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NA semi equipment industry posts April 05 b-to-b of 0.8

05/20/2005  May 20, 2005 - North American-based manufacturers of semiconductor equipment posted $1 billion in orders in April 2005 (three-month average basis) and a book-to-bill ratio of 0.80, according to SEMI. A book-to-bill of 0.80 means that $80 worth of orders were received for every $100 of product billed for the month.

Wilson Greatbatch Technologies, Inc. opens manufacturing facility in Mexico

05/19/2005  CLARENCE, N.Y.--(BUSINESS WIRE)--May 19, 2005--Wilson Greatbatch Technologies, Inc. ("The Company"), announced today the grand opening of its world-class manufacturing facility in Tijuana, Mexico.

Unotron introduces SpillSeal washable computer keyboards

05/19/2005  WESTWOOD, N.J.--(BUSINESS WIRE)--May 19, 2005-- Recognizing that harmful bacteria can survive as long as 24 hours on computer keyboards and that the average office desktop has 400 times more bacteria than a toilet seat, Unotron announced today the availability of SpillSeal computer keyboards.

IMI secures $1 million order from semiconductor device maker

05/19/2005  SUNNYVALE, Calif.--(BUSINESS WIRE)--May 18, 2005--Integrated Materials, Inc., a leading supplier of advanced boats and related consumables for diffusion and deposition furnaces used to manufacture semiconductors, announced that the company has received a multiple unit order with a value of almost $1 million for its high-temperature, poly silicon, 300mm boats from a leading semiconductor device maker.

President's advisers recommend NNI branch out

05/19/2005  An advisory panel to President George W. Bush praised the U.S. National Nanotechnology Initiative for its management of programs and finances in an assessment released on Wednesday. But it cautioned that increasing investments by other countries were eroding the United States' position as a nanotechnology leader, and it encouraged the multi-agency NNI to broaden its impact by building bridges with more government bodies, economic development groups and industry.

Winbond awards contract to ASML

05/18/2005  May 18, 2005 - ASML Holding NV (ASML) today announced it was awarded a customer contract from Winbond Electronics Corp. to equip its 300mm fab in Taiwan. No financial details are being disclosed. ASML will install systems from its TWINSCAN platform starting next month.

Akrion will ship multiple systems to major MEMS supplier

05/18/2005  May 18, 2005 - Akrion Inc. today announced the receipt of several orders from a long-time customer, one of the world's largest suppliers of MEMS. The order, valued at more than $2.5 million, includes 2 V3 batch-immersion systems and an upgrade to an existing GAMA Series wet cleaning system.

STG and SEMI partner to offer online education for standards

05/18/2005  May 18, 2005 -The Standards Technology Group Inc. (STG) and SEMI today announced a partnership to provide SEMI standards training and online courses to the semiconductor industry. Under the terms of the agreement, SEMI standards courses will be designed and presented by STG and marketed by SEMI. Seminars are now available for GEM300 and EDA standards.

Tessera, North to Grow Package Technology Alliance

05/18/2005  (May 18, 2005) San Jose, Calif. — Tessera Technologies is planning to grow its business and technology relationship with Japan-based North Corp., a circuit-board manufacturing technologies developer and licenser. Both companies have agreed to expand their relationship to jointly develop and license technologies for package substrates.

Gold-bumping Capacity Demand Stems from FPD Production Boost

05/18/2005  (May 18, 2005) San Jose, Calif. — Rising flat-panel display (FPD) production is boosting capacity expansion for gold-bump lithography processing used in advanced packaging in Asia, according to Ultratech Inc., having received multiple-system orders from several customers in Taiwan and China for advanced packaging lithography systems.