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Tire sensor makers gauging pressures of court decision

08/20/2003  This month's appeals court decision scuttling a U.S. rule on tire monitors leaves sensor makers in an awkward position. They know they will be dealing with a regulated market, but they don't know what the rules will be. Analysts say sensor and component suppliers are left wondering whether they'll soon face more demand, or a market similar to the one they had anticipated. So they must plan for the different scenarios.

Report: MEMS sector still solid

08/20/2003  Aug. 20, 2003 – Last year was one of the toughest to date for the MEMS industry, with revenues inching up only slightly and many companies going out of business, according to a new report.

Nanosys, SAIC link for defense research

08/20/2003  Nanosys Inc., a Palo Alto, Calif., developer of nanotechnology-enabled systems, has signed a master marketing and business development agreement with Science Applications International Corp. (SAIC) of San Diego, the company announced today.

Phoseon launches MEMS inspection system

08/19/2003  Phoseon Technology Inc. has launched an automated optical inspection system for advanced packaging applications in MEMS, according to a news release.

What's wrong with the grid? It's dumb; sensors might make it smarter

08/19/2003  Even as the energy industry struggles to understand why last week's blackout occurred, experts are examining ways in which small tech could help prevent it from happening again. And they're finding at least one new way to make the grid run more efficiently: microsensors. Not only more efficiently, but "smarter." The MEMS-based systems can do that by circulating up-to-date information about whatÂ’s going on within the power systems.

NARM names new leader

08/18/2003  August 18, 2003 - The National Association of Relay Manufacturers (NARM) has named former Tyco Electronics business director Jeffrey Boyce as its interim executive director, after the passing of longtime executive director Don Dangott. NARM, an affiliate of the Electronic Components, Assemblies & Materials Association (ECA), hosts the annual International Relay Conference.

FASL, GES source Japan fab equipment

08/18/2003  August 18, 2003 - FASL Japan Ltd., the Japanese arm of a joint venture between AMD and Fujitsu, and GE Global Electronic Solutions have completed a $100 million sale and leaseback of equipment, including machines for lithography, metrology, deposition and tech, and furnace equipment.

ASAT opens China facility

08/18/2003  August 18, 2003 - Semiconductor assembly and test services provider ASAT Holdings has officially opened a new 225,000-square-foot facility in Dongguan, China, 65 miles north of Hong Kong.

Oki to take quake-related charge

08/18/2003  August 14, 2003 - Oki Electric Industry Co. says it will report a $25 million charge related to damage caused by recent earthquakes in northern Japan. The quakes on July 26 forced the company to temporarily suspend operations at its Miyagi Oki 200mm fab.

Intel to invest in Malaysia

08/18/2003  August 14, 2003 - Intel plans to invest approximately $80 million in a new R&D facility in Malaysia, adding to existing manufacturing facilities in Penang, according to a Reuters report.

Sematech: We'll stay in Texas

08/18/2003  August 18, 2003 - Sematech directors have officially voted to keep the consortium's headquarters in Austin, TX. The vote to stay in the Lone Star Sate squashes speculation about a potential move to New York.

Chartered taking second look at 90nm demand

08/18/2003  August 14, 2003 - Chartered Semiconductor, Singapore, says in a new SEC filing that it is reevaluating market demand for 90nm chips, as it considers what to do with its Fab 7 facility scheduled to begin 300mm-wafer production late next year.

China mask firm sets production date

08/18/2003  August 14, 2003 - Allied Integrated Patterning Co. (AIPC) says it will complete equipment move-in and begin mass production of TFT-LCD photo masks by 2Q04. The affiliate of Allied Materials Technology Corp. (AMTC) hopes to generate sales of $130.8 million in sales by 2008, after an initial capital investment of $52.3 million.

Study: Hynix gains in DRAM market

08/18/2003  August 14, 2003 - Despite tariffs levied by the US and European Union, Hynix Semiconductor managed to gain on rivals in the DRAM market, according to a new Gartner Dataquest report. The next several quarters, however, will be more telling of the company's resiliency.

Isonics finds investors

08/18/2003  August 15, 2003 - Isonics Corp., Golden, CO, a developer of isotopically-engineered semiconductor materials, says it has received a commitment for $8 million in equity financing from Quivira Venture Partners, led by a former Isonics director.

500 lose jobs, 3,000 furloughed at IBM

08/18/2003  AUG. 18--ESSEX JUNCTION, Vt. -- Five-hundred people were laid off at IBM Monday and another 3,000 will have to take a week off without pay next month from the state's largest private employer

Sensant gets $500,000 for medical imaging

08/18/2003  Sensant Corp. received a $500,000 federal grant to develop a new generation of MEMS sensors for medical imaging, according to a news release.

Hach Ultra extends service life on particle counters

08/15/2003  AUG. 15--GRANTS PASS, Ore.--Hach Ultra Analytics has introduced Long Life Laser technology for its Met One particle counter products.

Applied takes 3Q loss, orders grow

08/15/2003  August 14, 2003 - Industry bellwether Applied Materials, Santa Clara, CA, says it lost $36.8 million in 3Q03 on $1.09 billion in sales, compared with a $115.2 million profit on revenues of $1.5 billion in 3Q02. The loss was mainly due to a pre-tax realignment charge, without which Applied would have realized a $0.05/share profit during the quarter, beating analysts' estimates.

The incredible shrinking chip

08/14/2003  August 14, 2003 - Researchers at Texas Instruments and the University of North Texas in Denton, TX, are working on techniques to enable the building of semiconductor chips half the size of current chips. A total of $2.2 million has been provided to the research team through a National Science Foundation grant and contributed services from TI and the university.