10/01/2003 Relative humidity is one of the environmental conditions usually specified for cleanroom operations. Relative humidity in a semiconductor cleanroom is typically controlled to a target value somewhere within the 30 to 50 percent range, and with tolerances as narrow as ± 1 percent for some areas, such as photolithography—or even less for deep ultraviolet processing (DUV)—and relaxing to ± 5 percent in other areas.
10/01/2003 Last month, we discussed filters and how they work. We reviewed the three primary filtration mechanisms—interception, impaction and diffusion. We also briefly described sieving (the mechanism represented by a fly against a window screen) as a special case of interception.
10/01/2003 Different types of materials, increased automation and advanced team design processes are just some of the ways companies can lower costs and maintain high standards. Add to that the desire of consumers to have smaller and lighter products, and the challenge that OEMs face today is clearly recognized.
10/01/2003 As the semiconductor manufacturing industry becomes increasingly competitive under the current economic conditions, chip manufacturers continue to look for new ways to maintain a sharp, competitive edge.
10/01/2003 Most people know that static electricity can present risks and cause problems in a variety of industrial situations. The electronics industry is particularly susceptible because of the low energy and low voltages at which damage can occur.
10/01/2003 Static charge build-up can ignite combustibles, shock personnel and destroy sensitive components. It also attracts dirt, dust and other contaminants that can worsen processing problems and increase product scrap.
10/01/2003 CleanRooms West 2003—held September 22-24 at the Anaheim Convention Center in Anaheim, Calif.—gave contamination control professionals the chance to get a first-hand look at products and services designed to improve cleanroom practices.
10/01/2003 Mold compounds are the plastics used to encapsulate many types of electronic packages, from capacitors and transistors to central processing units (CPUs) and memory devices.
10/01/2003 To understand the impact of package stress, what key parameter of an operational amplifier (op-amp) the stress affects most must be considered. A general-purpose op-amp specifies an input offset voltage (VIO). This parameter is the DC voltage that must be applied to the input terminals to cancel the DC offset within the op-amp to force the quiescent DC output voltage to a specified level (Figure 1).
10/01/2003 Tangible progress is being made in the wafer fabrication world and beyond based on new micro-production and replication technology, which presents nickel as a low-cost alternative to silicon for a growing number of next-generation production processes, concepts and applications.
10/01/2003 Chip scale packaging (CSP) has been driven primarily by the small form factors required for portable electronics and other high-density semiconductor applications. It has been shown that reliability requirements can be met in spite of the design constraints imposed by these applications. Even when the form factor dictates a stacked approach, ultra-thin CSPs can be stacked and still meet — and exceed — the physical and reliability requirements.
10/01/2003 Though markets tend to go in and out of fashion, it's important for those covering the industry to keep in touch. The optoelectronics market, for instance, has always been a bit elusive, just tantalizing us with possibilities.
10/01/2003 The quarterly updates from the major sub-contractors had more positive than negative news for the first time in many quarters. Most of the major firms saw at least 10 percent revenue growth in the second quarter of 2003 compared to the first quarter, and most of them showed improvements in the profit/loss column as well.
10/01/2003 The trend toward lead-free production of electronic components is accelerating rapidly in the U.S. In Asia and Europe, legislation has already been passed that introduces time lines for a ban on the future use of lead-based components in new equipment.
10/01/2003 In most semiconductor technologies, the silicon is outpacing available packages' ability to provide the full advantages. Power ICs are no exception and, in fact, are behind silicon capabilities. A new packaging technique promises to change this situation.
09/30/2003 Fujitsu Ltd. and wholly owned subsidiary Fujitsu Laboratories Ltd. have developed an 80-channel optical switch based on MEMS mirrors, according to a news release.
09/30/2003 The titans of corporate America and academia embraced nanotechnology at one of the premier R&D conferences recently, even as they cautioned that true nanoscale devices and widespread adoption are still years away. The first real market applications still are expected to be coatings and nanomaterials. Until scientists can perfect nanomanufacturing – true nanoscale devices and products are still further in the future.
09/29/2003 SEPT. 29--SAN JOSE, Calif.--The Semiconductor Industry Association (SIA) says that sales of semiconductor chips reached $13.4 billion in August, up from $12.9 billion the previous month, making it the sixth consecutive monthly increase.
09/29/2003 Mitsui & Co. Ltd. plans to invest $35.7 million during the next five years for nanotech-related research and development for life sciences and environmental uses, according to Asia Pulse.
