Issue

Three engineers, Alfred, Benjamin and Charles, and their wives, Althea, Bernice and Cora (not necessarily in that order), went shopping together while on holiday

Factory automation continues to be a much-debated subject in assembly factories. While advertising campaigns and marketing efforts would have us believe that full automation is a necessity or that only the very best will produce the very best

Stacked BGA package for wireless communications introduced

PT Series relays have low profiles and offer 2-, 3- or 4-pole double throw contacts for switching currents up to 12, 10 or 6 amps, respectively

There are a few things I can count on hearing when I talk it up with folks in the industry. Among the general niceties people bestow upon us, there is always a mix of good questions, such as "When are you going to cover such-and-such topic?" and "Does this product really work?"

The term reuse is commonly defined as using something again after some special treatment or processing. Today, it has become socially acceptable to reuse many of the things we have created and mass-produced

In the past, most integrated circuit (IC) packages used wirebonding as the interconnect technology between chip and leadframe

Build-up substrates and next-generation design tools Contribute to the miniaturization of electronics

CPU package design must start by addressing form factor. Whether for a high-performance desktop or a high-end workstation/ server, high-speed microprocessor packaging must be designed with the smallest form factor in mind

Typical flex-based packages can be made of pliable base materials, like polyimide or Mylar, onto which conductive metals are deposited and patterned

The decision to use flip chip packaging is not a simple one. Many equipment, product, and process variables affect the relative merits of flip chip vs. wire bonded packages

Until recently, controlled collapse chip connection bump technology, developed in the late 1960s, provided a reliable interconnect for high-performance, leading-edge microprocessors

Despite the many advances in assembly manufacturing since the IC was invented, the basic process has not changed significantly