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Environmental Tectonics' Sterilization Systems Group announces new contracts

09/13/2007  September 12, 2007 -- /PRNewswire/ -- SOUTHAMPTON, PA -- Environmental Tectonics Corporation's Sterilization Systems Group (SSG) announced today the award of several new contracts spanning all markets and offerings.

Free white paper addresses sterility testing for pharmaceutical manufacturers

09/13/2007  September 12, 2007 -- AGAWAM, MA -- A free white paper detailing sterility testing essentials for pharmaceutical manufacturers is now available for free download at http://www.microtestlabs.com/sterilitypaper/pharma-paper.htm.

Christ takes over controlling interest in the Zeta Group

09/13/2007  September 12, 2007 -- MONDSEE, AUSTRIA -- Christ Water Technology Group takes over 76 percent of the stock of the Zeta Group, located in Tobelbad, near Graz (Austria) and thus expands its activities in the pharmaceutical and life-science sector even further.

IBM enables single chip cell phones sans GaAs

09/13/2007  As cell phone demand surges in emerging markets, IBM says it's seizing the last significant opportunity to reduce cell phones' cost and size by developing a low cost, integrated solution with multiple RF/analog functions on a single chip. IBM technologists explain to SST how this is being accomplished by replacing GaAs with SOI.

Registration open for IEST Fall Conference

09/13/2007  September 7, 2007 -- ARLINGTON HEIGHTS, IL -- Registration is now open for the Institute of Environmental Sciences and Technology (IEST) Fall Conference, November 11-14, 2007.

TXP Deploys PoP Assembly

09/13/2007  Pre-manufacturing service provider TXP has developed a package-on-package (PoP) assembly process that it asserts will reduce manufacturing time and associated costs. The company will deploy PoP technologies for several of its global customers.

Nano-enabled CAP-XX supercapacitors feature high-temp operation, storage

09/13/2007  CAP-XX Limited, producer of supercapacitors that boost power delivery in mobile devices, has expanded its product line with high-temperature models. The HS and HW supercapacitors benefit from nanotechnology construction.

USPTO issues patent for nanotube-based transparent electrodes; Unidym licenses from Clemson

09/13/2007  Unidym, Inc., a majority-owned subsidiary of Arrowhead Research Corp., announced that U.S. Patent No. 7,265,174 has been issued by the U.S. Patent and Trademark Office. With respect to transparent conductive films, Clemson University has exclusively licensed this patent to Unidym.

ESI Ships Dual-beam Laser to Korea Memory Manufacturer

09/13/2007  Electro Scientific Industries Inc. (ESI) received an initial order from a Korea-based memory manufacturer for its Model 9850 dual-beam infrared (IR) laser link-processing system. The customer will implement yield and throughput improvements to its advanced memory device manufacturing processes with the 9850.

SPICE sim startup nabs $7.2M in funds

09/12/2007  September 12, 2007 - Nascentric Inc., a provider of Fast-SPICE simulation and analysis tools, says it has closed a $7.2 million Series C round of financing, with new investor Intel Capital and existing investors Austin Ventures, Silverton Partners, Needham Capital and EDA veteran Jim Solomon (founder of SDA, which later became Cadence Design Systems).

Dongbu HiTek readying 110nm CMOS image sensor work

09/12/2007  September 12, 2007 - Korean foundry Dongbu HiTek says it has made available a new internally developed design library to support manufacturing of CMOS image sensors using 110nm process technologies.

IBM uncrates single-chip technology for mobile devices

09/12/2007  September 12, 2007 - IBM says it has developed a new semiconductor technology that enables single-chip radio frequency (RF), integrating RF/analog functions including multimode/multiband RF switches, complex switch biasing networks, and power controllers.

ASML: i-Line customer topping 150WPH for 24hrs

09/12/2007  September 12, 2007 - ASML says a Taiwanese customer achieved a record throughput using the company's TwinScan XT:400F i-Line scanners -- 150 wafers/hr for 24 hrs, producing nearly 3600 wafers in a single day earlier this spring.

Horiba's new EDXRF microscope promises fast, easy nondestructive analysis

09/12/2007  Horiba Jobin Yvon's XGT-7000 energy dispersive x-ray fluorescence (EDXRF) microscope promises fast, high-sensitivity qualitative and quantitative elemental analysis and imaging, transmission x-ray imaging, and dual vacuum modes.

Holographix expands micro/nano replication capacity

09/12/2007  Holographix LLC has opened twho new laboratories and thereby has expanded its micro- and nano-replication production capacity by 50%. The company produces cost-effective tools for use in imprint lithography and other micro- and nano-molding processes.

SEMICON Taiwan Kicks Off

09/12/2007  SEMICON Taiwan, September 12–14 at the Taipei World Trade Center, Taiwan, begins today with more than 700 Taiwan-based and international companies exhibiting. Following are the show highlights from DEK, Palomar Technologies, and Rudolph Technologies.

Samsung tips 60nm 2Gb DRAMs

09/12/2007  September 12, 2007 - Samsung has developed what it says is the industry's first "60nm-class" 2Gb DDR2 DRAM devices, with multiple strategic aims to help stabilize DRAM prices, and solidify its foothold in a sector that will account for nearly half of all DRAM sales in five years.

Emerging MEMS manufacturers look beyond auto apps

09/12/2007  September 12, 2007 - MEMS revenue will double from $5B in 2005 to $10B in 2011, with a "select group of large, well-established MEMS suppliers" benefiting from growth in the automotive sector, and "new, emerging entrants" to the MEMS market capitalizing on opportunities in consumer, communications, and portable end-product sectors, according to Semiconductor Partners.

TI tightens 3Q sales, but no up/down surprise

09/12/2007  September 12, 2007 - Texas Instruments has narrowed its projected 3Q07 sales to a range of $3.56-$3.72 billion, vs. initial projections of $3.49-$3.79B. Semiconductor revenue outlook has been similarly narrowed around the midpoint of guidance to $3.36-$3.50B, vs. $3.29-$3.57B.

Gartner: Outsourcing Hits Packaging Sector

09/12/2007  Global PAT revenues are expected to grow at half the rate in 2007 that they did in 2006, and will improve marginally in 2008, according to new data from Gartner Dataquest. A closer look inside the numbers reveals the emergence of outsourced SATS providers, poised to balloon by nearly a third over the next three years and reach equal footing with IDMs.