DEPARTMENTS
Think Tank Think Tank
The Math and Logic Teasers Association (MALTA) was inaugurated a few years ago. At the end of the first year, its membership dropped by 10 percent
News Final packaging equipment figures for 2001
The semiconductor packaging equipment market dropped by 56 percent in 2001, according a report from Gartner Dataquest, making it the worst annual contraction in the industry's history. The revenue in 2001 was $2.98 billion
News New system for testing chips after dicing and thinning
Electroglas Inc. has developed test/handling equipment that allows for fully automated testing of ultra-thin chips, including the ability to test integrated circuits (ICs) after dicing or in wafer format
News Special needs of large flip chip being addressed
ASE Test Limited and MTBSolutions (MTBS) announced that they are jointly developing packaging technology for large flip chip devices
News Amkor continues expansion in Japan with Fujitsu deal
Amkor Technology announced a preliminary agreement to create a joint venture with Fujitsu
News Movers and shakers
Unitive Inc. (Research Triangle Park, N.C.) appointed Arthur Bergens, Jr., as vice president and chief financial officer. He will be responsible for leading the company's financial strategy and growth
New Products New Products
The DS-107 aligner bonder is an ultra-high precision assembly platform designed to align, place, and attach bare die, components and packages
News IPC forms photonics group
The IPC announced the formation of the Photonics Manufacturers Association (PMA) Council, whose function will be to "organize and coordinate roadmapping, standardization, legislative, market research and education efforts" in the photonics industry
News New materials highlighted at SEMI-THERM
Many new materials and technologies for addressing thermal management challenges were presented at IEEE's 18th annual Semiconductor Thermal Measurement and Management Symposium and Exhibition
Editorial Less than zero
Packaging almost seems like the kind of enterprise that has to have a finite future. Think about it - our task is to package chips while adding as little as possible to the size, cost and parasitics that detract from performance
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