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North American semiconductor equipment industry posts June 2016 book-to-bill ratio of 1.00

07/22/2016  Billings activity for equipment companies based in North America are at their highest level since February 2011.

2016 IEEE IEDM to showcase the latest tech developments in micro/nanoelectronics

07/21/2016  Paper-submission deadline is August 10 this year; Supplier exhibition to be held in conjunction with technical program.

Automotive MEMS sensor unit-shipments rose in 2015, even as revenue stalled

07/21/2016  Although shipments of microelectromechanical systems (MEMS) sensors used in automotive applications grew 8.4 percent in 2015, revenues were flat compared to the previous year, reaching $2.7 billion.

International Technology Roadmap for Semiconductors examines next 15 years of chip innovation

07/21/2016  Final installment of biannual report outlines short-term and long-term challenges and opportunities facing semiconductor technology.

Integration of novel materials with silicon chips makes new 'smart' devices possible

07/21/2016  Researchers from North Carolina State University and the U.S. Army Research Office have developed a way to integrate novel functional materials onto a computer chip, allowing the creation of new smart devices and systems.

Solid State Technology Contributing Editor receives "Lifetime Achievement Award" for "Excellence in 3D Packaging Technologies"

07/21/2016  Contributing editor and blogger Phil Garrou received the 3D InCites "Device of the Year" award during the 2016 SEMICON West conference for "Excellence in 3D Packaging Technologies."

Amkor Technology receives "Device of the Year" for SWIFT semiconductor package

07/20/2016  Amkor Technology, Inc. recently received the 3D InCites "Device of the Year" award during SEMICON West for its' SWIFT semiconductor package.

Quantum drag

07/20/2016  University of Iowa physicist says current in one iron magnetic sheet can create quantized spin waves in another, separate sheet.

Research team led by NUS scientists develop plastic flexible magnetic memory device

07/20/2016  Novel technique to implant high-performance magnetic memory chip on a flexible plastic surface without compromising performance.

STMicroelectronics unveils world's smallest single-chip motor driver

07/19/2016  With the combination of low power consumption and small form factor, the ST's new motor driver plans to contribute to the battery powered IoT device adoption.

GaN substrate market is estimated to be worth over $4B by 2020

07/19/2016  The gallium nitride (GaN) substrates market is set to cross $4 billion USD by 2020, according to the market research report from IndustryARC.

Unisem ships 1 billion packaged MEMS devices

07/19/2016  Unisem reported it recently shipped its one billionth packaged MEMS device and continues to invest capex in both MEMS assembly equipment and the development of additional factory floor space for this expanding market.

Scientists glimpse inner workings of atomically thin transistors

07/19/2016  With an eye to the next generation of tech gadgetry, a team of physicists at The University of Texas at Austin has had the first-ever glimpse into what happens inside an atomically thin semiconductor device.

Silicon Valley-based foundry Noel Technologies marks 20th Anniversary

07/18/2016  Silicon Valley specialty semiconductor foundry Noel Technologies, a provider of process development and substrate fabrication for a variety of high-technology industries, celebrates its 20th anniversary this month.

Light-trapping 3D solar cells undergo space testing

07/18/2016  A novel three-dimensional solar cell design developed at Georgia Tech will soon get its first testing in space aboard the International Space Station.

Graphene photodetectors: Thinking outside the 2-D box

07/18/2016  The efficient detection of low-energy photons constitutes one of the main challenges faced by future optoelectronics. Finding new ways of sensing and harvesting these photons is crucial for the development of technologies such as silicon photonics, pollution sensing and next-generation solar.

KLA-Tencor Evolves Inspection and Review Portfolio for 3D Future

07/10/2014  Systems detect and categorize defects that limit yield in advanced IC manufacturing.

How to Drive and Motivate Modern-Day Innovation

07/10/2014  Technology innovation isnÂ’t slowing down. But its steady acceleration isnÂ’t happening spontaneously, and TuesdayÂ’s Silicon Innovation Forum keynote from Professor of Innovation Dr. Bob Metcalfe outline how he believes to effectively drive the complex cycle that is modern-day innovation.

Vacuum Technologies Needed for 3D Device Processing

07/10/2014  Complex effluent management of ALD and CVD processes using novel precursors

Development of Silicon Photonics Devices Discussed in Forum

07/09/2014  Six speakers discussed developments in designing and manufacturing silicon photonics devices in a TechXPOT North session on Wednesday morning.