Issue

Advanced packaging processes use physical vapor deposition (PVD) for gold bumping, solder bumping, redistribution (RDL), and integrated passive components.

Tin-lead solder was pressed into service as means of making reliable permanent interconnections between electronic elements in the early years of the electronics industry.

The Japanese market, with its focus on consumer electronics and telecommunications, has embraced chip/package co-design and optimization for wire-bonded and system-in-package (SiP) devices.

Integral to the packaging process for over three decades, epoxy molding compounds have undergone significant advancements due to revolutions in semiconductor package geometries, and legislative requirements surrounding lead-free and “green” material adoption.

In the semiconductor industry challenges appear to be directly related to Moore’s Law. In reality the culprit is consumer demand for more functionality, faster speeds, and smaller features. Technically, the integrated circuit (IC) industry is progressing at a rate that’s unmatched by any other industry. Yet, moving forward, it faces technical hurdles that slow progress, and must create advanced solutions without increasing costs.

Die and wire bonding are among the most important IC connection technologies in electronic production.

Light-emitting diode (LED)-based applications are growing, and cover a broad range of markets including automotive lighting applications such as indicators, spot utility, and headlamps; camera functions like display backlights and camera flashes; consumer products such as LCD display backlight and projection systems; architectural uses like accent lighting for buildings, and signs; and many others. LEDs are bright, efficient, and quick to react.