Issue

Table of Contents Solid State Technology Year 2004 Issue 7	DEPARTMENTS Editorial Board Equipment for Advanced Packaging As an enabling technology, automated microelectronic and photonic manufacturing equipment is the engine that propels today's product concepts from the laboratory into large-scale commercial, military and industrial prominence. Packaging Trends Evolution of Wafer-level Packaging Sandia National Laboratories and Fujitsu conceived the wafer-level package (WLP) in the mid 1990s. New Products Semicon West Products Industry Voices SATS Outsourcing Growth Is Blossoming Last week, the Microelectronic Packaging and Test Engineering Council (MEPTEC) held what it hopes to be the first of many semiconductor assembly and test services (SATS) investor conferences. Editorial Who Will Regulate Lead-free Compliance? We all know that you can do well by doing good, right? When it comes to lead-free, many advanced packaging OEMs have already made an announcement of compliance. News In the News

FEATURES Design For Reliability O Design for Reliability of Stacked Die CSPs FATIGUE MODELING Cleanliness Is Critical Cleanliness is Critical for Wafer Bump Stencil Printing SOLDER PASTE DEPOSIT REMOVAL Overmolded Electronic As Overmolded Electronic Assembly Packaging OVERMOLDING PROVIDES COST, RELIABILITY AND MANUFACTURING IMPROVEMENTS The Back End Process Controlling the Bond Process Wirebonding Designing With Ltcc.html Designing with LTCC MATERIALS AND TOOLS Advanced Wafer Level Cle Advanced Wafer-level Cleaning Method DEVELOPMENT OF ADVANCED STRIPPING CHEMISTRIES Cover Story Packaging Alternatives NEW PACKAGING CONCEPT PROVIDES RELIABILITY

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