Featured Content




SEMI survey: Equipment makers expect a "robust" 2004

12/04/2003  December 3, 2003 - Semiconductor equipment manufacturers expect 8% sales growth this year to $21.4 billion -- double the increase they predicted just a few months ago -- and nearly 40% growth in 2004, according to the year-end edition of the SEMI Capital Equipment Consensus Forecast.

Japanese equipment orders continue to impress, while sales regress

12/04/2003  December 1, 2003 - Global orders in October of Japanese semiconductor equipment soared above 100 million yen for the third consecutive month, and are at their highest levels in nearly three years, according to the latest figures from the Semiconductor Equipment Association of Japan (SEAJ).

Chartered: 4Q outlook rosy

12/04/2003  December 1, 2003 - Singapore's Chartered Semiconductor Manufacturing Co. has raised its outlook for 4Q03, thanks to increased demand from communications customers.

SIA: Chip sales continue double-digit growth

12/04/2003  December 1, 2003 - Worldwide semiconductor sales continued to rebound in October, posting the eighth consecutive monthly increase and largest month-to-month gains since 1990, according to data from the Semiconductor Industry Association (SIA).

KLA-Tencor, Soitec work on 90nm, 65nm SOI

12/04/2003  November 25, 2003 - KLA-Tencor, San Jose, CA, and Soitec, Grenoble, France, are forming a joint program to improve the quality and yield of, and production costs for, silicon-on-insulator (SOI) wafers.

Toshiba to boost memory line

12/04/2003  November 26, 2003 - Toshiba Corp. reportedly plans to invest up to 12 billion yen to boost output at its facilities in Oita, Japan.

Japan institute licenses wafer technology

12/04/2003  December 4, 2003 - Japan's Super Silicon Crystal Research Institute Corp. has licensed its wafer processing equipment to South Korea's Tera Semicon Corp. and Japan's Shinkugiken Co.

At last: North American book-to-bill achieves parity, says SEMI

12/04/2003  November 30, 2003 - Need more proof that the industry is pulling itself up? For the first time since August 2002, semiconductor equipment sales and orders reached the parity mark of 1.0 in October, according to Semiconductor Equipment and Materials International (SEMI).

ASML inks another litho deal

12/04/2003  November 25, 2003 - A week after announcing a similar partnership with Dainippon Screen, ASML NV, Veldhoven, The Netherlands, has signed a deal with Tokyo Electron Ltd. to link the companies' lithography and track systems.

Sematech qualifies low-k material

12/04/2003  November 28, 2003 - International Sematech, Austin, TX, says it has qualified an ultra-low-k material for dual damascene copper processing at 0.13-micron features, using 193nm lithography on 300mm wafers.

AMAT introduces first automated in-line SEM/FIB system

12/04/2003  November 28, 2003 - Applied Materials recently introduced the SEMVision G2 FIB defect analysis system, touted as the first in-line production tool to integrate several technologies into one system: advanced defect-review scanning electron microscope (SEM), automated focused ion beam (FIB) cross-sectioning, and EDX energy dispersive x-ray analysis capabilities.

Sematech forms manufacturing group

12/04/2003  November 28, 2003 - International Sematech, Austin, TX, plans to form a new consortium of fabs and chipmakers to focus on manufacturing infrastructure, methods, standards, and productivity.

AMD unveils chip plant plans

12/04/2003  November 21, 2003 - It's official: AMD's new $2.4 billion 300mm fab will be built in Dresden, Germany, the first new chipmaking facility in Europe in years.

UM physicists demonstrate carbon nanotubes make best semiconductors

12/04/2003  (December 4, 2003) College Park, Md.—University of Maryland physicists have found that semiconducting carbon nanotubes have the highest mobility of any known material at room temperature. Mobility is a measure of how well a semiconductor conducts electricity.

AMD offers 4Q guidance, stakes 300mm territory

12/04/2003  November 17, 2003 - At its annual analyst meeting, AMD, Sunnyvale, CA, said it expects to report higher 4Q sales for both chips and flash memory, thanks to increased consumer and corporate spending.

Canon: Immersion is the future

12/04/2003  November 17, 2003 - Immersion lithography could replace super-high NA 193nm lithography for 65nm and 45nm production, according to an executive in Canon USA Inc.'s semiconductor equipment division.

Gap widens between global, domestic sales of Japanese equipment

12/04/2003  Global orders in September of Japanese semiconductor equipment continued to display solid gains, soaring above 100 billion yen for the second consecutive month at levels not seen since January 2001, according to the latest figures from the Semiconductor Equipment Association of Japan (SEAJ).

ASML, Dainippon Screen sign litho deal

12/04/2003  November 21, 2003 - ASML NV, Veldhoven, The Netherlands, and Dainippon Screen Manufacturing Co. Ltd., Kyoto, Japan, have agreed to co-develop methods for linking their track and lithography systems.

Wacker: No layoffs, just pay cuts

12/04/2003  November 21, 2003 - Wacker Siltronic says it will implement pay cuts at its Burghausen site in order to avoid layoffs announced last month.

LSI to sell storage business

12/04/2003  November 17, 2003 - LSI Logic, Milpitas, CA, plans to spin its storage systems business into an independent storage systems company, separate from its semiconductor business.