Issue



Table of Contents

Solid State Technology

Year 2001
Issue 4

DEPARTMENTS

Think Tank


Alice Meets the Infamous Mad Hatter

At his tea party, the Mad Hatter said, "I have noticed something about my age. If you add the square of its second digit to twice the square of its first digit, you get the same number as my age."


Notes From The Floor


Entering the photonics world of packaging

If you're like many engineers, you may have recently developed a curious interest in the photonics industry. This interest was likely piqued by the packaging technology employed for photonics or by the way packaging applies to optoelectronic components and modules


New Products


New products

A new line of thermoelectric/solid state air conditioners provides a broad range of thermoelectric cooling and heating protection in laser-based systems, scientific instruments and computer control packages for industrial and military applications


News


Movers and shakers

ASAT Inc. (Fremont, Calif.), has received the second annual Bob Graham Award presented by Semiconductor Equipment and Materials International (SEMI)


News


WEB WATCH

Lytron Inc. has announced an updated version of its Thermal Reference Guide at www.lytron.com. The online guide provides specifications, performance data and selection guidelines for the company's full line of thermal management products


Automotive Perspective


New age manufacturing systems

Now we are entering a 'New Age' of manufacturing systems, which places emphasis on the elimination of waste and the reduction of inefficiencies...


Editorial


The glitch we can't stop talking about

Mention the word "dot-com" lately and undoubtedly your co-workers will give you a mixed bag of comments, from the "I told you so" naysayers to the "You haven't seen nothin' yet" optimists


News


In the news

Unitive announces venture in Taiwan


FEATURES

Step By Step


The back-end process: Step 4 - Wire bonding step by step

In the semiconductor and overall electronics industry, the move continues unabated toward further miniaturizing of packages, components and modules while also increasing their functionality


Bluetooth Designs.html


Bluetooth designs

How low-temperature co-fired ceramic substrate can maximize performance


Bumping Technology.html


Bumping technology

Addressing industrial issues is key


Lead Free Packaging.html


Lead-free packaging

Investigating pure tin as an alternative finish


Environmentally Consciou


Environmentally conscious electronics

A trend driven by global regulations and aggressive marketing strategies