Issue

As a leadframe finish material, palladium has many advantages over tin-lead (SnPb) solder; it is more environmentally friendly and the package assembly process with palladium-plated leadframes is more efficient

The expansive growth rate of flip-chip in packaging (FCIP) continues to task flip chip attach (FCA) equipment suppliers with new challenges

New power and protection devices in wafer-level packaging (WLP) are aiding in the overall reduction of size and weight of portable equipment products

Micro-valve dispensing can minimize setup between PCB runs and reduce material costs

Tom, the older brother, made a rectangular box in which to pack his father's birthday present. The box was one foot in height, with a base diagonal of 37 inches

Exatron Inc., San Jose, Calif., has announced the appointments of Bo Mendoza to customer relations manager, Bob Garcia to particle interconnect product manager, and Denise Smith as particle interconnect coordinator

Scapa Tapes has recently redesigned its Web site, www.scapatapesna.com, with improved features and expanded information

Technology licensing is prolific in many industries, including the pharmaceutical and biotechnology arenas, and is used heavily for consumer products

The worldwide semiconductor market closed 2000 by marking a 31-percent increase over 1999 revenues to reach figures of $222.1 billion, according to preliminary results from a Dataquest Inc.

Advanced Semiconductor Engineering Inc. (ASE) has opened its Chungli Intelligent Industrial Park, which combines the services of a group of ASE companies

Lively discussions charge lead-free solder implementation summit

EtroniX is a multi-disciplinary event that will feature automated design tools, components, test, production, packaging and more

Excitement abounds here at Advanced Packaging magazine whenever we work on something new. While each and every month we deliver a new magazine to your desk, lately we have also been working on some other projects related to the magazine

Benchtop Lead Attach Machine
Die-Tech's Model 3005 attaches single in-line placement leadframes to substrates and is an alternative to hand-tooling