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Renesas to spend 40-50 billion yen to up 300mm wafer output

01/05/2005  January 5, 2005 - Betting that demand for high-performance chips will remain strong despite the overall market slowdown, Renesas Technology Corp. next fiscal year plans to invest 40-50 billion yen (US$382-477 million) to increase its monthly production capacity for 300mm wafers, the Nihon Keizai Shimbun reported.

Silicon waste converted into usable substrate for solar cells

01/05/2005  January 5, 2005 - IIS Material, a startup spawned from research at the University of Tokyo, has developed a way to remove impurities from the silicon waste generated in the semiconductor manufacturing process so the silicon can be reused as a substrate for solar cells, according to the Nihon Keizai Shimbun.

Analysts advise option pricing for nano platform plays

01/05/2005  As nanotechnology companies move into public markets, early stage companies may lack the revenue visibility usually accompanying startups in more established industries. It is arguable that a platform technology-based nanotechnology company deserves a premium valuation: one that exceeds the value of its visible product line.

Zyvex introduces nanotube epoxy concentrates

01/05/2005  Zyvex, a Richardson, Texas-based provider of nanotools and materials, today announced it has expanded its NanoSolve product line with nine new product offerings.

Atlas Mining and NanoDynamics to collaborate on nano project

01/05/2005  Atlas Mining Co. and NanoDynamics Inc. announced they have established a strategic relationship to develop high value applications for the hollow microtubules currently being produced at the Dragon Mine in Juab county, Utah.

January 2005 Exclusive Feature:
FLAT PANEL DISPLAYS

Technology for deposition and patterning of OLEDs



01/04/2005  By Janice K. Mahon, Min-Hao Michael Lu, Universal Display Corp., Ewing, New Jersey

VTE has been the leading technology for OLED production, but OVPD, IJP and LITI have the potential to drive display performance and manufacturing efficiencies in future device generations. For OLED technology to advance in FPD applications, its production technology must continue to achieve device performance advances and manufacturing cost reductions.

Jan. 2005 Exclusive Feature:

3D interconnect gets real



01/04/2005  By Dr. Paula Doe, Contributing Editor
After all these years of hype, vertical interconnects are finally starting to replace horizontal connections in real products. Infineon is directly connecting security controller chips on top of memory chips in smart cards. Mattel's new Juice Box* media player for kids uses Matrix Semiconductor's built up layers of programmable ROM for its videos on memory cards. And Tezzaron....

Jan. 2005 Exclusive Feature:

IMEC explores self-adjusting circuits for solving future scaling problems



01/04/2005  By J. Robert Lineback, Senior Technical Editor
Researchers at IMEC in Belgium have embarked on an ambitious program to change the meaning of "design for manufacturing." During IMEC's Annual Research Review Meeting this fall, managers outlined a new system-level integration program that will explore circuit and system design concepts, addressing the growth of technology barriers as IC feature sizes are scaled smaller at the 45nm and below process nodes.

'Slump' Forecasted for 2005

01/04/2005  (January 04, 2005) Scottsdale, Ariz.—The semiconductor industry is sliding into another slump, with 2005 expected to be a down year with revenue declining 5.7% to $199.3 billion, according to In-Stat analysts. This downturn comes on the heels of annual revenue growth of 27.0% in 2004, and a record annual revenue of $211.4 billion.

NEMI Becomes "iNEMI"

01/04/2005  (January 04, 2005) Herndon, Va. — The National Electronics Manufacturing Initiative (NEMI), an industry-led consortium focused on strengthening the global electronics manufacturing supply chain, announces that it has changed its name to iNEMI — the International Electronics Manufacturing Initiative.

Jan. 2005 Exclusive Feature

Sematech hunts for collaborative path to 450mm



01/04/2005  By J. Robert Lineback, Senior Technical Editor
Ready or not, the semiconductor industry is attempting to work up the gumption and early development strategy for the next big wafer challenge: 450mm diameter silicon substrates. Nearly all experts agree that the industry is dragging its collective heels in organizing an effort to define and create R&D programs needed to put 450mm wafers into production by 2011-2012.

Soitec partners with Sematech to develop multigate FETs for 45nm and below

01/04/2005  January 4, 2005 - In an effort to accelerate the development of new-generation transistors, Soitec has announced its participation as the SOI substrate supplier in a development program led by the Advanced Technology Development Facility (ATDF), the new independent subsidiary of Sematech for advanced semiconductor R&D in Austin, TX.

Agilent Ships 100 Millionth FBAR Filter

01/03/2005  (January 03, 2005) Palo Alto, Calif. — Agilent Technologies announces that it has shipped its 100 millionth FBAR (film bulk acoustic resonator) filter since its release in December 2001. Demand has been so strong that Agilent has increased its shipments to six million per month. FBAR filters are used in mobile phones, data cards, and other wireless products operating in the U.S. PCS frequency band.

Global Semiconductor Sales Surpass $19 Billion in November 2004

01/03/2005  (January 03, 2005) San Jose, Calif. — Worldwide sales of semiconductors grew to $19.02 billion in November 2004, an increase of 1.3% from the $18.8 billion in October 2004, and an increase of 18% from the $16.12 billion in October 2003, the Semiconductor Industry Association (SIA) reports.

Global semiconductor sales surpass $19 billion in November

01/03/2005  January 3, 2005 - Worldwide sales of semiconductors grew to $19.02 billion in November, an increase of 1.3% from the $18.8 billion in October, and an increase of 18% from the $16.12 billion in October 2003, the Semiconductor Industry Association (SIA) reported today.