Long connections can slow system performance in high-speed applications, and this can be problematic because there is a continuing need to reduce the overall system size, weight and cost in many new applications.

There are limits to the number of lines that can be patterned on a single side of a flex-based electronic package. This is driven primarily by cost, as the capital investment for semiconductor processing equipment is higher than for traditional PCB processing equipment. Yield is another factor that limits the number of lines or wiring density. When wiring or trace dimensions, line width and line spacing become smaller, the process yield is affected by smaller and smaller particles in the air. To address this problem, cleanroom facilities are often required.

One solution to this is to use both sides of the flex-based package for wiring, allowing larger line widths and line spacing. This technology is referred to as two metal layer tape (2ML tape). 2ML tape, where the die is directly attached to a cavity in the middle of the top of the flex or tape and where solder ball connections are on the same side as wirebond connections, is referred to as a tape ball grid array (TBGA). Die can be attached via wire bond connections – cavity-up TBGA or flip chip (FC) connections – FC TBGA.

Figure 2. Cross-section of a typical flex TBGA.Click here to enlarge image

When the overall electronic package size is less than 20 percent greater than the die size, these packages are referred to as chip scale packages (CSPs). The definition of CSP is under review but this has been used commonly in the electronic packaging industry for some time. Both wirebond and flip chip CSP packages are available on the market today. Figure 1 outlines the different types of flex-based packages.

While 2ML or TBGAs may seem to be a good solution for improving densities, there are a few obstacles in making this type of package. First, the SML tape industry evolved around using 35 mm-wide base materials, in part because processing equipment from the photographic industry was readily available. SML manufacturers now also use 48 mm-, 75 mm- and soon 150 mm-wide base materials. To reduce manufacturing costs and be competitive with PCB manufacturers that process much larger areas, the trend toward larger tape processing will continue. New tooling will be required to support such processes, especially to align the top of the tape to the bottom.

2ML tape also requires the ability to make connections between the top and the bottom of the tape; some SML tape manufacturers accomplish this today by etching away the base flex material and making solder ball connections from the bottom. Because the bottom of the tape is used for solder ball connections and not wiring, this is not necessarily a good method. A better solution is to use small vias and free up more area for wiring.

Primary Advantages

There are many advantages to using 2ML tape because of its light weight, good electrical performance at high frequencies (because of the thin flex base or dielectric material with a solid ground plane), small vertical profile and high-density wiring that doesn't require using multiple levels of packaging for wiring connections.

Unlike SML tape, 2ML tape technology is still on the cutting edge and evolving. Most 2ML tape manufacturers either process in large panels or in roll-to-roll format. They also manufacture small vias using punching or lasers and by two-sided processing.

For Example…

To be more specific regarding the use of 2ML tape, a cross- sectional diagram of a typical TBGA is shown in Figure 2. Such packages are sold to assemblers and self-contained electronic manufacturers that have the ability to manufacture complete subassemblies to end-users. This particular example uses roll-to-roll processing with small vias (25 to 30 µm exit width) to connect the top of the tape package to the bottom. Laser technology makes the small vias. These vias are plated with copper to make the electrical connections from top to bottom. The signal or trace lines are made with deposited copper and patterned using semiconductor type processes. Typical line widths range from 30 to 50 µm and line spaces from 30 to 37.5 µm; this example uses a 330 mm wide format (Figure 3).

Figure 3. 330 mm-wide processing.Click here to enlarge image

Vacuum metalization and additive plating build up the signal lines. Conductor thickness controls with tight line and space rules are achievable using thin film manufacturing technology. Smaller vias that can be made using punching or drilling technologies are produced using high-speed lasers. Die size reduction capability is a key advantage for 2ML tape users. Smaller die reduces die cost and increases the capacity of semiconductor manufacturers as more dies can be manufactured using the same capacity. The effect of die size reduction can be seen using physical layouts of a 40-mm, 432-lead cavity-down super BGA and the same size package and I/O count using a TBGA. An assembler can take advantage of continuing die shrinkage while using the same flex-based package. The die shrinkage would be transparent to the next level of assembly. This can significantly reduce cost conversion costs and qualification time.

What's next after 2ML tape?

The same limitations described earlier for SML tape will eventually catch up to 2ML tape as wiring density and performance requirements increase. Research has shown that 2ML tape can be multilayered like PCBs, embedding passive devices within the electronic package rather than mounting them on the surface of the package.¹ This has been done by depositing and patterning thin film materials, in a roll-to-roll process, onto a polyimide based flex or tape. Chromium oxide was chosen for a resistor material and tantalum oxide for a capacitor material. Patterning the metal lines into spiral or square shape makes an inductor. The requirement to make a center connection for the inductor is accomplished by using vias and a metal trace on the bottom side of the tape.

One advantage of the demonstrated technology extensions for 2ML tape is that the number of I/O connections can be increased without using smaller lines and spaces by stacking or multilayering layers of 2ML tape. Also, by placing passive devices (resistors, capacitors and inductors) within the electronic package, the top surface is freed up for more dies and thereby keeps the overall system package small. This is critical for portable applications that require increased functionality but must maintain a small system size, weight and low cost. One such example would be to access your computer system via a cell phone, while at the same time keeping all of your current cell phone functions, size and price. A number of universities are working on making these types of packages a reality.

Reference

1. Tim Lenihan, et.al., “A Novel Approach to Create an Integrated Flex Package,” IPC National Conference Flexible Circuits Proceedings, pp. 89-96, 1998.

TIMOTHY G. LENIHAN, director of marketing and sales, applications engineering, product engineering and business planning for the Micro Products Division of Sheldahl, Inc. and adjunct professor in the Electrical Engineering Department and the High Density Electronic Packaging Center at the University of Arkansas, can be contacted at Sheldahl Micro Products, 1285 South Fordham Street, Longmont, CO 80503; 303-684-7154; Fax: 303-651-2265; E-mail: [email protected].

A system-level view

BY JIM HJERPE KASKADE

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CPU package design must start by addressing form factor. Whether for a high-performance desktop or a high-end workstation/ server, high-speed microprocessor packaging must be designed with the smallest form factor in mind. Microprocessor vendors are struggling with end-users' requirements for the highest performance in the smallest form, and for packaging engineers, this means addressing a growing challenge of power distribution, thermal management and EMI containment.¹

The best solutions to these challenges will involve an integrated packaging architecture, which addresses the need to conserve space in the X, Y and Z axes. The ideal packaging architecture will also provide a common approach for many markets – value desktop, performance desktop, workstation and server – allowing the vendor to tailor functionality and cost. This becomes a significant challenge with increased demands on the power delivery and thermal dissipation solutions.

Power Distribution and Voltage Regulation

It is no longer feasible to deliver high-current, low-voltage power throughout a computer system from a central power supply. Power designers are turning to distributed power supply architectures in which power is bussed around the system at a high voltage and low current.² Modular dc/dc converters (or voltage regulators) are mounted as close as possible to the microprocessor, converting the power to meet low-voltage, high-current requirements (Figure 1).

Figure 1. A distributed power architecture.Click here to enlarge image

Microprocessor vendors are researching the possibilities of incorporating voltage regulator circuitry into the CPU package itself to avoid unacceptable impedances and resulting voltage drops in the power distribution path. However, this is not yet feasible for a number of reasons, such as the unmanageable physical size of the power conditioning circuitry. In addition, increasing the number of analog components adversely impacts the processor reliability.

Figure 2. Power from the system to the package.Click here to enlarge image

There are various issues to consider in distributing power from the system to the CPU package. The need to lower thermal dissipation and improve device reliability for high-performance processors has resulted in the reduction of the power-supply voltage with each succeeding semiconductor generation.³ Unfortunately, the margin for error (transient-droop margin) is reduced with the lower operating voltages. The links in the power distribution path must have low impedance to minimize critical voltage fluctuations. For correct operation of the processor's circuits, the voltage seen at the CPU cannot vary more than 10 percent, which typically translates to a voltage regulator supply variance of only 5 percent.⁴

Figure 3. Current, slew and voltage trends.Click here to enlarge image

The real problem arises from transient currents. Computing demands vary because of high clock speed circuits and power conservation design techniques, such as clock gating and sleep modes. These techniques result in fast, unpredictable and large magnitude changes in supply current ultimately requiring hundreds of amps within a few nanoseconds. Unfortunately, the resulting current surge between the CPU and power regulator can create unacceptable spikes in the supply voltage (dv = IR + Ldi/dt).⁵ Values shown in Figure 3 for slew rate vary depending on where the change in current is measured and the total capacitance of the circuit, but the trend remains the same.⁶

Figure 4. CPU transient response at 1.0V operating voltage.Click here to enlarge image

Much effort is expended in placing power and ground planes and power and ground vias, and in capacitor pad design, to ensure low inductance power delivery loops. To gain the proper margin, as shown in Figure 4, surge currents are managed by placing many decoupling capacitors throughout the power delivery system – on the power regulation module, motherboard, die package and the die itself (Figure 1). This not only increases costs, but also consumes critical silicon area, chip package and board real estate. For microprocessors operating at more than 200 MHz, the most effective capacitor is an on-die capacitor or one that is physically very close to the die. All PC-processor manufacturers now use on-die capacitors.⁷

Thermal Management

The need for higher performance and an increased level of functional integration, as well as die size optimization, has led to higher heat-flux concentration in certain areas of the processor die. Engineers now foresee energy densities at the surface of the silicon approaching unmanageable levels. Heat-load and heat-flux keep climbing (Figure 5).⁸

Figure 5. Thermal heat-load and heat-flux.Click here to enlarge image

Reliability of the CPU is exponentially dependent on the operating temperature of the die junction. Lowering temperatures 10 to 15

Thermal engineers must also take into account the nearby voltage regulator efficiencies. For example, a voltage regulator working at 85 percent efficiency driving a 130-watt device dissipates over 20 watts. Therefore, trying to locate the voltage regulator close to the CPU (an important goal) becomes more difficult as CPU performance increases.

Figure 6. Battle between thermal and EMI for aperture size.Click here to enlarge image

As thermal densities increase beyond 60 W/cm², more effective heat spreading technologies, such as vapor chambers, will be necessary. With these technologies, the heat-dissipating device effectively becomes isothermal. Thus, rather than managing both the processor and its power source independently, the ideal thermal architecture would service both taking advantage of a single isothermal structure. This would allow the CPU and its power source to be more easily integrated.

EMI Containment

The microprocessor is by far the largest source of electromagnetic energy. Containing radiated and conducted emissions at the source (at the CPU package) would make the system design easier for computer OEMs. To comply with FCC regulations, the system must be tested for emissions at up to five times the CPU operating frequency or 40 GHz, whichever is lower. This is necessary because of the harmonics that are generated from the base CPU frequency.

The main component of EMI is a radiated electromagnetic wave with a wavelength that gets smaller as frequencies increase. Chassis-level solutions involve reducing the size of openings in the system, effectively blocking the waves. However, the solutions are more challenging when apertures need to be reduced for EMI, but increased for airflow (Figure 6).

Figure 7. An integrated packaging architecture.Click here to enlarge image

Heatsink grounding may be another effective way to reduce system EMI emissions. Noise coupled from the processor package to the heatsink may cause it to act as an antenna and re-radiate the noise. However, grounding the heatsink through the CPU package is not possible with most implementations.1 In addition, grounding of heatsinks may reduce EMI, but that alone may not be sufficient to pass the required tests. Additional shielding of the processor itself may be necessary.

Tomorrow's Microprocessor Chip Package

Each generation of microprocessor packages transforms into an even more sophisticated thermal, electrical and mechanical platform. Tomorrow's microprocessor package must take into account all system-level implications in an integrated approach.

Figure 8. A CPU packaging approach.Click here to enlarge image

A modular “On-Package-Voltage-Regulation” (OPVR) architecture provides a much-needed solution. Modular OPVR couples the performance benefits of integrating voltage regulation with the CPU with the benefits of making the voltage regulator an independent and modular device. Having the voltage regulation next to the chip eliminates the path impedance and need for much of the capacitance. Until recently, however, no apparent solution existed for interconnecting the voltage regulation circuitry on the package in a modular approach, especially given the physical size constraints of today's CPU packages and their associated power interconnect solutions. Voltage regulators are currently interconnected to the processor through bulky high-pin-count edge-connectors.

This packaging design integrates the microprocessor with its voltage regulator into one single modular construction – modular OPVR (Figure 7). Miniaturized power circuitry is mounted on the underside of a power substrate that houses the DC/DC components and acts as a heatsink grounding structure and common-mode current shunt. The heat-dissipating device is used for both the processor and power circuitry. A photograph of the CPU package itself is shown in Figure 8. Not shown is a motherboard-mounted EMI frame that functions as a faraday cage for the processor, voltage regulator and heat dissipating device.

This architecture addresses several system issues, including reducing the power interconnect impedance by virtually eliminating the path between the power source and the load. Cleaner power translates into large signal-to-noise margin, resulting in higher operating frequencies. This approach also addresses the issue of providing a cooling solution for both CPU and VRM. Rather than leaving the thermal solution for the OEM in two discrete parts, this design forces a single design. This can translate into lower junction temperatures, resulting in higher operating frequencies and/or reliability figures. The power substrate itself provides a good groundling and shielding structure for higher shielding effectiveness. Package designers can only benefit by investigating a system-level view to chip-level packaging.

References

1. Polka, et al., “Package-Level Interconnect Design for Optimum Electrical Performance,” Intel Technology Journal, Q3, 2000.
2. Kaskade, “Power Distribution for High-Performance Processors,” High-Density Interconnect, October 2000, Vol.3 No.10.
3. “International Technology Roadmap for Semiconductors,” 1999 Edition, Semiconductor Industry Association.
4. Baliga, “Power, EMI and Thermal Management in One Unit,” Semiconductor International, September 2000.
5. Herrell, “Processors Put Pressure on Packages,” Microdesign Resources, December 27, 1999.
6. Chickamenahalli, Li and Figueroa, “Study of Synchronous DC/DC Converters in High-Current Processor Power Delivery Systems,” 2000 International Conference on High-Density Interconnect and Systems Packaging.
7. Diefendorff, “Processors Penetrate Gigahertz Territory,” Microdesign Resources, February 28, 2000.
8. Tadayon, “Thermal Challenges During Microprocessor Testing,” Intel Technology Journal, Q3, 2000.
9. Viswanath, Wakharka, Watwe and Lebonheur, “Thermal Performance Challenges from Silicon to Systems,” Intel Technology Journal, Q3, 2000.

JIM HJERPE KASKADE, president and founder, can be contacted at INCEP Technologies, 10650 Treena Street, Suite 308, San Diego, CA 92131; 858-547-9925; Fax: 858-579-9926; E-mail: [email protected].

Three engineers, Alfred, Benjamin and Charles, and their wives, Althea, Bernice and Cora (not necessarily in that order), went shopping together while on holiday. At the end of the day, they noticed that each person had paid a sum of dollars equal to the square of the number of items each person had bought. They also noticed (believe it or not) that each husband spent $105 more than his wife.

Charles bought seven more times than Bernice, and Benjamin bought 11 more items than Cora.

Who is Althea's husband?

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Congratulations to Randy Weinstein of Villanova University for solving the Alice and Her Daughters puzzle, and to Manier Dar of DARS Graphic Arts for solving CrossNumber 58.

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CrossNumber 60

All answers are numbers. No number is repeated.

Across

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1. Prime
2. 1 Across x 4 Across
4. Prime
6. (1 Down + 5 Down) big Pi 2
7. (1 Down + 28 Down) big Pi 2
9. Prime
10. 5 Down x 25 Down
12. Prime
14. 31 Across x (25 Down + 29 Across) big Pi 2
16. 1 Down x 28 Down
17. 3 x 22 Across
20. 1 Across x 18 Down
22. 1 Across x 31 Across
24. 1 Across x 25 Down
26. Prime
27. (25 Down + 28 Down) big Pi 2
29. Prime
30. 29 Across x 31 Across
31. Prime

Down

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1. Prime
2. Prime
3. Prime
5. Prime
6. 1 Across x 1 Down
8. 4 Across x 5 Down
9. Prime
11. (5 Down + 28 Down) big Pi 2
12. 1 Down x 25 Down
13. 4 Across x 25 Down
15. 5 Down x 28 Down
18. Prime
19. 25 Down x 29 Across
20. 28 Down x 31 Across
21. Prime
23. 17 Across + 27 Across
24. Prime
25. Prime
28. Prime

Contest Rules: All entries must be received by March 28, 2001. The winners of the word puzzle and CrossNumber (can be the same person) will be drawn from all correct entries. Fax all entries to 847-634-4240. All entries must include name, complete address, company affiliation and daytime phone number to be considered.

Solutions to January’s Puzzles
CrossNumber 58
Alice and her daughters

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Stacked BGA package for wireless communications introduced

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SINGAPORE – In response to a demand for enhanced capability in chip scale packages, ST Assembly Test Services, an independent semiconductor testing and advanced packaging service provider, has introduced a new integrated circuit (IC) package for the wired and wireless communications markets. Referred to as “Stacked Die Ball Grid Array” (SDBGA), it is distinguished by its stacking feature, combining various ICs in one package. The total package height is typically 1.4 mm; popular sizes are 8 x 8 mm to 14 x 14 mm, with 80 to 140 pin counts.

The package is said to reduce the mounting area and chip weight as much as 70 percent over conventional packages. It has the characteristics of near chip scale packages. Good applications for the new packages include handphones, MP3 and MD players, and hand-held devices. They can combine flash/SRAM, flash/logic and ASIC/memory ICs.

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EPA ruling lowers threshold on reporting lead

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NORTHBROOK, ILL. – The IPC Association environmental health and safety committee has announced that the U.S. Environmental Protection Agency's (EPA) finalization of a lead reporting rule could impact U.S. PWB and EMS companies. The final rule changes the Toxics Release Inventory (TRI) reporting threshold for lead and lead compounds from 25,000 pounds per year to 100 pounds per year.

The new rule is retroactive to January 1, 2001, requiring companies to begin tracking and reporting all lead and lead components used during the 2001 calendar year. The full text of the final TRI rule is available at www.epa.gov/tri.

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Stock repurchase plan slated for National Semiconductor

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SANTA CLARA, CALIF. – National Semiconductor Corp. has announced a second program of open market repurchases to up to 8 million shares of common stock. This is in addition to a current authorization announced last September to purchase a similar 8 million shares. Timing of the purchase and the exact number of shares will depend on market conditions.

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New book available on intellectual property

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NEW YORK – The American Society of Mechanical Engineers (ASME) has published Intellectual Property: A Guide for Engineers. Published by ASME Press in collaboration with the American Bar Association Section of Intellectual Property Law, the book is designed to provide engineers in all disciplines with a basic understanding of intellectual property and its various forms. The book includes information on patents, copyrights, trades, federal registrations of trade names and Internet domain names. It also includes a chapter about intentional protections.

The book is $10 for ASME members, $13 for non-members. Bulk rates are available. To order, visit www.asme.org or call 800-843-2763.

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Call for Papers

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NORTHBROOK, ILL. – The IPC has announced a call for papers for APEX 2002, which will be held January 20-24, 2002, at the San Diego Convention Center. Papers are being sought on design, materials, assembly, processes and equipment; a complete list of topics is available at www.GoAPEX.org. Abstracts are due May 31. For more information on submitting an abstract, please contact Martin Barton, APEX conference director, at 972-424-8805; E-mail: [email protected].

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USI Manufacturing Services opens U.S. facility

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MORGAN HILL, CALIF. – USI Manufacturing Services Inc. has recently opened an electronic manufacturing services center in Morgan Hill, California, 15 miles outside of San Jose. The $10 million, 32,000-square-foot facility uses state-of-the-art equipment to design, manufacture, assemble and test prototype systems of communication, computer and consumer related products in a low-volume, high-mix environment. USI Manufacturing works closely with its customers' engineering and design teams to verify the prototype's manufacturability before it reaches production volumes. Customers have access to the services of USI Manufacturing's global partners, USI Inc. (an EMS provider) and ASE Group (a semiconductor packaging, assembly and test house). USI and ASE have manufacturing facilities in Taiwan, China, Hong Kong, Korea, Malaysia, Mexico, The Philippines and Scotland.

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Maxim acquires Dallas Semiconductor

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SUNNYVALE, CALIF. – Maxim Integrated Products Inc. has announced an agreement to acquire Dallas Semiconductor for approximately $2.5 million in stock. The acquisition is expected to be completed during the second quarter of 2001 and is subject to approval by Dallas Semiconductor's stockholders and compliance with applicable regulatory requirements. The transaction is intended to be accounted for as a pooling of interests and to qualify as a tax-free reorganization.

“Dallas Semiconductor has many product lines that are complementary to Maxim's, and we look forward to giving more visibility to Dallas Semiconductor's excellent digital and mixed-signal circuits in both the domestic and the international marketplaces,” said Jack Gifford, chairman, president and CEO of Maxim.

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FormFactor opens new Korean office

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LIVERMORE, CALIF. – FormFactor Inc., a leading provider of integrated wafer-level semiconductor test and packaging solutions, has opened a new office in Kunggi-Do, Korea. S.M. Kim, vice-general manager of FormFactor Korea, will manage the new office.

In addition to its probe card business, FormFactor's new office will help support technology partnerships and technology licensing arrangements with Korean chipmakers.

“Besides the obviously increased local technical and sales support, having this office helps us strengthen our relationships with Korean manufacturers as we move forward with several advanced new integrated back-end test and packaging solutions that can save customers up to 25 percent in back-end costs, as well as improve device performance,” said Kim.

FormFactor has developed the industry's first integrated process for wafer-level packaging and whole-wafer test. This technology has been licensed to leading DRAM manufacturers, including Infineon AG, and FormFactor is currently working with major packaging companies, including Japan's Shinko Denki.

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Agilent acquires MV Technology

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PALO ALTO, CALIF. ' Agilent Technologies Inc. has announced that its subsidiary, Agilent Technologies Ireland Ltd., will acquire MV Technology Ltd., a privately held provider of automated optical inspection (AOI) systems and solutions for the electronics manufacturing market. The acquisition of MVT (with more than 140 employees) includes products, patents, intellectual property and regional offices in Chicago, Singapore, Tokyo and Guadalajara, Mexico. Additionally, the two companies plan to establish a worldwide center for AOI in Dublin, called the Irish Imaging Operation. It will have global business responsibility for all of Agilent's AOI development, manufacturing, marketing and sales.

The transaction is expected to close in late March, after receipt of regulatory approvals and other closing conditions have been met. Upon completion of the acquisition, MVT will become an operation within the Imaging Division of Agilent's Manufacturing Test Business Unit, part of Agilent's Automated Test Group.

In related news, Agilent has announced plans to work with Siemens Electronics Assembly Systems (EAS) to jointly develop and implement integrated test and process control technologies for assembly lines.

The two companies will work to implement Agilent's Intelligent Test solutions within SIPLACE Global Solutions turnkey assembly lines. This will reportedly establish closed-loop control over the entire assembly process by relying on Agilent test and inspection systems to monitor manufacturing quality and provide feedback to other process points in the SIPLACE line.

In a separate agreement, Agilent and Siemens have agreed that Siemens will sell Agilent test equipment on a non-exclusive basis.

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NEMI seeks participation in data exchange project

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HERNDON, VA. – The National Electronics Manufacturing Initiative (NEMI) has issued an industry-wide call of participation for a new project aimed at accelerating the convergence of competing approaches for CAD data exchange formats used by the electronics industry. Through this project, industry participants will leverage the strengths of existing standards and solutions to recommend a common course of action for future standards work

The project's objective is to lower the industry-wide cost of design exchange through the consolidation of existing CAD/CAM exchange formats and stands to promote the development of software solutions built on a single, consensus-based exchange format. The intention is to develop a technical recommendation for a CAD/CAM data exchange format that can be widely adopted in a timely manner. This single format will combine the strengths of GenCAM, ODB++ and other related specifications.

More than 30 industry leaders discussed these objectives and the structure of the project at the APEX 2001 conference in January. More than 20 companies and organizations, including 10 OEM and EMS companies, participated in discussions.

“We want industry involvement in this important initiative,” said Jim McElroy, executive director and CEO of NEMI. “Broad participation from industry, especially from the user community, will help ensure that the project meets its goals.”

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WEB WATCH

EMEXCESS.COM
The electronics manufacturing services council of the IPC Association (Northbrook, Ill.) has launched www.EMexcess.com, a Web site designed for electronics manufacturers. The site allows users to post a file of obsolete/excess inventory and search by manufacturer part number. There is no fee to use the site, and all visitors can search the inventory to see what parts are available. However, only IPC members may post inventory and access the contact information needed to execute a purchase.

CAMTECHINC.COM
A new Web site, www.camtechinc.com, presents Camtech Automation's (Elgin, Ill.) capabilities for automated assembly, inspection, testing and imprinting of manufactured products. The site includes the company's system-development process, its engineering and design software alternatives, and a case

history portfolio. The site also provides customers planning on visiting the company with a map and driving directions as well as a

directory of area hotels and restaurants.

ECTINFO.COM
Through corporate Internet portals, Everett Charles Technologies (ECT, Pomona, Calif.) and its TTI Testron Division allow test engineers to request design quotations and follow the progress of user-specified automated-test equipment fixtures on-line. The ECT Web site, www.ectinfo.com, allows for quotes for fixture procurements; the TTI site, www.ttitestron.com, offers additional fixture types. The tracking system provides customers with real-time job-by-job information, as well as access to a master database of past projects. To access either system, the user must apply for a user ID.

BITECHNOLOGIES.COM
BI Technologies (Fullerton, Calif.) has expanded its Web site to include a new inventory locator feature, “netComponents.” The system allows customers to search product inventories throughout the company's network of authorized distributors.

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Movers and shakers

PEOPLE

Agilent Technolgies Inc. (Palo Alto, Calif.) has appointed Marcy Montgomery as general manager of the company's newly created Loveland Imaging Operation in its manufacturing test business unit.

Masayuki Ohi has joined APack Technologies Inc. (Hsinchu, Taiwan) as vice president for R&D and customer service.

Carol Latham, president and CEO of Thermagon Inc. (Cleveland), was named Cleveland Business Woman of the Year by Inside Business magazine.

Morgan Advanced Ceramics (Fairfield, N.J.) has appointed Kevin McAloon to serve as application engineering manager for the company's North American division.

GuerreraClick here to enlarge image

Frank Guerrera has been named customer service engineer for Ultrasonic Systems Inc. (Amesbury, Mass.).

Leonard Perham has been elected chairman of Portal Bay Inc. (Sunnyvale, Calif.), the parent company to semiconbay.com.

Mark Neal has been named director of customer service for RVSI Vanguard, a business unit of the Semiconductor Equipment Group of Robotic Vision Systems Inc. (Tucson, Ariz.).

Bliss Industries Inc. (Fremont, Calif.) has named Jim West as vice president of sales and marketing/chief sales marketing officer.

Daniel Sparks has been named vice president of new business development at BI Technologies (Fullerton, Calif.).

Solid State Equipment Corp. (Horsham, Pa.) has appointed Donald Campbell to the newly created position of director of customer satisfaction. The company is also opening new sales and service centers in New Castle, England; Newport Beach, Calif.; and Hsin Cho, Taiwan.

COMPANIES

Terrasem (O-Chang Industrial Park, Korea), a CMOS image sensor and tape carrier packaging and testing house, has built a new factory with first production slated to begin this month. The factory will include package design, assembly and test. DK Lee is the CEO of the operation.

Cryopak Industries Inc. and Cryopak Corp. have moved to a new manufacturing facility. The new contact information is 1053 Derwent Way, Annacis Island, Delta, British Columbia, V3M 5R4 Canada; 604-515-7977 or 800-667-2532; Fax: 604-515-7978.

OMM Inc. (San Diego), a supplier of photonic switching subsystems based on MEMS technology, recently received two awards for its technology innovations: the Laser Focus World 2001 Commercial Technology Achievement Award (in the category of fiberoptics/optoelectronics components) and the 2000 Photonics Circle of Excellence Award.

Smart Sonic Corp. (Van Nuys, Calif.) has earned a U.S. Presidential Green Chemistry Challenge Award nomination for its 440-R SMT Detergent, a non-hazardous aqueous detergent used in assembling printed circuit boards.

International Rectifier (El Segundo, Calif.) has received JANS certification by the Defense Supply Center Columbus for its wafer fabrication facility.

Insilco Corp. (Raleigh, N.C.) has changed its name to Insilco Technologies. The company serves telecommunications, computer networking, data processing, medical instrumentation and automotive markets with its manufacturing of cable assemblies and electromechanical subassemblies, transformers, high-speed modular connectors and precision stamping. The company's custom assembly segment (formerly ESCOD Industries) also has a new corporate name: ITG Global. This division has recently added a fiber optic manufacturing facility to its Larne, Northern Ireland plant.

Deloitte & Touche named Methode Electronics Inc. (Chicago) and its subsidiary, Stratos Lightwave Inc., to its list of “Technology Fast 50” in 2000 for the greater Chicagoland area. Methode Electronics manufactures components devices for OEMs and Stratos Lightwave develops and manufactures optical subsystems and components.

Router Solutions Inc. (Newport Beach, Calif.), a software provider of tools for the electronics industry, has opened a technical sales and support office in Guadalajara, Jalisco, Mexico. Arturo Gallaga will head the operation.

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Correction

In the November/December 2000 issue, Figure 1 from the Back-end Process series “Singulation” on page 59 should read “Flow chart showing auto sequencing between the saw and pick-and-place handler.”

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Briefly Speaking

Corning to expand calcium fluoride production
Corning Inc. is expanding its North Brookfield, Mass., operations to meet a growing demand for calcium fluoride optics. The facility currently manufactures calcium fluoride optics and components used by excimer laser manufacturers. The expansion will focus on the production of lithography-grade calcium fluoride optics.

New machining company
LFI Machining Inc. has established a new 15,000 square-foot manufacturing and sales facility to support various sectors of the ceramic and metal industries, including the semiconductor market. The new company hosted an open house in February. Its contact information is 1515 Harbor Blvd., West Sacramento, CA 95691; 916-372-8593; Fax: 916-372-8526; E-mail: [email protected].

Entegris to acquire NSE fluid handling
Entegris Inc. has recently signed a letter of intent with Nisso Engineering Co. Ltd. (Tokyo) to acquire the NSE fluid handling product line.

“The proposed acquisition of [Nisso's] fluid handling component product line fits well with Entegris' strategy to increase our presence and market share in Taiwan and Japan. It will provide the opportunity to fill out our product line and offer more materials integrity management solutions…” said Frank Sidell, president of Entegris' fluid handling group.

Under the terms of the proposed agreement, Entegris will purchase the complete interest of NSE's component product lines, including pumps, valves, fittings, distribution rights of level sensors and other related intellectual property rights.

Loctite acquires Power Devices
Loctite Corp., an affiliate of Henkel KGaA, has acquired Power Devices (Laguna Hills, Calif.), a supplier of phase-change thermal management technology for electronic and electromechanical applications. A privately held company, Power Devices will retain the same management team.

By Mark Diorio

Factory automation continues to be a much-debated subject in assembly factories. While advertising campaigns and marketing efforts would have us believe that full automation is a necessity or that only the very best will produce the very best, many factories do quite well by using a minimum level of automation. For every fully automated line in production today, I would estimate that there are at least ten that are not and they are doing just as well as the automated lines – if not better.

Having a fully automated system is not a guarantee for success; success still comes down to people (the very element that full-scale automation is trying to erase). But people do need to have good tools to do their jobs well, so it is appropriate to review the various levels of automation available today.

Process Automation

Process automation is the information housekeeping and material processing of a single assembly step. It allows for the ability to store and recall product-specific parameters that control how a piece of equipment will interact with a product being manufactured. This generally is achieved by defining motion controls. This level of automation is a requirement for manufacturing a high quality product around the clock. It is a level of automation that we largely take for granted, as almost any piece of equipment used in high-volume manufacturing today can repetitively perform its function with very little human interaction.

Communication Automation

Communication automation is the exchange of information between the shop floor and the rest of the organization.

Depending on the factory's infrastructure, the following items are supported:

• The shop floor stores process parameters off-line and exchanges them both within the factory and remotely to other factory sites.
• Factory staff monitors, schedules and routes work-in-process in accordance with factory ability and market needs.
• Suppliers and factory buyers respond to material resource planning needs.
• Engineering studies yield-enhancement and responds to SPC trends.

Material Handling Automation

The facilitation of material transfers between different assembly operations or process steps is material handling automation. Material is presented to the various assembly operations in a standard carrier configuration; it is then transferred or routed to subsequent operations or process steps.

Material handling automation may couple as few as two process steps together (such as mark and test) or many steps that are necessary to complete the entire packaging process. By doing this, the factory typically profits from labor savings while realizing reductions in handling-related losses. There are a myriad of automation providers available, from assembly equipment makers that provide in-line solutions to system integrators that can provide essentially the same functions and, in some cases, better results. This level of automation is the most difficult to justify, especially if you are already running at peak efficiencies and producing to a greater than 99.5-percent yield.

Which Level Is Right for You?

Bottom line – does an automated assembly line bring more customers and provide higher margins? One U.S.-based assembly factory recently launched all three levels of automation, and it is now out of business. In comparison, there are factories with no more than two levels of automation that are assembly leaders. There are even some companies with only the first level of automation that are doing admirably.

Considering that automation goes beyond labor savings (and realizing that higher yields can be obtained, equipment utilization can be increased and cycle times reduced), automation is a well-justified practice. However, in practice, deciding on automation levels comes down to what is right for you and your company. Although you may find worth in automation, the ultimate question is if your customer will. At the end of the day, they are going to ask about quality criteria, the parts they need, how fast you can make them and the price. And your boss (or shareholder) is going to ask, “How much money did we make today?”

AP

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MARK DiORIO, chief executive officer, can be contacted at MTBSolutions Inc., 1630 Oakland Road, Suite A102, San Jose, CA 95131-2450; 408-441-2173; Fax: 408-441-9700; E-mail: [email protected].

For more information, circle the corresponding numbers on the reader service card and mail back. For faster results, fax the card to 413-637-4343, or visit www.onlinecenter.to/ap.

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Relays
PT Series relays have low profiles and offer 2-, 3- or 4-pole double throw contacts for switching currents up to 12, 10 or 6 amps, respectively. The relays stand 1.14-in tall and are available in plug-in and PCB mountable versions with either AC or DC coils. Contact material is cadmium-free silver-nickel alloy (AgNi 90/10) offered with or without gold plating. The system is said to require less coil power than previous designs but generates higher contact forces. Coil power requirement is 750 milliwatts, and each relay is equipped with a manual test tab and a mechanical indicator. A full line of sockets and accessories is available for use with the plug-in version of the PT relay. Tyco Electronics, Harrisburg, Pa.

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Ceramics
A new line of controlled resistivity ceramics for static charge dissipation is said to be ideal for mechanical, chemical or vacuum applications that require controlled electrical conduction or static dissipation. These ceramics feature metallized, brazed or bonded assemblies, and are manufactured in a range of insulating and controlled resistivities. Morgan Advanced Ceramics, Latrobe, Pa.

Reliability Test Vehicle
Polymer Flip Chip's reliability test vehicle (RTV) evaluates conductive and underfill epoxies for flip chip assembly reliability and repeatability. The RTV device consists of a patterned FR-4 chip carrier and a matching thin-film metallized chip that, when assembled together, form a series of low-resistant daisy-chained bump connections in a diagonal pattern under the chip. The obtained resistance values can be used to calculate an average bump- interconnect resistance for comparing differing conductive epoxies and evaluating the change in interconnect resistance during temperature cycling and prolonged high-temperature storage. Polymer Flip Chip Corp., Billerica, Mass.

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Rework System
The M-9100AV rework system automatically calculates alignment, places the component and solders it. Unlike split-vision systems, the M-9100AV is said to require minimal training and no calibration. The system's software provides complete control over temperature, airflow and duration during the solder process. Solder profiles are graphically displayed in real-time for easy monitoring. The system includes a large area IR board heater to prevent board warpage, plus pad cleaning and precision dispense tools. Manncorp, Huntingdon Valley, Pa.

AlN Substrates
Aluminum nitride (AlN) substrates are now available from Valley Design. They come in sizes as large as 4.5 inches square or round, and in thicknesses from 0.003 to 0.100 inch. The substrates are stocked as-fired, and may be lapped and polished with surface finishes from 0.5 to 20 micro-inches. AlN features a thermal conductivity of 180 W/mK, good dielectric properties and low thermal expansion (similar to silicon). The substrates are said to be ideal as an electrically insulating non-toxic material for hybrid, power and microwave electronics applications. Valley Design Corp., Scotts Valley, Calif.

Analyzer Software
WaferAnalyzer 2.2 with camLine SPC is a software application designed to analyze production-related defect problems and monitor process variations through advanced trend identification. The software is said to be proficient at monitoring trends, such as in-line process control and inspection tool control. Additionally, the SPC application has advanced set-up for control charts and performs distribution analysis. ADE Corp., Westwood, Mass.

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Photonic Soldering System
The LS-200 photonic soldering system is designed for soldering rework of all types of components. The system is said to be ideal for soldering and desoldering RF shielding and various paste-in-hole and solder-paste-on-through-hole applications. The LS-200 is a semiautomatic, off-line rework system that prevents overheating and thermal stress of components, the board and adjacent components, while also enabling the programming of precise reflow profiles. The system handles boards up to 24 x 24 inches, and its vision system uses software control to achieve accuracy of more than 0.001 inch. A temperature recorder uses thermocouples to track temperatures, and a Windows NT interface allows customers to link rework information to their entire process. No tooling changeover is required for different components. A laser beam can be adjusted from 1.0 to 4.0 mm and can be programmed to follow any path, including pinpoint, peripheral and grid array heating. ViTechnology LLC, Haverhill, Mass.

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Bar Code Placement
Siemens Siplace placement systems with dual conveyors now feature a PCB barcode reader for improved reliability. A laser scanner reads the barcode label on the top or bottom side of each incoming PCB, and the computer then uses this information to automatically select the correct placement program. All current types of barcodes are supported. The placing of components can be carried out on different products in the two conveyors, with asynchronous transport. This new barcode feature is available with the introduction of software version 502 for the Siplace S-25 HM and HS-50. Siemens Production and Logistics Systems AG, Nuremberg, Germany.

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Solder Joint Inspection
The IS-1000 inspection system allows operators to easily inspect solder balls underneath a component. Images are captured on video reportedly for a fraction of the cost of X-ray inspection. The system employs non-glare light and is used to identify lifted leads, cracks, solder balls, bridging, cold soldering and misalignment. It can inspect BGA, CSP, QFP and LGA solder joints. Magnification is up to 140x on a 14-inch monitor. ASG, Cleveland, Ohio.

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EMI Gaskets
Gore-Shield SMT EMI gaskets can be used as an RF grounding pad or interconnect. These gaskets conduct currents of a primary RF signal much the same way a connector conducts RF currents from a PCB to a coaxial cable, and are also said to provide shielding to protect against EMI emissions as compared to metal spring contacts. The gaskets can be used anywhere a designer needs to place an electrical contact point and come in several different sizes. All parts are shipped in tape-and-reel that is compatible with surface mount pick-and-place machinery. W.L. Gore & Associates, Newark, Del.

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Progressive Scan Camera
The BCV-M10 provides two PCBs, each measuring 1.57 inch square. 0.5-inch format CCD sensor and driver circuits are located on one board; timing and video circuits are located on the other. The two boards are permanently interconnected via a 2.17-inch flex cable that allows the boards to be freely positioned. The system can be operated in a continuous mode at 25 progressive scan frames per second, or externally triggered using pulse width to govern shutter speed or edge triggered for operation at a pre-set shutter speed. The camera can provide synchronization in the form of HD/VD pulses. The unit also features a frame-delay readout mode that allows the captured image to be stored in the CCD sensor for a maximum of 80 ms. Using this feature, three cameras can be configured with a single frame grabber for 3-D image capture. JAI America, Laguna Hills, Calif.

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Conductive Epoxy Adhesive
Tra-Duct 2705 is said to be a low-cost epoxy that forms strong bonds with most metals, ceramics, glasses and plastics. With a room-temperature cure, the product is good for cold solder for bonding and shielding heat-sensitive components. The epoxy is a nickel-filled material that is a smooth paste upon application. It is recommended for use where exposure to salt water causes silver-based systems to corrode. The product is free of solvents, silver, copper or carbon additives and is reportedly a cost-effective replacement for many gold- and silver-based products. Tra-Con, a National Starch & Chemical Co., Bedford, Mass.

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Machinable Ceramic
Aremcolox 502-1550 is a zirconia phosphate-based machinable ceramic used for producing specialized brazing fixtures, induction liners, wafer chucks, optical stands and combustion nozzles for applications to 1,550°C. The product has a low CTE of 0.5 in/in/°F x 10-6 and is available in both low (60 to 70 percent) and medium (70 to 80 percent) density compositions. Both forms are said to exhibit good mechanical strength and electrical and thermal insulation, a compressive strength of greater than 25,000 psi, dielectric strength of 80 volts/mil and thermal conductivity of 5.3 Btu-in/hr-ft²-°F. The material is inert, will not outgas in ultra-high vacuum and does not react with most molten metals, salts and acids. The product is available in rods from 0.5 to 2.5-inch diameter, and plates from 0.25 to 1.00-inch thick. Aremco Products Inc., Valley Cottage, N.Y.

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Vertical Oven
The Vertical Pro inline oven is an integrated thermal process solution for automatic production lines. Applications include drying of electronic components, underfill curing for flip chip assembly and SMT bonding. The oven is suited for thermal processes from 50 to 300°C, with cycle times from a few minutes to six hours. The Vertical Pro features a small footprint (2.5 m²), and is built with seven heating zones and one cooling zone, each with separate temperature controls. The maximum temperature is 300°C, with a temperature uniformity of ± 3 K at 200°C and ± 5 K at 300°C. Lükon Thermal Solutions, Täuffelen, Switzerland.

Conductive Platinum Coatings
Three types of conductive platinum inks for screen printing are being offered by Eltecks. After application, they are fired at 575 to 1,400°C to develop electrical conductivity and adhesion. They may also be applied by brushing by thinning them with a proprietary paste thinner. The fired films are 10 to 12 microns thick and have sheet resistivity less than 0.05 ohms per square. 3335 is suitable for application on alumina, porcelain, steatite, zirconia, lanthanum-chromite, lithium-niobate and other high-temperature materials. 3335-G is designed for application on glass, and 3335-UF is an unfluxed version and forms a fired film with 99.99-percent platinum. Eltecks Corp., Bangalore, India.

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Epoxy Preforms
Uni-forms epoxy performs, an alternative to liquid epoxy, are designed to provide a simple method for sealing or potting electromechanical components. Uni-forms are one-part epoxy resins that are solid at room temperature. When heated, they melt and cure, forming a consistent seal that protects components from dust, moisture, |oil, flux, industrial cleaning solvents, conformal coatings and other contaminants. The performs are available in a range of shapes, sizes and materials, and can be dispensed at rates of 200 to 600 ppm. Multi-Seals Inc., Manchester, Conn.

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Clock Oscillators
Surface mount R3312 clock oscillators operate from 1.5 to 125 MHz and are stocked in quantity for several widely used frequencies. The standard frequencies are 25, 44.736, 50, 75, 100 and 125 MHz. The oscillators are available with 50 parts-per-million frequency accuracy over the -40 to +85°C range. Available for 3.3V operation, the oscillators feature 35 mA maximum current draw at 125 MHz. The oscillators are said to function during ± 10-percent supply voltage variations. The R3312 oscillators reportedly preserve better than 45/55 symmetry and feature 2.5 ns maximum rise/fall times. Jitter specification is 5 ps RMS maximum. The oscillators are built in a 5 x 7.5 x 2-mm surface mount package, and are available in tape- and-reel. MF Electronics Corp., New Rochelle, N.Y.

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Cobalt Target
Tosoh SMD's new cobalt target features a reduce grain size and a high pass-through flux, which are said to contribute to better film thickness uniformity and target utilization in advanced semiconductor physical vapor deposition cotact processes. The target has a hexagonal-close-packed target microstructure and has a fine grain size of less than 75 microns. High purity 3N5 and 4N5 solder-bonded cobalt target assemblies are available. Tosoh SMD Inc., Grove City, Ohio.

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Bench-top Dispensing Robot
The I&J 2300 fully automatic bench-top dispensing robot is 560-mm wide and 529-mm deep, has a work area of 300 x 320 mm and weighs 35 kg. It comes with ready-to-use dispensing software, RS232C lead and memory card for program storage. Hardware is also available that allows for mounting of dispensing barrels, valves or cartridges to the robot's Z-axis. Typical materials dispensed include epoxies, silicones, inks, solder pastes, adhesives, fluxes, greases, lubricants and potting compounds. The system allows most liquids or pastes to be dispensed automatically in any sequence of dots, circles, arcs and lines. A multi-axis configuration allows for full control of dispensing over three-dimensional objects. I&J Fisnar Inc., Fair Lawn, N.J.

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Carrier Tape
Nu-Way Electronics offers custom carrier tape that allows packaging of components on tape-and-reel for pick-and-place of components onto PCBs using any standard SMT feeder. Tapes are available in 8-mm and 12-mm widths, conforming to EIA-481-1-A. The tapes are manufactured in a way that reportedly produces precise, consistent tape pockets. Nu-Way Electronics Inc., Elk Grove Village, Ill.

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Liquid Dispenser
The MicroMax Dispenser is part of a series of liquid dispensing systems that is said to be ideal for non-heated applications in surface mount applications and semiconductor packaging. The MicroMax has a stable composite base with a footprint of 36.5 x 47 x 59.5 inches, and a work area of 12 x 12 inches. The system has a dispense rate up to 36,000 dots per hour at a speed of 30 inches per second, and can be operated as a conveyorized system for PCBs or boats/carriers. With the capability for mounting two valves at all times, the system dispenses dots as small as 10 mil. The MicroMax reportedly features X-Y-Z accuracy better than ± 0.0015 inch and X-Y-Z repeatability less than ± 0.0006 inch. The product employs a real-time multi-tasking operating system with proprietary software displayed in an X Windows format. GPD Global, Grand Junction, Colo.

Spray Fluxing
The EZ-Flux automatic spray fluxing system is said to offer economical application of flux to printed circuit boards. The product uses spray nozzle technology with two-direction spray. An air-actuated traversing mechanism is said to provide precise motion control at a speed of 10 to 15 inches per second. Deposition variation is reportedly maintained at ± 15 percent. The EZ-Flux spray head delivers flux through a pressurized delivery system with a deposition range of 500 to 3,000 µg/in². A dual nozzle option allows the operator to switch flux types in less than one minute. Additionally, the system can be upgraded to include Ultra-Spray technology, which features a vibrating solid titanium head and powerful air jets that create a repeatable spray coating. The product accommodates all liquid fluxes, including no-clean, O/A and RMA fluxes. Standard board width is 1 to 20 inches, with the option of expanding to 24-inch capacity. The system can be installed internally or externally to a wave soldering system, or in a stand-alone unit. Ultrasonic Systems Inc., Amesbury, Mass.

Assembly and Test Software
Trilogy 5000 CAM software (release 6.0) is for virtual prototyping, assembly and test. The software is said to address time and cost problems associated with handling multiple types of engineering data, such as design data, bills of materials and approved vendor lists. Using the open ODB++ data exchange format, the software reportedly incorporates machine optimization and line balancing functions. Additionally, ProBOM is a new lightweight, standalone tool that has been developed to work with Trilogy 5000 and other systems for the reading and creation of first version BOMs early in the assembly cycle. Valor Computerized Systems, Lake Forest, Calif.

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Odd Form Placement
The Polaris Assembly Cell provides automated odd form component placement and final assembly in one machine. Features include open architecture, multi-level assembly capability, customizable tooling, user-friendly interface, CAD-driven placements, vision inspection and orientation, and the flexibility to handle a wide component range. Universal Instruments Corp., a Dover Corp. Co., Binghamton, N.Y.

Tape-and-Reel System
The DT-8000 high-performance tape-and-reel system is said to provide ultra-safe, high-throughput inspection and handling of SOIC, SSOP, TSSOP, MSOP and similar devices. The system accepts devices in tube or magazine, and outputs to tube or tape. The DT-8000 uses Drop-Point technology, with which a gravity-assisted arm moves each device into tape in a single, unidirectional motion, eliminating torsional forces and the risk of damage to leaded devices. Also, the system does not allow devices to come into contact with one another after inspection, which reduces the risk of device damage, misalignment and system jams. For tube-to-tube applications, throughput is reportedly up to 10,000 units per hour with full vision inspection. The advanced vision system, the AVS-4000, inspects for lead quality, marking and orientation, as well as providing complete, camera-based 3-D measurement of lead and average plane coplanarity, terminal dimension, true position span and spread error, pitch, width and standoff. Robotic Vision Systems Inc. (RVSI), Canton, Mass.

Silicon-based Conformal Coatings
The 1900 series is a family of three silicon-based conformal coatings is reportedly formulated to deliver high performance, PCB protection, cost-of-use advantages and compliance with most international regulatory standards. These silicon-based formulations are said to offer flexible, low-stress protection for fine pitch leads and delicate components. All three coatings are self-priming materials using non-corrosive moisture/condensation cures. They can be cured at room temperature or accelerated by heat, forming transparent elastomers with good electrical properties over a wide temperature range (-55 to 200°C). The one-part formulations come ready to apply in many process conditions, including selected no-clean flux residues. The products can be blended to achieve viscosity between 130 and 50,000 cps without the use of solvents. Dow Corning, Midland, Mich.

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Surface Mount Adapters
New footprint conversion adapters for surface mount devices are said to allow customers who face integrated circuit shortages or obsolescence to use a similar device in a different package style without re-spinning their motherboard. The design reportedly allows for conversion of almost any surface mount device footprint to another; examples include QFP to BGA, BGA to BGA, and TSOP to SOIC adapters. Standard products have one-to-one pin outs. Capacitors and resistors are added and signals can be re-routed as required to match functionality of the original or a competitor's device. ISI offers concept to prototype in two weeks, and volume production in four weeks. Interconnect Systems Inc., Camarillo, Calif.

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In-line Dispensing
The Millennium M-2022 Series dispensing system, with high-capacity conveyor technology, is said to be ideal for microelectronics applications, especially underfill and dam and fill. Underfilling the components in one lane can be done while fluid flows in the other lane. Each lane can be controlled and moved independently. Up to an 80 percent increase in throughput is achievable by eliminating conveyor transport time and the time a dispensing system has to wait for flow-out. The M-2022 system comes standard-equipped with capacity to support six heaters and lift tables operating independently. Three stations are available for each lane: pre-heat, dispense and post-heat. Asymtek, a Nordson Co., Carlsbad, Calif.

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Screen Printer
The KS-1700 printer is said to remedy inconsistent printing and insufficient stencils by troubleshooting problems. The system features a proprietary floating and rotating squeegee head design, equipped with a linear guide and cylinder, allowing it to rotate 90 degrees and enabling the operator to easily clean front and back blades. The machine includes a solder paste dispenser that holds standard cartridges. The printer's dual fiducial cameras provide a fully automated vision system for both stencil and board, resulting in a reported accuracy of ± 0.001 inch at 3s with fiducials and ± 0.004 inch without fiducials. The auto conveyor width adjustment results in minimal board warpage; warp tolerance is ± 0.079 inch. The KS-1700 also has flexible transport system specifications. Standard height is 37.40 inches, ± 0.787 inch. There are buffer conveyors on both input and output with an optional fixed rail, and a 20 x 20-inch stencil adaptor. Juki Automation Systems, Morrisville, N.C.

Reflow Software
Version 1.04 Profile Planner has added more than 200 solder pastes to the specification database. This tool is said to provide electronic assemblers the ability to generate a robust thermal profile for a specific combination of reflow oven and solder paste. The new Profile Planner includes a built-in reflow oven configuration database, an expanded solder paste specification database, the ability to match/optimize a paste to an oven using an overall “goodness factor,” direct links to the Web sites of oven and paste manufacturers, and universally accepted Excel workbook software application. ECD Inc., Milwaukie, Ore.

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Laser Marking System
The SmartLase laser marking system is said to be ideal for marking on circuit boards, semiconductors, and interconnect, passive or electromechanical devices. The CO2 system does not require a PC on the factory floor, and also allows marking of products such as connectors, resistors, switches and relays. Markem Corp., Keene, N.H.

AP