Applications

APPLICATIONS ARTICLES



Side-impact regulations could drive more demand for MEMS sensors

02/09/2005  The airbag accelerometer is generally regarded as one of the best examples of a MEMS sensor giving automakers a simultaneous price and performance advantage. The same may one day be said of MEMS-based tire pressure monitors, now being integrated in mainstream models in response to safety legislation. Now there’s another area where MEMS is poised to make inroads in automotive – side-impact crash protection.

MEMS industry group receives funding from DARPA

01/20/2005  January 20, 2005 - The MEMS Industry Group (MIG) announced that it has received funding from the Defense Advanced Research Projects Agency (DARPA) to continue its MEMS Cost Assessment Tool (MEMS CAT) project, and has chosen ISMI to modify its software for MIG.

MEMS Industry Group Continues Phase II of MEMS CAT Project

01/19/2005  (January 19, 2005) Pittsburgh, Pa. — The MEMS Industry Group (MIG) announces that it has received funding from the Defense Advanced Research Projects Agency (DARPA) to continue its MEMS Cost Assessment Tool (MEMS CAT) project.

Japan's Oki set to enter MEMS sensor market

10/18/2004  After several years of helping others bring MEMS to market, a Tokyo-based fab facility is launching its own line. Oki Electric Industry Co. Ltd. has developed a tri-axis accelerometer module designed for mobile phones as well as other products. Oki expects to send sample shipments in October to Japanese and North American customers, and ramp up to high volume by April.

Radant takes lead in race to bring MEMS RF to market

09/20/2004  With only 25 employees and barely two years old, Radant Technologies has taken the lead in a race to bring MEMS-based radio frequency switches to market. It squeezed out defense-contracting giants Northrop Grumman and TRW Corp. along the way, and now has a $5-million government grant.

MEMS may make smart homes more affordable

09/17/2004  Smart homes, those high-tech houses where the lights, sprinkler systems, appliances and heating and cooling systems all communicate through Web-based wireless networks, still appear to be only for the very wealthy. Thanks to MEMS, the basic building blocks are actually there for bringing intelligent homes to the masses.

COMS 2004 kicks off with upbeat look at state of industry

09/02/2004  With more than 320 delegates registered at the annual Commercialization of Micro and Nano Systems (COMS) Conference, held this year in the Canadian city of Edmonton, Alberta, those in attendance were told that small-tech gold isn’t totally out of reach.

MEMS update: 2004 likely to be banner year

07/16/2004  The first half of 2004 is looking a lot like the last half of 2003 for the MEMS industry, only better. If trends continue, 2004 will be a banner year, or in the very least, an interesting successor to 2003. Year-to-year revenues were up 35.7 percent in 2003 from 2002, with much of that occurring in the last half of 2003.

Is telecom ready to embrace MEMS-based solutions?

07/02/2004  Three years ago, optical networking was a highly anticipated end use for optical MEMS. Just as the buzz reached a fever pitch, the market collapsed and all opportunity evaporated. Now that the market appears to be coming back to life, a critical question must be asked: Is telecom finally ready to embrace MEMS-based solutions? And if so, then is this market still worth pursuing?




WEBCASTS



Environment, Safety & Health

Date and time TBD

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

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Wafer Processing

Date and time TBD

As the industry moves to 10nm and 7nm nodes, advances in wafer processing – etch, deposition, planarization, implant, cleaning, annealing, epitaxy among others – will be required. Manufacturers are looking for new solutions for sustained strain engineering, FinFETs, FDSOI and multi-gate technologies, 3D NAND, and high mobility transistors.

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